US 6,983,092 B2
Optical interconnection circuit among wavelength multiplexing chips, electro-optical device, and electronic apparatus
Takayuki Kondo, Suwa (Japan)
Assigned to Seiko Epson Corporation, Tokyo (Japan)
Filed on Nov. 28, 2003, as Appl. No. 10/722,441.
Claims priority of application No. 2002-355345 (JP), filed on Dec. 06, 2002.
Prior Publication US 2004/0264867 A1, Dec. 30, 2004
Int. Cl. G02B 6/30 (2006.01); H04B 10/12 (2006.01)
U.S. Cl. 385—49 14 Claims
OG exemplary drawing
 
1. An optical interconnection circuit among wavelength multiplexing chips comprising:
a substrate,
a micro-tile shaped elements disposed on the substrate having a light emitting function or a light receiving function with wavelength selectivity; and
optical waveguides disposed on the substrate and optically connected to the micro-tile shaped elements.