US 6,982,184 B2 | ||
Method of fabricating MEMS devices on a silicon wafer | ||
Kia Silverbrook, Balmain (Australia) | ||
Assigned to Silverbrook Research Pty Ltd, Balmain (Australia) | ||
Filed on Nov. 12, 2004, as Appl. No. 10/986,354. | ||
Application 10/986354 is a continuation of application No. 10/258517, granted, now 6,846,692, previously published as PCT/AU01/00502, filed on May 02, 2001. | ||
Prior Publication US 2005/0095742 A1, May 05, 2005 | ||
This patent is subject to a terminal disclaimer. | ||
Int. Cl. H01L 21/00 (2006.01) |
U.S. Cl. 438—51 | 9 Claims |
1. A method of fabricating MEMS devices, the method including the steps of:
providing a silicon wafer having a MEMS layer arranged on a MEMS side of the wafer;
applying a first holding means to the MEMS side of the wafer;
performing at least one operation on the wafer from a back side of the wafer opposed to the MEMS side;
performing at least one deep silicon etch on the back side of the wafer to define individual MEMS chips, each chip being composed
of a part of the wafer and at least one part of the MEMS layer;
applying a second holding means to said back side of the wafer;
removing the first holding means; and
causing the individual chips to be released from the second holding means.
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