US 6,982,386 B2
Interconnecting substrates for electrical coupling of microelectronic components
Syed Sajid Ahmad, Boise, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on Oct. 07, 2002, as Appl. No. 10/267,080.
Application 10/267080 is a division of application No. 09/644801, filed on Aug. 23, 2000, granted, now 6,483,044.
Prior Publication US 2003/0106709 A1, Jun. 12, 2003
Int. Cl. H05K 1/16 (2006.01); H01L 23/053 (2006.01)
U.S. Cl. 174—260 18 Claims
OG exemplary drawing
 
1. A microelectronic device, comprising:
a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit;
an interconnecting substrate coupled to the microelectronic die, the interconnecting substrate having a first external layer, a second external layer, a first conductive stratum between the first and second external layers, a first dielectric separator layer having a first surface contacting the first conductive stratum, a plurality of contact elements on at least one of the first and second external layers coupled to corresponding bond-pads on the die, a plurality ball-pads on at least one of the first and second external layers, and a plurality of trace lines electrically coupling selected contact elements to corresponding ball-pads, wherein the first conductive stratum has an internal moisture release element, and wherein at least one of the contact elements is coupled to the first conductive stratum; and
a protective casing covering at least a portion of the microelectronic die.