US 6,982,463 B2
Integrated circuit with reduced coupling via the substrate
Armand Castillejo, Grenoble (France)
Assigned to STMicroelectronics S.A., Montrouge (France)
Appl. No. 10/450,009
PCT Filed Nov. 26, 2001, PCT No. PCT/FR01/03721
§ 371(c)(1), (2), (4) Date Dec. 30, 2003,
PCT Pub. No. WO02/47164, PCT Pub. Date Jun. 13, 2002.
Claims priority of application No. 00 15789 (FR), filed on Dec. 06, 2000.
Prior Publication US 2004/0085704 A1, May 06, 2004
Int. Cl. H01L 23/62 (2006.01)
U.S. Cl. 257—355 17 Claims
OG exemplary drawing
 
1. An integrated radio frequency circuit with reduced coupling a plurality of electronic components formed thereon, the integrated circuit comprising:
a substrate;
a plurality of electronic components disposed on the substrate;
a seal ring with an impedance, the seal ring disposed on the substrate to completely surround the plurality of electronic components so as to prevent an exposure of the plurality of electronic components to particulate contamination resulting from a subsequent cutting of the substrate to form an integrated circuit;
at least one cold spot including a first discharge rail disposed on the substrate in between the plurality of electronic components and the seal ring, the cold spot formed and connected to ground so as to provide a path of lower impedance than the impedance of the seal ring thereby directing unwanted signals away from the seal ring and into the discharge rail of the cold spot thereby avoiding coupling of the unwanted signals between the plurality of electronic circuits via the substrate; and
a second discharge rail disposed on the substrate in between the plurality of electronic components and the first discharge rail, wherein the first discharge rail and the second discharge rail are electrically coupled by a clamp circuit for detecting electrostatic discharge signals and passing them between the first discharge rail and the second discharge rail.