US 6,982,493 B2 | ||
Wedgebond pads having a nonplanar surface structure | ||
Kevin Shawn Petrarca, Newburgh, N.Y. (US); and Richard Paul Volant, New Fairfield, Conn. (US) | ||
Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
Filed on Apr. 03, 2003, as Appl. No. 10/249,382. | ||
Prior Publication US 2004/0195679 A1, Oct. 07, 2004 | ||
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01) |
U.S. Cl. 257—784 | 7 Claims |
1. A wedgebond pad structure comprising:
a substrate;
a metallic layer formed on the substrate;
a dielectric layer over the metallic layer, at least one through via to the metallic layer and at least a portion of the dielectric
layer comprising a nonplanar dielectric structure;
a metallic bond layer conformally formed over the nonplanar structure of the dielectric layer such that the nonplanar dielectric
structure is substantially reproduced in the metallic bond layer as a nonplanar metallic structure, the metallic bond layer
further formed in the through via so as to contact the metallic layer, wherein the nonplanar metallic structure has a planar
surface and only one curved or v-shaped feature for receiving a wedge bond wherein the surface is not coplanar with the curved
or v-shaped feature.
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