US 6,982,341 B1 | ||
Volatile copper aminoalkoxide complex and deposition of copper thin film using same | ||
Yunsoo Kim, Daejeon (Korea, Republic of); Chang Gyoun Kim, Daejeon (Korea, Republic of); Taek-Mo Chung, Daejeon (Korea, Republic of); Sun Sook Lee, Daejeon (Korea, Republic of); Ki-Seok An, Daejeon (Korea, Republic of); Taek Seung Yang, Daejeon (Korea, Republic of); and Hong Suk Jang, Daejeon (Korea, Republic of) | ||
Assigned to Korea Research Institute of Chemical Technology, (Korea, Republic of) | ||
Filed on Mar. 30, 2005, as Appl. No. 11/93,995. | ||
Int. Cl. C07F 1/08 (2006.01); C23C 16/18 (2006.01) |
U.S. Cl. 556—113 | 6 Claims |
1. A copper aminoalkoxide complex of formula (I): ![]() wherein, R1, R2, R3 and R4 are each independently C1-4 alkyl optionally carrying one or more fluorine substituents; and m is an integer in the range of 1 to 3. |