US 6,982,189 B2
Molded wafer scale cap array
Kia Silverbrook, Balmain (Australia)
Assigned to Silverbrook Research Pty Ltd, Balmain (Australia)
Filed on Dec. 08, 2003, as Appl. No. 10/728,930.
Application 10/728930 is a continuation of application No. 10/129502, filed on May 06, 2002, granted, now 6,716,666.
Claims priority of application No. PR 2448 (AU), filed on Jan. 10, 2001.
Prior Publication US 2004/0082119 A1, Apr. 29, 2004
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01)
U.S. Cl. 438—106 20 Claims
OG exemplary drawing
 
1. An array of wafer scale polymeric caps, made by a molding method, the method including:
forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in a mold, the mold having first and second mold halves which are brought together to form the array of wafer scale polymeric caps, each cap having a central portion and a perimeter wall; and
opening the mold so that the array of caps is carried by the first mold half.