US 6,981,380 B2
Thermoelectric cooling for microelectronic packages and dice
Gregory M. Chrysler, Chandler, Ariz. (US); Paul A. Koning, Chandler, Ariz. (US); Saikumar Jayaraman, Chandler, Ariz. (US); and Makarem A. Hussein, Beaverton, Oreg. (US)
Assigned to Intel Corporation, Santa Clara, Calif. (US)
Filed on Dec. 20, 2002, as Appl. No. 10/326,864.
Prior Publication US 2004/0118129 A1, Jun. 24, 2004
Int. Cl. F35B 21/02 (2006.01)
U.S. Cl. 62—3.2 19 Claims
OG exemplary drawing
 
1. A method, comprising:
thermally coupling a second TEC substrate of two or more thermoelectric cooling devices with a microelectronic die;
electrically connecting the two or more thermoelectric cooling devices in series; and
thermally coupling a first TEC substrate of the two or more thermoelectric cooling devices with an inner surface of an integrated heat spreader.