US 6,981,805 B2 | ||
Molded electronic connector formed from a thermally conductive polymer composition and method of making the same | ||
James D. Miller, Marietta, Ga. (US); E. Mikhail Sagal, Warwick, R.I. (US); and Kevin A. McCullough, Warwick, R.I. (US) | ||
Assigned to Cool Options, Inc., Warwick, R.I. (US) | ||
Filed on Dec. 14, 2004, as Appl. No. 11/11,996. | ||
Application 11/011996 is a continuation of application No. 09/916056, filed on Jul. 26, 2001, granted, now 6,851,869. | ||
Claims priority of provisional application 60/223228, filed on Aug. 04, 2000. | ||
Prior Publication US 2005/0095901 A1, May 05, 2005 | ||
Int. Cl. G02B 6/36 (2006.01); H01R 13/00 (2006.01) |
U.S. Cl. 385—92 | 22 Claims |
1. An electronic connector, comprising:
a housing having at least one interface port configured to receive and retain an electronic communication cable and a surface
portion adjacent said interface port for receiving a circuit board; and
a circuit board mounted on the surface portion, the circuit board including a heat-generating component residing thereon,
wherein the housing is molded over the circuit board and heat-generating component and the housing is made of a thermally-conductive
polymer composition, the composition including a base polymer and thermally-conductive filler material.
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