US 6,983,002 B2
Semiconductor laser device and optical pickup using the same
Hideshi Koizumi, Yamatotakada (Japan); Ayumi Yagi, Yamatotakada (Japan); Kazunori Matsubara, Shiki-gun (Japan); and Nobumasa Kaneko, Kitakatsuragi-gun (Japan)
Assigned to Sharp Kabushiki Kaisha, Osaka (US)
Filed on Sep. 30, 2003, as Appl. No. 10/677,030.
Claims priority of application No. 2002-286806 (JP), filed on Sep. 30, 2002; and application No. 2003-321541 (JP), filed on Sep. 12, 2003.
Prior Publication US 2004/0066813 A1, Apr. 08, 2004
Int. Cl. H01S 3/04 (2006.01)
U.S. Cl. 372—36 10 Claims
OG exemplary drawing
 
1. A semiconductor laser device including an element mounting area, which is formed on a top surface of a supporting member having a plane area surrounded by a pair of right and left opposing ends and a pair of front and back opposing sides, for mounting a series of elements including: a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected at an outside optical disc surface so as to be re-entered, wherein
an optical path of the laser beam from the semiconductor laser element to the optical disc surface includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upwards direction,
arcuate curved outer surfaces are formed on the pair of right and left opposing ends of the supporting member, respectively, or on a pair of right and left protrusions formed on the supporting member, respectively, by which the supporting member is fitted into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces, and
the arcuate curved outer surfaces are formed of arcs having the vertical optical path as central axes, and are so formed that lengths of curvature radiuses of right and left sides are different.