US 6,982,861 B2 | ||
Sole structure for electrostatic dissipative footwear and method of making same | ||
Chien Lee, No. 63 AN-HO Road, Section 1, Taipai (Taiwan); and Donald R. Jensen, 26550 Rookery Lake Dr., Bonita Springs, Fla. 34134 (US) | ||
Filed on Dec. 16, 2003, as Appl. No. 10/737,294. | ||
Application 10/737294 is a continuation of application No. 09/844798, filed on Apr. 27, 2001, granted, now 6,721,161. | ||
Application 09/844798 is a continuation of application No. 09/814085, filed on Mar. 21, 2001, abandoned. | ||
Prior Publication US 2004/0130848 A1, Jul. 08, 2004 | ||
Int. Cl. H05F 3/02 (2006.01) |
U.S. Cl. 361—223 | 26 Claims |
1. An electrostatic circuit for footwear wherein said footwear includes an outsole having electrically conductive properties,
an insole having electrically conductive properties, and a midsole between the insole and outsole that is substantially non-electrically
conductive, said electrostatic circuit comprising:
an electrically conductive path extending between said outsole and said insole through said midsole, one end of said conductive
path being in electrical contact with said outsole and the other end of said conductive path being in electrical contact with
said insole;
a pad adapted for large area contact with one of said insole and said outsole, said pad having an electrically conductive
portion that includes stitching that lies in said electrically conductive path; and
an at least one resistor electrically coupled to said electrically conductive path.
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