US 6,982,565 B2 | ||
Test system and test method with interconnect having semiconductor spring contacts | ||
Kyle K. Kirby, Boise, Id. (US) | ||
Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
Filed on Mar. 06, 2003, as Appl. No. 10/379,949. | ||
Prior Publication US 2004/0174176 A1, Sep. 09, 2004 | ||
Int. Cl. G01R 31/02 (2006.01); G01R 31/26 (2006.01) |
U.S. Cl. 324—755 | 41 Claims |
1. A system for testing a semiconductor wafer containing a plurality of semiconductor components having a plurality of component
contacts comprising:
a test circuitry configured to apply test signals to the components;
a testing apparatus configured to support and move the wafer;
an interconnect on the testing apparatus comprising a substrate and a plurality of interconnect contacts on the substrate
in electrical communication with the test circuitry and configured to electrically engage the component contacts,
the interconnect contacts comprising hinged spring segment portions of the substrate separated and defined by a plurality
of grooves in the substrate, the spring segment portions having shapes, hinge points and spring constants determined by the
grooves.
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