US 6,982,624 B2 | ||
Chip resistor | ||
Daisuke Saito, Kyoto (Japan); Takahiro Kuriyama, Kyoto (Japan); and Masato Doi, Kyoto (Japan) | ||
Assigned to Rohm Co., Ltd., Kyoto (Japan) | ||
Filed on Feb. 23, 2004, as Appl. No. 10/786,386. | ||
Claims priority of application No. 2003-047518 (JP), filed on Feb. 25, 2003. | ||
Prior Publication US 2004/0164841 A1, Aug. 26, 2004 | ||
Int. Cl. H01C 1/012 (2006.01) |
U.S. Cl. 338—309 | 6 Claims |
1. A chip resistor comprising:
an insulating chip substrate including an upper surface and a pair of opposite side surfaces;
a resistor film formed on the upper surface of the insulating substrate;
a pair of upper electrodes formed from silver-based conductive paste on the upper surface of the insulating substrate to be
connected to the resistor film;
an outermost cover coat covering the resistor film, the cover coat having a flat upper surface and a tapering edge;
an auxiliary electrode formed on each of the upper electrodes to partially overlap the cover coat;
a side electrode formed on each of the side surfaces of the insulating substrate and electrically connected to one of the
upper electrodes and one of the auxiliary upper electrodes
a nickel-plated layer covering the auxiliary electrode and the side electrode; and
a soldering layer covering the nickel-plated layer and formed of tin or solder;
wherein the side electrode is made of nonmagnetic conductive resin paste, the auxiliary electrode being made of carbon-based
conductive resin paste;
wherein the nickel-plated layer and the soldering layer extend onto the flat upper surface of the cover coat beyond the tapering
edge; and
wherein the auxiliary electrode extends onto the flat upper surface of the cover coat beyond the tapering edge.
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