US 6,981,759 B2 | ||
Substrate and method forming substrate for fluid ejection device | ||
Chien-Hua Chen, Corvallis, Oreg. (US); Donald W. Schulte, Corvallis, Oreg. (US); and Terry E. McMahon, Corvallis, Oreg. (US) | ||
Assigned to Hewlett-Packard Development Company, LP., Houston, Tex. (US) | ||
Filed on Apr. 30, 2002, as Appl. No. 10/135,236. | ||
Prior Publication US 2003/0201245 A1, Oct. 30, 2003 | ||
Int. Cl. B41J 2/05 (2006.01) |
U.S. Cl. 347—65 | 23 Claims |
1. A substrate for a fluid ejection device, the substrate comprising:
a first side;
a second side opposite the first side;
spaced etch stops formed in the first side of the substrate; and
a fluidic channel communicating with the first side and the second side, wherein a first portion of the fluidic channel extends
from the second side toward the first side to the spaced etch stops and a second portion of the fluidic channel extends between
the spaced etch stops from the first portion of the fluidic channel to the first side,
wherein the spaced etch stops are formed in spaced slots formed in the first side of the substrate.
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