US 6,982,017 B2
Method for controlling deflection of substrates by temperature
Takayuki Suzuki, Yachiyo (Japan); Masahiro Nakamura, Saitama (Japan); Tsuyoshi Wakahira, Tokyo (Japan); and Hideo Kobayashi, Tokyo (Japan)
Assigned to Origin Electric Company, Limited, Tokyo (Japan)
Filed on Jan. 30, 2004, as Appl. No. 10/769,301.
Claims priority of application No. 2003-433599 (JP), filed on Dec. 26, 2003.
Prior Publication US 2005/0139306 A1, Jun. 30, 2005
Int. Cl. B32B 31/26 (2006.01); B32B 31/28 (2006.01)
U.S. Cl. 156—64 20 Claims
OG exemplary drawing
 
1. A processing method for substrates, comprising:
a step in which substrates before curing are mounted on a mounting table, said substrates having a plurality of individual substrates and an uncured photo-curable adhesive layer interposed between these individual substrates;
a step in which substrates after curing are obtained wherein, while said substrates before curing are mounted on said mounting table, said individual substrates are bonded together by photo-curing said adhesive layer by irradiating said substrates before curing with photo-curing light; and
a step in which a deflection X of said substrates after curing is controlled by controlling at least one of said substrates before curing and said mounting table;
the step in which said deflection X is controlled comprises:
a step in which a temperature difference ΔT between a temperature Th of said mounting table and a temperature Td of said substrates before curing is found;
a step in which a deflection difference ΔX between the deflection X of said substrates after curing and a target deflection setting value Xt is found;
a step in which a temperature Tc is found by Tc=ΔT−M×ΔX by using a constant of proportionality M determined by a correlation between said temperature difference ΔT and said deflection X; and
a step in which at least one of said substrates before curing and said mounting table are temperature controlled according to said temperature Tc such that Tc=Th−Td.