US 6,982,843 B2 | ||
Assembly comprising adjustable heat flux mechanism for thermally assisted/thermal information processing and control | ||
Kevin Robert Coffey, Morgan Hill, Calif. (US); Hendrik F. Hamann, Mohegan Lake, N.Y. (US); Jan-Ulrich Thiele, Menlo Park, Calif. (US); and Hemantha Kumar Wickramasinghe, Chappaqua, N.Y. (US) | ||
Assigned to Hitachi Global Storage Technologies Netherlands B.V., Amsterdam (Netherlands) | ||
Filed on Aug. 17, 2001, as Appl. No. 9/931,834. | ||
Prior Publication US 2003/0035234 A1, Feb. 20, 2003 | ||
Int. Cl. G11B 5/02 (2006.01) |
U.S. Cl. 360—59 | 20 Claims |
11. An assembly comprising:
a directed energy source configured to heat a medium;
a temperature sensing element comprising a piezoelectric film for measuring the blackbody radiation of a medium to produce
measurement information; and,
a controller responsive to measurement information including a temperature of the medium from the temperature sensing element
and inputting power to a medium based on the temperature of the medium.
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