US 6,981,879 B2 | ||
Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture | ||
Joseph Kuczynski, Rochester, Minn. (US); Timothy Jerome Tofil, Rochester, Minn. (US); and Paul Alan Vermilyea, Rochester, Minn. (US) | ||
Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
Filed on Mar. 18, 2004, as Appl. No. 10/803,634. | ||
Prior Publication US 2005/0208785 A1, Sep. 22, 2005 | ||
Int. Cl. H01R 12/00 (2006.01) |
U.S. Cl. 439—66 | 9 Claims |
1. An interposer for providing electrical connections between lands of a Land Grid Array (LGA) device and corresponding lands
of an electronic assembly, said interposer comprising:
an interposer frame comprising a substantially planar insulating sheet defining dumbell-shaped voids through said insulating
sheet perpendicular to a primary plane of the interposer frame, said voids provided for the insertion of contacts spaced in
a grid-array;
a plurality of flexible C-shaped metal conductive contacts each having an arcuate first contact end and an arcuate second
contact end, and wherein said contacts are inserted within and through the voids defined by said interposer frame such that
said first contact extends above a top surface of said interposer frame and said second contact extends below a bottom surface
of said interposer frame, and a gap of the C-shape is between the top surface and the bottom surface; and
an elastic disposed between said contacts and said interposer frame and adhered to said interposer frame, whereby said contacts
are mechanically retained to said interposer frame by said elastic which permits travel of said contacts in a direction perpendicular
to said interposer frame via flexure of said elastic.
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