US 6,982,472 B2 | ||
Semiconductor device and capacitor | ||
Masahiro Kiyotoshi, Sagamihara (Japan) | ||
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
Filed on Sep. 04, 2003, as Appl. No. 10/654,472. | ||
Claims priority of application No. 2003-053185 (JP), filed on Feb. 28, 2003. | ||
Prior Publication US 2004/0169255 A1, Sep. 02, 2004 | ||
Int. Cl. H01L 29/00 (2006.01) |
U.S. Cl. 257—532 | 9 Claims |
1. A semiconductor device comprising:
a semiconductor substrate; and
a capacitor provided above the semiconductor substrate, the capacitor comprising:
a lower electrode containing metal;
a dielectric film containing tantalum oxide or niobium oxide;
an upper electrode containing metal; and
at least one of a lower barrier layer which is provided between the lower electrode and the dielectric film and an upper barrier
layer which is provided between the upper electrode and the dielectric film,
the lower barrier layer being insulating layers which contain silicon, oxygen and nitrogen, containing the nitrogen at least
in a portion on a side contacting the lower electrode and containing the oxygen in an portion on a side contacting the dielectric
film,
the upper barrier layer being insulating layer which contains silicon, oxygen and nitrogen, containing the nitrogen at least
in a portion on a side contacting the upper electrode and containing the oxygen in a portion on a side contacting the dielectric
film.
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