US 6,982,491 B1 | ||
Sensor semiconductor package and method of manufacturing the same | ||
Chun Ho Fan, Sham Tseng (Hong Kong Special Administrative Reg ); Sadak Thamby Labeeb, Tsuen Wan (Hong Kong Special Administrative Reg ); and Lap Keung Chow, Kowloon (Hong Kong Special Administrative Reg ) | ||
Assigned to ASAT Ltd., New Territories (Hong Kong Special Administrative Reg ) | ||
Filed on Jan. 20, 2004, as Appl. No. 10/759,247. | ||
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) |
U.S. Cl. 257—778 | 14 Claims |
1. An integrated circuit package comprising:
a substrate having conductive traces therein, the substrate including a cavity therein;
a semiconductor die mounted to a first surface of the substrate, in a flip-chip orientation such that a sensor portion of
said semiconductor die is aligned with said cavity and conductive interconnects connect pads of the semiconductor die to said
conductive traces of said substrate;
an underfill material surrounding said interconnects;
a plurality of conductive balls disposed on said first surface of said substrate, said conductive balls being electrically
connected to said conductive traces such that ones of said conductive balls are connected to ones of said pads of said semiconductor
die via said conductive traces; and
an overmold material covering a back side of said semiconductor die and said plurality of conductive balls such that portions
of said conductive balls are exposed.
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