US 6,982,782 B2
Processing apparatus for processing object in vessel
Keiji Emoto, Tochigi (Japan)
Assigned to Canon Kabushiki Kaisha, Tokyo (Japan)
Filed on Mar. 09, 2004, as Appl. No. 10/797,843.
Claims priority of application No. 2003-064199 (JP), filed on Mar. 10, 2003.
Prior Publication US 2004/0179178 A1, Sep. 16, 2004
Int. Cl. G03B 27/42 (2006.01); G03B 27/52 (2006.01)
U.S. Cl. 355—53 1 Claim
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a substrate processing unit;
a chamber which accommodates said substrate processing unit in a pressure-reduced ambient; and
a temperature adjusting plate arranged between said substrate processing unit and said chamber,
wherein said chamber has an exhaust port communicating with an exhaust portion, and
said temperature adjusting plate has a hole and arranged near the exhaust port such that the hole corresponds to the exhaust port.