US 6,982,030 B2
Reduction of surface oxidation during electroplating
Yun Zhang, Warren, N.J. (US); Robert A. Schetty, III, Ft. Salonga, N.Y. (US); and Kilnam Hwang, Melville, N.Y. (US)
Assigned to Technic, Inc., Plainview, N.Y. (US)
Filed on Nov. 27, 2002, as Appl. No. 10/305,547.
Prior Publication US 2004/0099340 A1, May 27, 2004
Int. Cl. C25D 3/56 (2006.01); C23C 18/00 (2006.01); C23C 30/00 (2006.01); B05D 1/18 (2006.01); B32B 15/01 (2006.01)
U.S. Cl. 205—238 16 Claims
 
1. A method for enhancing the solderability of a metal coating that is plated on a substrate, which comprises providing an electroplating solution for depositing the metal coating on the substrate, adding sufficient amounts of phosphorus to the electroplating solution to provide a concentration of between 0.5 to 15 g/l for enabling the phosphorus to co-deposit with the metal, and electroplating the substrate by co-depositing phosphorus and the metal wherein the electroplated metal coating is produced by electroplating at a current density of no greater than about 2000 ASF with the current density controlled to achieve the desired quantity of phosphorus in the electroplated metal coating and with the phosphorus being present in the electroplated metal coating in trace amounts sufficient to reduce surface oxide formation on exposed portions of the electroplated metal coating during subsequent heating or processing operations to thus enhance long term solderability of the electroplated metal coating, wherein the electroplated metal coating is nickel, cobalt, copper, tungsten or tin.