US 6,982,496 B2
Semiconductor device having bump electrode and support area
Hirofumi Abe, Gamagori (Japan); and Hiroyuki Ban, Hazu-gun (Japan)
Assigned to Denso Corporation, Kariya (Japan)
Filed on Apr. 30, 2003, as Appl. No. 10/425,664.
Claims priority of application No. 2002-142974 (JP), filed on May 17, 2002.
Prior Publication US 2003/0214034 A1, Nov. 20, 2003
Int. Cl. H01L 29/06 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/544 (2006.01)
U.S. Cl. 257—797 16 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a plurality of bump electrodes disposed on the substrate; and
a support area for supporting the substrate in case of carrying the substrate,
wherein the support area is disposed directly on a surface of the substrate, and is disposed at a predetermined position which is dotted on the surface of the substrate,
wherein the plurality of bump electrodes are disposed directly on the same surface of the substrate as the support area, and
wherein the support area includes a part of the surface of the substrate on which none of the plurality of bump electrodes is disposed.