US 6,982,181 B2
Manufacturing process for ultra slim electrooptic display device unit
Yamanaka Hideo, Kumamoto (Japan)
Assigned to Sony Corporation, Tokyo (Japan)
Filed on Mar. 24, 2004, as Appl. No. 10/807,958.
Claims priority of application No. 2003-083056 (JP), filed on Mar. 25, 2003; and application No. 2004-024897 (JP), filed on Jan. 30, 2004.
Prior Publication US 2004/0259326 A1, Dec. 23, 2004
Int. Cl. H01L 21/00 (2006.01); H01L 21/30 (2006.01)
U.S. Cl. 438—30 21 Claims
OG exemplary drawing
 
1. A method of manufacturing an ultra-slim electrooptic display comprising:
a process of forming a porous semiconductor layer on a support substrate made of a mono crystalline semiconductor,
a process of forming a mono crystalline semiconductor layer on said support substrate via said porous semiconductor layer,
a process of forming an insulating layer on a surface of said mono crystalline semiconductor layer and subsequently removing the insulating layer in the peripheral circuit region while leaving the insulating layer in the display region in order to form a polycrystalline semiconductor layer in said display region and a mono crystalline semiconductor layer in said peripheral circuit region, respectively by semiconductor epitaxial growth, growth,
a process of forming a display device unit in the polycrystalline semiconductor layer of said display region and a peripheral circuit unit in the mono crystalline semiconductor layer of said peripheral circuit region, respectively,
a process of separating said support substrate from said porous semiconductor layer,
a process of bonding a support on the ultra-slim electrooptic display device substrate after said separation, and
a process of being divided into various ultra-slim electrooptic displays after bonding said support.