US 6,982,843 B2
Assembly comprising adjustable heat flux mechanism for thermally assisted/thermal information processing and control
Kevin Robert Coffey, Morgan Hill, Calif. (US); Hendrik F. Hamann, Mohegan Lake, N.Y. (US); Jan-Ulrich Thiele, Menlo Park, Calif. (US); and Hemantha Kumar Wickramasinghe, Chappaqua, N.Y. (US)
Assigned to Hitachi Global Storage Technologies Netherlands B.V., Amsterdam (Netherlands)
Filed on Aug. 17, 2001, as Appl. No. 9/931,834.
Prior Publication US 2003/0035234 A1, Feb. 20, 2003
Int. Cl. G11B 5/02 (2006.01)
U.S. Cl. 360—59 20 Claims
OG exemplary drawing
 
11. An assembly comprising:
a directed energy source configured to heat a medium;
a temperature sensing element comprising a piezoelectric film for measuring the blackbody radiation of a medium to produce measurement information; and,
a controller responsive to measurement information including a temperature of the medium from the temperature sensing element and inputting power to a medium based on the temperature of the medium.