US 6,981,859 B2 | ||
Method for manufacturing electronic component and apparatus for manufacturing the same | ||
Shingo Okuyama, Takefu (Japan); Tadahiro Nakagawa, Fukui (Japan); Takehiko Miura, Takefu (Japan); and Makoto Fukuda, Takefu (Japan) | ||
Assigned to Murata Manufacturing Co., Ltd., Kyoto (Japan) | ||
Filed on Feb. 24, 2003, as Appl. No. 10/372,703. | ||
Application 10/372703 is a division of application No. 09/578370, filed on May 25, 2000, granted, now 6,569,367. | ||
Claims priority of application No. 11-147573 (JP), filed on May 27, 1999. | ||
Prior Publication US 2003/0132544 A1, Jul. 17, 2003 | ||
Int. Cl. B29C 70/72 (2006.01) |
U.S. Cl. 425—110 | 9 Claims |
1. An apparatus for manufacturing an electronic component on which a paste is applied on a part of side faces of a component
on which a paste is applied on a part of side faces of a component body with a predetermined width, comprising:
a silt plate on which silts to be filled with the paste and having a width corresponding to the width for applying the paste
are provided, the slit plate having first and second principle faces in opposed relation with each other with a predetermined
distance apart, and the first principle face side serving as a side for disposing the component body;
a shutter member compromising an elastic member disposed so as to shut the opening of the slit on the second principle face
of the slit plate; and
a compression member for compressing the shutter member so as to allow the shutter member to undergo elastic deformation toward
the inside of the slit, in order to apply the paste in the slit on the part of the side face of the component body while supplying
the paste filled in the slit so as to swell on the first principle face side; wherein
projections are formed on the compression member at the positions in opposed relation to the slits.
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