US 6,982,002 B2 | ||
Apparatus and method for forming coating film | ||
Takashi Tanaka, Kikuchi-gun (Japan); and Shinji Nagashima, Kikuchi-gun (Japan) | ||
Assigned to Tokyo Electron Limited, Tokyo (Japan) | ||
Filed on Feb. 11, 2002, as Appl. No. 10/68,838. | ||
Claims priority of application No. 2001-037466 (JP), filed on Feb. 14, 2001. | ||
Prior Publication US 2002/0110641 A1, Aug. 15, 2002 | ||
Int. Cl. B05C 13/00 (2006.01) |
U.S. Cl. 118—52 | 10 Claims |
1. An apparatus for forming a coating film, comprising:
holding means for holding a substrate horizontally;
a rotation mechanism configured to rotate said holding means such that the substrate held by said holding means is allowed
to rotate in a horizontal plane;
a nozzle configured to drop a coating liquid through a hole on a surface of the substrate;
a center rod provided at a center of the hole and configured to flow the coating liquid along the inner wall of the hole;
and
a spiral groove formed on an inner wall of the hole of said nozzle, the spiral groove extending to a position adjacent an
exit of the nozzle and configured to gyrate the coating liquid such that the coating liquid continues to gyrate after being
dropped from the nozzle.
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