US 6,981,318 B2 | ||
Printed circuit board manufacturing method | ||
Sul Kay Wong, North Point (Hong Kong Special Administrative Reg ) | ||
Assigned to Jetta Company Limited, Fanling (China) | ||
Filed on Oct. 22, 2002, as Appl. No. 10/278,740. | ||
Prior Publication US 2004/0078968 A1, Apr. 29, 2004 | ||
Int. Cl. H05K 3/02 (2006.01) |
U.S. Cl. 29—846 | 23 Claims |
1. A method for producing a printed circuit board on a substrate comprising:
a) printing a predetermined circuit pattern defined by connection traces onto the substrate using a conductive material;
b) applying additional connection traces onto the substrate;
c) depositing a metal layer onto the predetermined circuit pattern;
d) applying an insulation layer over the metal layer deposited onto the predetermined circuit pattern, thereby encapsulating
and securing the metal layer; and
e) optionally removing any undesired connection traces from the predetermined circuit pattern.
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