US 6,982,784 B2 | ||
Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method | ||
Shin Matsui, Saitama (Japan) | ||
Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
Filed on Sep. 02, 2004, as Appl. No. 10/931,984. | ||
Application 10/931984 is a division of application No. 09/799060, filed on Mar. 06, 2001, granted, now 6,862,080. | ||
Claims priority of application No. 2000-066378 (JP), filed on Mar. 10, 2000; and application No. 2001-040169 (JP), filed on Feb. 16, 2001. | ||
Prior Publication US 2005/0018169 A1, Jan. 27, 2005 | ||
Int. Cl. G03B 27/58 (2006.01); G03B 27/62 (2006.01) |
U.S. Cl. 355—72 | 3 Claims |
1. A substrate holding device comprising:
a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
a sensor that identifies an identification sign provided on said plate; and
a controller that selects the plate based on an identification signal from said sensor, wherein said controller selects said
plate based on information on a type of the substrate.
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