US 6,981,594 B1
Method and apparatus to facilitate transport of semiconductor wafers
Roger P. Sarver, Gorham, Me. (US)
Assigned to National Semiconductor Corporation, Santa Clara, Calif. (US)
Filed on Jun. 17, 2003, as Appl. No. 10/463,974.
Int. Cl. B65D 85/00 (2006.01); B65D 85/30 (2006.01); A47G 19/08 (2006.01)
U.S. Cl. 206—710 7 Claims
OG exemplary drawing
 
1. An assembly to facilitate the transport of semiconductor wafers, said assembly comprising:
rigid first and second end plates;
a plurality of interconnected flexible pockets configured to be provided between said first and second end plates; and
a plural of jigs configured to be located between the first and second end plates and each of the plurality of interconnected flexible pockets, each jig including a plurality of teeth configured for insertion between said pockets to engage and open each of said pockets so that semiconductor wafers may be inserted into the plurality of interconnected flexible pockets respectively.