US 6,982,874 B2
Thermal solution for electronic devices
Martin David Smalc, Parma, Ohio (US); Gary D. Shives, Brunswick, Ohio (US); and Robert Anderson Reynolds, III, Bay Village, Ohio (US)
Assigned to Advanced Energy Technology Inc., Wilmington, Del. (US)
Filed on Nov. 25, 2003, as Appl. No. 10/722,364.
Prior Publication US 2005/0111189 A1, May 26, 2005
Int. Cl. H05K 7/20 (2006.01)
U.S. Cl. 361—704 20 Claims
OG exemplary drawing
 
1. A thermal dissipation and shielding system for an electronic device, comprising:
an electronic device comprising a first component which comprises a heat source, wherein the first component transmits heat to an external surface of the electronic device;
a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and the external surface of the electronic device,
wherein the thermal solution comprises at least one sheet of compressed particles of exfoliated graphite which thermally shields the external surface of the electronic device from heat generated by the first component.