US 6,982,454 B2 | ||
Metal-metal capacitor array | ||
Horia Giuroiu, Campbell, Calif. (US); and Sorin Andrei Spanoche, Santa Clara, Calif. (US) | ||
Assigned to Oki Electric Industry Co., Ltd., Tokyo (Japan) | ||
Filed on Oct. 22, 2003, as Appl. No. 10/690,456. | ||
Claims priority of provisional application 60/421779, filed on Oct. 29, 2002. | ||
Prior Publication US 2004/0129966 A1, Jul. 08, 2004 | ||
Int. Cl. H01L 27/108 (2006.01) |
U.S. Cl. 257—306 | 23 Claims |
1. A capacitor comprising:
a first metal plate formed above a semiconductor substrate;
a second metal plate formed above the first metal plate, the second metal plate having an opening in a central portion thereof;
a third metal plate formed above the second metal plate;
an insulating material between the first, second and third metal plates and on the semiconductor substrate; and
a conductive member, formed through the insulating material and the opening of the second metal plate, that electrically connects
the first and third metal plates.
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