US 6,982,183 B2 | ||
Method and system for manufacturing a pixel image sensor | ||
Lixin Zhao, Sunnyvale, Calif. (US) | ||
Assigned to Galaxcore Inc., Cayman Islands (Cayman Islands) | ||
Filed on May 12, 2003, as Appl. No. 10/436,563. | ||
Application 10/436563 is a division of application No. 10/266839, filed on Oct. 07, 2002, granted, now 6,586,789. | ||
Prior Publication US 2004/0065911 A1, Apr. 08, 2004 | ||
Int. Cl. H01L 21/00 (2006.01) |
U.S. Cl. 438—48 | 7 Claims |
1. A method for forming CMOS image sensor pixel, the method comprising:
forming a first region of a first conductive type on a first of a first semiconductive material, the first layer being disposed
on a substrate of the first conductive type, the first region being coupled to a conductive contact; and
forming a second region of a second conductive type on the first layer, the first region being substantially enclosed by the
second region, the first region and the second region being separated by a third region of the first semiconductive material,
wherein the first region, the third region and the second region form a lateral photodiode element that is reverse based and
signals generated from photoelectric conversion are readout to a circuit via the conductive contact.
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