US 6,981,880 B1 | ||
Non-oriented wire in elastomer electrical contact | ||
William L. Brodsky, Binghamton, N.Y. (US); William E. Buchler, Jr., Owego, N.Y. (US); Benson Chan, Vestal, N.Y. (US); and Michael A. Gaynes, Vestal, N.Y. (US) | ||
Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
Filed on Jun. 22, 2004, as Appl. No. 10/873,037. | ||
Int. Cl. H01R 9/09 (2006.01) |
U.S. Cl. 439—66 | 5 Claims |
1. An electronic module to substrate interconnecting structure, comprising:
at least one layer of insulating material having opposing surfaces and an array of apertures formed therethrough to each of
said opposing surfaces;
a plurality of wound wadded wire connectors formed to provide deformable resilient electrical conductors with individual ones
of said conductors disposed within respective ones of said apertures of said array of apertures of said at least one layer
of insulating material so that distal portions of said resilient electrical conductors extend beyond said opposing surfaces
of said layer of insulating material with said distal portions including loops and leads; and
elastomeric insulating material disposed around each of said deformable resilient electrical conductors and corresponding
ones of said apertures holding said conductors to encapsulate said electrical conductors, said elastomeric insulating material
forming a thin solft layer over said loops and leads with said layer being sufficiently thin and soft so as to allow said
loops and leads to extend therethrough under compression thereof.
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