1. A method for fabricating an enclosure for a mobile computing system, the method comprising:
determining a height by which electronic components of an electronic assembly fabricated on a substrate stand proud of the
substrate; and
fabricating an enclosure to house the substrate with minimum clearance, the enclosure comprising a top panel, a bottom panel,
and peripheral side panels interconnecting the top and bottom panels, wherein at least one of the top and bottom panels comprises
a zone of reduced thickness that coincides with a portion of the electronic assembly of increased height, a zone of greater
thickness that coincides with a portion of the electronic assembly of reduced height, and a strengthening beam, wherein at
least one of the top and bottom panels further comprises a heat sink having a heat spreading component changing size in cross-sectional
area along its height.
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