US 6,981,495 B2
Wire sawing process and device
Andreas Muller, Weggis (Switzerland); and Alexander Bortnikov, Moscou (Russian Federation)
Assigned to HCT Shaping Systems SA, Cheseaux (Switzerland)
Filed on Feb. 20, 2004, as Appl. No. 10/781,762.
Claims priority of application No. 583/03 (CH), filed on Apr. 01, 2003.
Prior Publication US 2004/0194773 A1, Oct. 07, 2004
Int. Cl. B23D 57/00 (2006.01)
U.S. Cl. 125—21 14 Claims
OG exemplary drawing
 
1. Wire sawing process comprising:
sawing at least one prismatic piece to be sawed having a substantially rectangular base with a layer of wires stretched between at least two wire guide cylinders whose axes are parallel to a working plane and held in position by grooves provided on the surface of the wire guide cylinders which define an interval between the wires of the layer of wires, hence the thickness of sawed slices;
the wires of the layer being adapted to move while bearing against the piece to be sawed fixed on at least one support table via an intermediate plate;
the sawing being carried out by relative advancing movement between the piece to be sawed and the layer of wires;
wherein the piece to be sawed is fixed on the support table such that a prismatic surface of said piece directed toward the layer of wires forms a predetermined angle of inclination with said working plane along an intersection line parallel to the axes of the wire guide cylinders;
the size of said predetermined angle of inclination being fixed such that the beginning of sawing takes place against a prismatic edge of the piece to be sawed, and at the end of cutting, the wires of the layer of wires are prevented from penetrating from the intermediate plate into the piece to be sawed fixed on said intermediate plate.