US 6,983,438 B1
Design tool for integrated circuit design
Robert Newman, Santa Clara, Calif. (US); Pranabendra Sarma, San Jose, Calif. (US); and Valerie Vivares, Palo Alto, Calif. (US)
Assigned to Advanced Micro Devices, Inc., Sunnyvale, Calif. (US)
Filed on Aug. 23, 2000, as Appl. No. 9/643,847.
Int. Cl. G06F 17/50 (2006.01)
U.S. Cl. 716—8 18 Claims
OG exemplary drawing
 
1. A method for determining whether a square die fits into a particular package comprising the steps of:
receiving input for one or more design parameters for the square die;
calculating characteristics of the die based upon the design parameter; and
comparing the calculated characteristics of the die to characteristics of the package, wherein, the package comprises a ball grid array (BGA) package;
the one or more design parameters include a die pad pitch;
calculating characteristics of the die includes:
calculating a maximum number of die pads allowed based upon the die pad pitch; and
calculating a required package bond finger pitch based upon the die pad pitch; and
comparing the calculated characteristics of the die includes:
comparing the calculated required package bond finger pitch to a minimum predefined package bond finger pitch for the BGA package.