US 6,981,585 B2
Surface package type semiconductor package and method of producing semiconductor memory
Wahei Kitamura, Kodaira (Japan); Gen Murakami, Machida (Japan); and Kunihiko Nishi, Kokubunji (Japan)
Assigned to Renesas Technology Corp., Tokyo (Japan)
Filed on Jul. 30, 2002, as Appl. No. 10/207,052.
Application 10/207052 is a division of application No. 09/843937, filed on Apr. 30, 2001, granted, now 6,443,298.
Application 07/392029 is a division of application No. 07/124925, filed on Nov. 23, 1987, abandoned.
Application 09/843937 is a continuation of application No. 09/387049, filed on Aug. 31, 1999, granted, now 6,223,893, filed on May 01, 2001.
Application 09/387049 is a continuation of application No. 09/094490, filed on Jun. 10, 1998, granted, now 5,988,368.
Application 09/094490 is a continuation of application No. 08/712559, filed on Sep. 13, 1996, granted, now 5,803,246.
Application 08/712559 is a continuation of application No. 08/264745, filed on Jun. 23, 1994, granted, now 5,607,059.
Application 08/264745 is a continuation of application No. 07/791539, filed on Nov. 14, 1991, abandoned.
Application 07/791539 is a continuation of application No. 07/392029, filed on Aug. 10, 1989, granted, now 5,095,626.
Claims priority of application No. 61-278610 (JP), filed on Nov. 25, 1986; and application No. 62-206290 (JP), filed on Aug. 21, 1987.
Prior Publication US 2002/0179460 A1, Dec. 05, 2002
This patent is subject to a terminal disclaimer.
Int. Cl. B65D 73/02 (2006.01)
U.S. Cl. 206—204 20 Claims
OG exemplary drawing
 
1. A packaged device, comprising:
a moisture proofing bag;
a surface mount semiconductor device, to be mounted on a printed circuit board, sealed in the moisture proofing bag with dry N2, the surface mount semiconductor device being a device which will be subject to heat when the surface mount semiconductor device is surface mounted on a printed circuit board; and
a desiccant sealed in said moisture proofing bag.