US 6,982,564 B2
Semiconductor test interconnect with variable flexure contacts
Salman Akram, Boise, Id. (US); and Alan G. Wood, Boise, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on Dec. 24, 2002, as Appl. No. 10/329,212.
Application 09/729114 is a division of application No. 09/340879, filed on Jun. 28, 1999, granted, now 6,310,484.
Application 08/972088 is a division of application No. 08/625281, filed on Apr. 01, 1996, granted, now 5,869,974.
Application 10/329212 is a continuation of application No. 09/729114, filed on Dec. 04, 2000, granted, now 6,498,503.
Application 09/340879 is a continuation in part of application No. 08/972088, filed on Nov. 17, 1997, granted, now 6,072,321.
Prior Publication US 2003/0090282 A1, May 15, 2003
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/02 (2006.01)
U.S. Cl. 324—754 11 Claims
OG exemplary drawing
 
1. An interconnect for testing a semiconductor component comprising:
a substrate having a first side and an opposing second side;
a contact on the first side of the substrate configured to electrically engage a terminal contact on the component;
a cavity on the second side of the substrate aligned with the contact; and
a flexible segment of the substrate between the contact and the cavity configured to permit the contact to move to accommodate a variation in a size or a planarity of the terminal contact.