US 6,981,312 B2
System for handling microelectronic dies having a non-piercing die ejector
Frederick F. Rezaei, Phoenix, Ariz. (US)
Assigned to Intel Corporation, Santa Clara, Calif. (US)
Filed on Mar. 31, 2003, as Appl. No. 10/404,980.
Prior Publication US 2004/0187298 A1, Sep. 30, 2004
Int. Cl. B23P 19/00 (2006.01)
U.S. Cl. 29—740 26 Claims
OG exemplary drawing
 
1. A system for handling microelectronic dies, comprising:
a frame;
a wafer support mounted to the frame to support a diced wafer comprising singulated microelectronic dies;
an ejector head having a passageway therethrough and being connected to the frame for movement to move an outlet of the passageway into respective positions below respective selected microelectronic dies;
a fluid pump having high and low pressure sides, the high pressure side being connected to the passageway to provide a fluid through the passageway, the fluid flowing from the outlet towards the selected microelectronic dies; and
a pick head connected to the frame for movement into respective positions above the wafer to engage with and remove the selected microelectronic dies below which the outlet is located.