US 6,982,192 B1 | ||
High performance thermal interface curing process for organic flip chip packages | ||
Nagesh Vodrahalli, Cupertino, Calif. (US); and Biswajit Sur, San Jose, Calif. (US) | ||
Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
Filed on Dec. 30, 1999, as Appl. No. 9/475,104. | ||
Int. Cl. H01C 21/44 (2006.01); H05B 6/64 (2006.01); H05B 6/70 (2006.01); H05B 6/50 (2006.01); H01L 23/495 (2006.01); H01L 23/10 (2006.01) |
U.S. Cl. 438—122 | 18 Claims |
1. A method for assembling an integrated circuit package, comprising:
applying a thermal epoxy after applying said epoxy to the integrated circuit to a top surface of an integrated circuit;
placing a thermal element adjacent to the thermal epoxy;
curing the thermal epoxy with energy at a microwave frequency without heating other components of the integrated circuit package,
the curing of the thermal epoxy with the energy at the microwave frequency preventing (i) warpage of the integrated circuit
package and (ii) epoxy pumping that would create air gaps between the thermal element and the integrated circuit; and
applying an encapsulant over the integrated circuit, the thermal element and the thermal epoxy after curing of the thermal
epoxy.
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