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US 6,981,629 B2 |
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Apparatus of clamping semiconductor devices using sliding finger supports |
Michael B. Ball, Boise, Id. (US) |
Assigned to Micron Technology, Inc., Boise, Id. (US) |
Filed on Aug. 11, 2003, as Appl. No. 10/639,121. |
Application 09/358248 is a division of application No. 09/244702, filed on Feb. 04, 1999, granted, now 6,299,057, filed on Oct. 09, 2001. |
Application 10/639121 is a continuation of application No. 09/840289, filed on Apr. 23, 2001, granted, now 6,637,636, filed on Oct. 28, 2003. |
Application 09/840289 is a continuation of application No. 09/358248, filed on Jul. 21, 1999, granted, now 6,227,431, filed on May 08, 2001. |
Application 09/244702 is a continuation of application No. 08/709639, filed on Sep. 09, 1996, granted, now 5,890,644, filed on Apr. 06, 1999. |
Application 08/709639 is a continuation in part of application No. 08/631143, filed on Jun. 17, 1996, granted, now 5,673,845, filed on Oct. 07, 1997. |
Application 08/631143 is a continuation in part of application No. 08/597616, filed on Feb. 06, 1996, granted, now 5,647,528, filed on Jul. 15, 1997. |
Application 08/597616 is a continuation in part of application No. 08/592058, filed on Jan. 26, 1996, granted, now 5,954,842, filed on Sep. 21, 1999. |
Prior Publication US 2004/0035913 A1, Feb. 26, 2004 |
This patent is subject to a terminal disclaimer. |
Int. Cl. B23K 37/00 (2006.01); B23K 31/02 (2006.01)
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