US 6,981,380 B2 | ||
Thermoelectric cooling for microelectronic packages and dice | ||
Gregory M. Chrysler, Chandler, Ariz. (US); Paul A. Koning, Chandler, Ariz. (US); Saikumar Jayaraman, Chandler, Ariz. (US); and Makarem A. Hussein, Beaverton, Oreg. (US) | ||
Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
Filed on Dec. 20, 2002, as Appl. No. 10/326,864. | ||
Prior Publication US 2004/0118129 A1, Jun. 24, 2004 | ||
Int. Cl. F35B 21/02 (2006.01) |
U.S. Cl. 62—3.2 | 19 Claims |
1. A method, comprising:
thermally coupling a second TEC substrate of two or more thermoelectric cooling devices with a microelectronic die;
electrically connecting the two or more thermoelectric cooling devices in series; and
thermally coupling a first TEC substrate of the two or more thermoelectric cooling devices with an inner surface of an integrated
heat spreader.
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