1. An apparatus for dissipating heat and shielding electromagnetic radiation from at least one integrated circuit on a printed
circuit board, the apparatus comprising:
a printed circuit board comprising a plurality of layers including an inner conducting layer and an exterior layer having
a surface with at least one integrated circuit disposed thereon and an electrically conductive region surrounding the at least
one integrated circuit, the printed circuit board having a row of electrically conductive through-holes located adjacent to
and along one side of the electrically conductive region, the electrically conductive through-holes being in electrical communication
with the electrically conductive region and with the conducting layer; and
an electrically conductive cover portion having a top surface and a bottom edge, the top surface having at least one heat-dissipating
structure extending therefrom and the bottom edge being in electrically conductive contact with the electrically conductive
region of the printed circuit board, the electrically conductive cover portion defining a cavity that encloses the at least
one integrated circuit on the surface of the printed circuit board to shield electromagnetic radiation, the at least one integrated
circuit being in thermally conductive communication with the electrically conductive cover portion for transferring heat thereto
to be dissipated by the at least one heat-dissipating structure.
|