US 6,982,380 B2
Encapsulated component which is small in terms of height and method for producing the same
Christian Hoffmann, Deutschlandsberg (Austria); Jürgen Portmann, München (Germany); and Hans Krueger, München (Germany)
Assigned to Epcos AG, Munich (Germany)
Appl. No. 10/500,371
PCT Filed Dec. 11, 2002, PCT No. PCT/DE02/04535
§ 371(c)(1), (2), (4) Date Oct. 08, 2004,
PCT Pub. No. WO03/058810, PCT Pub. Date Jul. 17, 2003.
Claims priority of application No. 101 64 494 (DE), filed on Dec. 28, 2001.
Prior Publication US 2005/0034888 A1, Feb. 17, 2005
Int. Cl. H01L 23/28 (2006.01); H05K 5/06 (2006.01)
U.S. Cl. 174—52.2 29 Claims
OG exemplary drawing
 
1. A component comprising a chip having component structures, said chip comprising, on one surface, solderable metallizations connected with the component structures, a carrier substrate having, on a lower surface, contacts for electrically conductive connection with the component structures of the chip, conductor traces extending from the contact to connection areas, wherein the connection areas are respectively at least partially uncovered on a floor of recesses in the carrier substrate, said chip being mounted in a flip-chip arrangement by means of bump connections arranged in the recesses, said bump connections electrically-conductively connecting the solderable metallizations of the chip to the connection areas of the carrier substrate, so that the chip at least partially rests on the carrier substrate, the chip, on a back side, having a lacquer layer selectively removed to generate an inscription for the chip.