US 6,981,312 B2 | ||
System for handling microelectronic dies having a non-piercing die ejector | ||
Frederick F. Rezaei, Phoenix, Ariz. (US) | ||
Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
Filed on Mar. 31, 2003, as Appl. No. 10/404,980. | ||
Prior Publication US 2004/0187298 A1, Sep. 30, 2004 | ||
Int. Cl. B23P 19/00 (2006.01) |
U.S. Cl. 29—740 | 26 Claims |
1. A system for handling microelectronic dies, comprising:
a frame;
a wafer support mounted to the frame to support a diced wafer comprising singulated microelectronic dies;
an ejector head having a passageway therethrough and being connected to the frame for movement to move an outlet of the passageway
into respective positions below respective selected microelectronic dies;
a fluid pump having high and low pressure sides, the high pressure side being connected to the passageway to provide a fluid
through the passageway, the fluid flowing from the outlet towards the selected microelectronic dies; and
a pick head connected to the frame for movement into respective positions above the wafer to engage with and remove the selected
microelectronic dies below which the outlet is located.
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