US 6,982,005 B2
Multiple-nozzle thermal evaporation source
Erten Eser, Newark, Del. (US); and Gregory M. Hanket, Newark, Del. (US)
Assigned to University of Delaware, Newark, Del. (US)
Filed on May 09, 2003, as Appl. No. 10/435,637.
Application 10/435637 is a division of application No. 10/234604, filed on Sep. 04, 2002, granted, now 6,562,405.
Claims priority of provisional application 60/322039, filed on Sep. 14, 2001.
Prior Publication US 2003/0209202 A1, Nov. 13, 2003
This patent is subject to a terminal disclaimer.
Int. Cl. C23C 14/24 (2006.01)
U.S. Cl. 118—726 12 Claims
OG exemplary drawing
 
1. In a multiple nozzle thermal evaporation source having a containment box with an evaporation chamber and a heater and having heat shielding and having a plurality of effusion nozzles, the improvement being in that the exterior of the nozzles have a tapered shape to increase the thermal conductance of the nozzles and reduce the temperature gradient, and the tapered nozzles being made of thermally conductive material with low emissivity.