US 6,982,875 B2
Attaching device for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board, a mount board having the board, the semiconductor device, and the heat sink, and an attaching method of the semiconductor device and the heat sink provided on the semiconductor device on the board
Kouichi Shinotou, Kawasaki (Japan)
Assigned to Fujitsu Limited, Kawasaki (Japan)
Filed on Jul. 13, 2004, as Appl. No. 10/889,015.
Application 10/889015 is a division of application No. 10/356744, filed on Feb. 03, 2003, granted, now 6,781,838.
Application 10/356744 is a continuation of application No. PCT/JP00/05224, filed on Aug. 03, 2000.
Prior Publication US 2004/0257771 A1, Dec. 23, 2004
Int. Cl. H05K 7/20 (2006.01)
U.S. Cl. 361—704 5 Claims
OG exemplary drawing
 
1. A mount board having a board, a semiconductor device fixed to the board, and a heat sink provided on the semiconductor device,
wherein the semiconductor device and the heat sink are fixed to the board by an attaching device, the attaching device comprising:
a base part fixed to the board;
a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board; and
a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated, wherein:
the press mechanism has a receiving part provided at the rotation member,
the receiving part is received by a receiving member having a spring configuration and provided at the heat sink detachably, and
the receiving member is bent when the rotation member is rotated.