US 6,982,059 B2 | ||
Rhodium, platinum, palladium alloy | ||
Jiang Liang, Schenectady, N.Y. (US); Melvin Robert Jackson, Niskayuna, N.Y. (US); Charles Gitahi Mukira, Clifton Park, N.Y. (US); and Mark Daniel Gorman, Westchester, Ohio (US) | ||
Assigned to General Electric Company, Niskayuna, N.Y. (US) | ||
Filed on Oct. 01, 2001, as Appl. No. 9/682,630. | ||
Prior Publication US 2005/0265888 A1, Dec. 01, 2005 | ||
Int. Cl. C22C 5/04 (2006.01) |
U.S. Cl. 420—467 | 22 Claims |
1. An alloy for use in high-temperature applications, said alloy comprising:
palladium, in an amount ranging from about 1 atomic percent to about 41 atomic percent;
platinum, in an amount that is dependent upon said amount of palladium, such that
a. for said amount of palladium ranging from about 1 atomic percent to about 14 atomic percent, said platinum is present up
to about an amount defined by the formula (40+X) atomic percent, wherein X is the amount in atomic percent of said palladium,
and
b. for said amount of palladium ranging from about 15 atomic percent up to about 41 atomic percent, said platinum is present
in an amount up to about 54 atomic percent; and
the balance comprising rhodium, wherein said rhodium is present in an amount of at least 24 atomic percent;
wherein said alloy is essentially free of L12-structured phase at a temperature greater than about 1000° C.
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