US 6,981,629 B2
Apparatus of clamping semiconductor devices using sliding finger supports
Michael B. Ball, Boise, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on Aug. 11, 2003, as Appl. No. 10/639,121.
Application 09/358248 is a division of application No. 09/244702, filed on Feb. 04, 1999, granted, now 6,299,057, filed on Oct. 09, 2001.
Application 10/639121 is a continuation of application No. 09/840289, filed on Apr. 23, 2001, granted, now 6,637,636, filed on Oct. 28, 2003.
Application 09/840289 is a continuation of application No. 09/358248, filed on Jul. 21, 1999, granted, now 6,227,431, filed on May 08, 2001.
Application 09/244702 is a continuation of application No. 08/709639, filed on Sep. 09, 1996, granted, now 5,890,644, filed on Apr. 06, 1999.
Application 08/709639 is a continuation in part of application No. 08/631143, filed on Jun. 17, 1996, granted, now 5,673,845, filed on Oct. 07, 1997.
Application 08/631143 is a continuation in part of application No. 08/597616, filed on Feb. 06, 1996, granted, now 5,647,528, filed on Jul. 15, 1997.
Application 08/597616 is a continuation in part of application No. 08/592058, filed on Jan. 26, 1996, granted, now 5,954,842, filed on Sep. 21, 1999.
Prior Publication US 2004/0035913 A1, Feb. 26, 2004
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 37/00 (2006.01); B23K 31/02 (2006.01)
U.S. Cl. 228—4.5 11 Claims
OG exemplary drawing
 
1. An apparatus for supporting at least one lead finger of at least one lead frame for a wire bonding process connecting the at least one lead finger to a semiconductor device comprising:
at least one support for positioning below the at least one lead finger for the wire bonding process, a surface of the at least one support for contacting a bearing surface and for moving on a portion thereof, the at least one support including a portion for positioning at a location between the at least one lead finger and the semiconductor device, the portion of the at least one support contacting a lower surface of the at least one lead finger located above the semiconductor device without providing support therefor; and
a heating apparatus for heating at least the semiconductor device.