US 6,982,479 B2 | ||
Semiconductor package with leadframe inductors | ||
Masaaki Nishijima, Osaka (Japan); Tsuyoshi Tanaka, Neyagawa (Japan); and Daisuke Ueda, Ibaraki (Japan) | ||
Assigned to Matsushita Electric Industrial Co., Ltd., Osaka (Japan) | ||
Filed on Sep. 24, 2003, as Appl. No. 10/669,219. | ||
Claims priority of application No. 2002-283165 (JP), filed on Sep. 27, 2002. | ||
Prior Publication US 2004/0061244 A1, Apr. 01, 2004 | ||
Int. Cl. H01L 23/02 (2006.01) |
U.S. Cl. 257—678 | 7 Claims |
1. A semiconductor device comprising:
a semiconductor chip;
a mold resin sealing the semiconductor chip; and
a plurality of conductor leads extending from an inside of the mold resin to an outside thereof, each having a portion arranged
inside the mold resin defining an internal terminal portion and a portion arranged outside the mold resin defining an external
terminal portion, and an electrode of the semiconductor chip and the internal terminal portion of the conductor lead being
connected;
wherein at least one of the conductor leads has two inductance element portions,
an additional external terminal portion is branched off from between the two inductance element portions,
the inductance element portions have a meandering planar shape, and
the conductor lead with the inductance element portions has an overlapping portion overlapping a lower surface of the semiconductor
chip at which the semiconductor ship is mounted on and connected with the conductor lead.
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