US 6,982,877 B2 | ||
Heat sink having compliant interface to span multiple components | ||
Wade D. Vinson, Magnolia, Tex. (US); and John P. Franz, Houston, Tex. (US) | ||
Assigned to Hewlett-Packard Development Company, L.P., Houston, Tex. (US) | ||
Filed on Feb. 20, 2004, as Appl. No. 10/783,833. | ||
Prior Publication US 2005/0185379 A1, Aug. 25, 2005 | ||
Int. Cl. H05K 7/20 (2006.01) |
U.S. Cl. 361—719 | 21 Claims |
1. A system, comprising:
a computer device;
a heat sink coupled to the computer device over a plurality of components disposed on the computer device, wherein the heat
sink comprises a component interface having varying heights at least substantially corresponding to heights of the plurality
of components;
a compliant non-paste material flexibly engaging the component interface of the heat sink against the plurality of components;
a fastener configured to compress the compliant non-paste material between the heat sink and the plurality of components.
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