US 6,981,317 B1 | ||
Method and device for mounting electronic component on circuit board | ||
Kazuto Nishida, Katano (Japan) | ||
Assigned to Matsushita Electric Industrial Co., Ltd., Osaka-fu (Japan) | ||
Appl. No. 9/331,763 PCT Filed Dec. 26, 1997, PCT No. PCT/JP97/04873 § 371(c)(1), (2), (4) Date Jun. 25, 1999, PCT Pub. No. WO98/30073, PCT Pub. Date Jul. 09, 1998. |
||
Claims priority of application No. 8-350738 (JP), filed on Dec. 27, 1996. | ||
Int. Cl. H01L 21/44 (2006.01) |
U.S. Cl. 29—840 | 28 Claims |
1. A method of mounting an electronic component, said method comprising:
aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit
board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed
between said electronic component and said circuit board, while achieving mutual pressing between said electronic component
and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any
warping of said circuit board thereby bonding said electronic component and said circuit board together to achieve electrical
connection between said mutual electrodes thereof; and
said hardening, said leveling and said correcting being achieved at approximately the same time,
wherein said thermosetting resin includes conductive particles.
|