US 6,981,542 B2 | ||
Multi-heatsink integrated cooler | ||
Edward Lopatinsky, San Diego, Calif. (US); Naum Shostak, Los Angeles, Calif. (US); and Lev Fedoseyev, El Cajon, Calif. (US) | ||
Assigned to Rotys Inc., San Diego, Calif. (US) | ||
Filed on Oct. 29, 2003, as Appl. No. 10/696,617. | ||
Prior Publication US 2005/0092463 A1, May 05, 2005 | ||
Int. Cl. F28F 7/00 (2006.01) |
U.S. Cl. 165—80.3 | 8 Claims |
1. A multi-heatsink integrated cooler for direct cooling of at least two electronic components comprising at least two heatsinks
with heat-exchanging means and housings with inflow and outflow openings and one common blower, wherein:
(i) each of said heatsinks is located independently in tight contact with the surface of one of said electronic components;
(ii) said housings of all said heatsinks are hydraulically connected in a common system of airflow between said heat-exchanging
means of all the heatsinks and the inside space of said blower;
(iii) said housings of the heatsinks are connected by at least one sealing element from the elastic material located in the
clearance between nearest parts of said housings thus compensating the differences in locations and tolerances.
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