US 6,982,495 B2 | ||
Mark configuration, wafer with at least one mark configuration, and a method of producing at least one mark configuration | ||
Hans-Georg Fröhlich, Dresden (Germany); Johannes Kowalewski, Dresden (Germany); Udo Götschkes, Dresden (Germany); Frank Hübinger, Dresden (Germany); Gerd Krause, Dresden (Germany); Heike Langnickel, Wachau (Germany); Antje Lässig, Dresden (Germany); and Reiner Trinowitz, Dresden (Germany) | ||
Assigned to Infineon Technologies AG, Munich (Germany) | ||
Filed on Oct. 31, 2002, as Appl. No. 10/284,778. | ||
Claims priority of application No. 101 54 981 (DE), filed on Oct. 31, 2001. | ||
Prior Publication US 2003/0092204 A1, May 15, 2003 | ||
Int. Cl. H01L 23/544 (2006.01) |
U.S. Cl. 257—797 | 14 Claims |
1. A mark configuration for at least one of alignment and determination of a relative position of at least two planes in relation
to one another in at least one of a substrate and layers on the substrate during lithographic exposure, comprising:
a substrate having a reference plane at least one of therein and thereon;
a mark structure disposed at said substrate; and
at least one layer having a defined thickness disposed between said mark structure and said substrate adjusting a physical
position of said mark structure relative to said reference plane.
|