US 6,982,190 B2
Chip attachment in an RFID tag
Bruce Roesner, San Diego, Calif. (US)
Assigned to ID Solutions, Inc., Tapei (Taiwan)
Filed on Mar. 25, 2003, as Appl. No. 10/396,932.
Prior Publication US 2004/0192011 A1, Sep. 30, 2004
Int. Cl. H01L 21/44 (2006.01)
U.S. Cl. 438—108 19 Claims
OG exemplary drawing
 
1. A design for attaching a die directly to a conductive module comprising:
a die supported by a lower platform;
a conductive module having conductive traces;
aligning means to align the conductive module over the die;
removing means to remove the die from the lower platform to connect to the conductive traces; and
attaching means to electrically and structurally attach the die to the conductive traces;
wherein the attaching means comprises an adhesive on the conductive module and one or more humps on the die that penetrate through the adhesive, during attachment of the die to the conductive module, to contact the conductive traces.