US 6,982,386 B2 | ||
Interconnecting substrates for electrical coupling of microelectronic components | ||
Syed Sajid Ahmad, Boise, Id. (US) | ||
Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
Filed on Oct. 07, 2002, as Appl. No. 10/267,080. | ||
Application 10/267080 is a division of application No. 09/644801, filed on Aug. 23, 2000, granted, now 6,483,044. | ||
Prior Publication US 2003/0106709 A1, Jun. 12, 2003 | ||
Int. Cl. H05K 1/16 (2006.01); H01L 23/053 (2006.01) |
U.S. Cl. 174—260 | 18 Claims |
1. A microelectronic device, comprising:
a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit;
an interconnecting substrate coupled to the microelectronic die, the interconnecting substrate having a first external layer,
a second external layer, a first conductive stratum between the first and second external layers, a first dielectric separator
layer having a first surface contacting the first conductive stratum, a plurality of contact elements on at least one of the
first and second external layers coupled to corresponding bond-pads on the die, a plurality ball-pads on at least one of the
first and second external layers, and a plurality of trace lines electrically coupling selected contact elements to corresponding
ball-pads, wherein the first conductive stratum has an internal moisture release element, and wherein at least one of the
contact elements is coupled to the first conductive stratum; and
a protective casing covering at least a portion of the microelectronic die.
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