US 6,982,489 B2 | ||
Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween | ||
Satoru Wakiyama, Tokyo (Japan); and Kozo Harada, Tokyo (Japan) | ||
Assigned to Renesas Technology Corp., Tokyo (Japan) | ||
Filed on Sep. 02, 2003, as Appl. No. 10/652,039. | ||
Claims priority of application No. 2003-098507 (JP), filed on Apr. 01, 2003. | ||
Prior Publication US 2004/0195671 A1, Oct. 07, 2004 | ||
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) |
U.S. Cl. 257—778 | 2 Claims |
1. A semiconductor device comprising:
a plurality of laminated semiconductor elements; and
highly water-absorbing resin films formed between the semiconductor elements, wherein
the highly water-absorbing resin films absorb an organic solvent having a boiling point equal to or higher than the reflow
melting point temperature of solder.
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