US 6,982,784 B2
Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
Shin Matsui, Saitama (Japan)
Assigned to Canon Kabushiki Kaisha, Tokyo (Japan)
Filed on Sep. 02, 2004, as Appl. No. 10/931,984.
Application 10/931984 is a division of application No. 09/799060, filed on Mar. 06, 2001, granted, now 6,862,080.
Claims priority of application No. 2000-066378 (JP), filed on Mar. 10, 2000; and application No. 2001-040169 (JP), filed on Feb. 16, 2001.
Prior Publication US 2005/0018169 A1, Jan. 27, 2005
Int. Cl. G03B 27/58 (2006.01); G03B 27/62 (2006.01)
U.S. Cl. 355—72 3 Claims
OG exemplary drawing
 
1. A substrate holding device comprising:
a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
a sensor that identifies an identification sign provided on said plate; and
a controller that selects the plate based on an identification signal from said sensor, wherein said controller selects said plate based on information on a type of the substrate.