US 6,981,323 B2
Method for fabricating a fluid injection head structure
Tsung-Wei Huang, Taipei (Taiwan); and Chih-Ching Chen, Taipei (Taiwan)
Assigned to BenQ Corporation, Tao-Yuan Hsien (Taiwan)
Filed on Feb. 11, 2004, as Appl. No. 10/708,152.
Application 10/708152 is a division of application No. 10/065609, filed on Nov. 03, 2002, granted, now 6,902,257.
Claims priority of application No. 90127720 A (TW), filed on Nov. 08, 2001.
Prior Publication US 2004/0160479 A1, Aug. 19, 2004
Int. Cl. B21D 53/76 (2006.01); B41J 2/135 (2006.01)
U.S. Cl. 29—890.1 15 Claims
OG exemplary drawing
 
1. A method for fabricating a fluid injection head structure comprising steps of:
providing a substrate;
forming at least one bubble generator on the substrate;
forming at least one functional device;
forming a first conductive trace, the first conductive trace formed of poly-silicon; and
forming a second conductive trace, which is used to electrically couple the functional device with the bubble generator, and also serves to couple the functional device with the first conductive trace.