US 6,982,869 B2
Folded interposer
Charles E. Larson, Nampa, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on Nov. 07, 2002, as Appl. No. 10/291,076.
Application 10/291076 is a division of application No. 09/813724, filed on Mar. 21, 2001.
Prior Publication US 2003/0069654 A1, Apr. 10, 2003
Int. Cl. H05K 1/18 (2006.01)
U.S. Cl. 361—684 12 Claims
OG exemplary drawing
 
1. A computer system comprising:
an input device;
an output device;
a processor, coupled to said input device and said output device; and
a memory module, coupled to said processor, comprising:
a module board having at least one electrical circuit in electrical communication with at least one high density semiconductor package;
said at least one high density semiconductor package attached to and in electrical communication with said module board, said at least one high density semiconductor package comprising:
a flexible interposer folded around at least one semiconductor die, said interposer including a first surface having a plurality of electrical contacts for electrically connecting said at least one semiconductor die to a substrate, a second surface, and a plurality of vias extending through said interposer from said first surface to said second surface, said at least one semiconductor die having a plurality of bond pads on a surface thereof and a back side surface, said at least one semiconductor die attached to said interposer to form an intermediate packaging structure; and
said substrate attached to said intermediate packaging structure and connected to said at least one semiconductor die through said electrical contacts and said plurality of bond pads.