US 6,982,866 B2
Lightweight robust enclosure design for a mobile computing system
Prosenjit Ghosh, Portland, Oreg. (US)
Assigned to Intel Corporation, Santa Clara, Calif. (US)
Filed on Feb. 14, 2003, as Appl. No. 10/366,991.
Prior Publication US 2004/0160732 A1, Aug. 19, 2004
Int. Cl. H05K 7/20 (2006.01)
U.S. Cl. 361—679 19 Claims
OG exemplary drawing
 
1. A method for fabricating an enclosure for a mobile computing system, the method comprising:
determining a height by which electronic components of an electronic assembly fabricated on a substrate stand proud of the substrate; and
fabricating an enclosure to house the substrate with minimum clearance, the enclosure comprising a top panel, a bottom panel, and peripheral side panels interconnecting the top and bottom panels, wherein at least one of the top and bottom panels comprises a zone of reduced thickness that coincides with a portion of the electronic assembly of increased height, a zone of greater thickness that coincides with a portion of the electronic assembly of reduced height, and a strengthening beam, wherein at least one of the top and bottom panels further comprises a heat sink having a heat spreading component changing size in cross-sectional area along its height.