US 6,982,484 B2 | ||
Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet | ||
Mikihiro Ogura, Kusatsu (Japan); Syouji Kigoshi, Otsu (Japan); Masami Tokunaga, Otsu (Japan); Yasuaki Tsutsumi, Otsu (Japan); Ryuichi Kamei, Kyoto (Japan); and Ken Shimizu, Kyoto (Japan) | ||
Assigned to Toray Industries, Inc., Tokyo (Japan) | ||
Appl. No. 10/111,302 PCT Filed Aug. 22, 2001, PCT No. PCT/JP01/07183 § 371(c)(1), (2), (4) Date Apr. 23, 2002, PCT Pub. No. WO02/17379, PCT Pub. Date Feb. 28, 2002. |
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Prior Publication US 2003/0031867 A1, Feb. 13, 2003 | ||
Int. Cl. H01L 23/06 (2006.01) |
U.S. Cl. 257—729 | 19 Claims |
1. An adhesive-backed tape for semiconductor devices comprising a laminate of an insulating film layer and at least one adhesive
agent layer,
wherein the insulating film layer has a coefficient of linear expansion in the film transverse direction (TD) at 50–200° C.
of 17–30 ppm/° C. and a tensile modulus of elasticity at room temperature of 6–12 GPa and wherein the adhesive agent layer
contains epoxy resin and at least one type of polyamide resin of an acid value of at least 3.
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