US 6,982,863 B2 | ||
Component formation via plating technology | ||
John L. Galvagni, Surfside Beach, S.C. (US); Jason MacNeal, Georgetown, S.C. (US); Andrew P. Ritter, Surfside Beach, S.C. (US); Robert Heistand, II, Myrtle Beach, S.C. (US); and Sriram Dattaguru, Myrtle Beach, S.C. (US) | ||
Assigned to AVX Corporation, Myrtle Beach, S.C. (US) | ||
Filed on Apr. 08, 2003, as Appl. No. 10/409,036. | ||
Claims priority of provisional application 60/435218, filed on Dec. 19, 2002. | ||
Claims priority of provisional application 60/372673, filed on Apr. 15, 2002. | ||
Prior Publication US 2004/0022009 A1, Feb. 05, 2004 | ||
Int. Cl. H01G 4/228 (2006.01); H01G 4/32 (2006.01) |
U.S. Cl. 361—309 | 26 Claims |
1. A multi-layer electronic component, comprising:
a plurality of insulating substrates each having an upper and a lower surface, said plurality of insulating substrates being
delimited laterally by edges;
a plurality of electrodes interleaved between said plurality of insulating substrates, said plurality of electrodes characterized
by having tab portions thereof with respectively varied widths exposed along at least one edge of said plurality of insulating
substrates; and
at least one layer of plated termination material connecting selected of said tab portions.
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