US 6,982,470 B2 | ||
Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment | ||
Osamu Omori, Fujimi-machi (Japan) | ||
Assigned to Seiko Epson Corporation, Tokyo (Japan) | ||
Filed on Nov. 25, 2003, as Appl. No. 10/722,365. | ||
Claims priority of application No. 2002-343816 (JP), filed on Nov. 27, 2002. | ||
Prior Publication US 2004/0159920 A1, Aug. 19, 2004 | ||
Int. Cl. H01L 31/0203 (2006.01); H01L 27/15 (2006.01) |
U.S. Cl. 257—434 | 4 Claims |
1. A cover for a semiconductor device having a substrate with an optical unit formed thereon, the cover comprising:
a portion defining a first opening on a surface of the cover;
a portion defining a second opening on the surface of the cover;
a portion defining a third opening on the surface of the cover, wherein the first opening is formed between the second opening
and the third opening; and
a translucent portion in at least the portion defining the second opening, wherein the first opening is formed along a circumference
of the second opening, and wherein the first opening contains an adhesive for affixing the cover to the substrate, and wherein
the second opening is formed to receive and surround the optical unit inside of the second opening when the cover is affixed
to the substrate, and wherein the second opening that includes the optical unit is sealed from the adhesive in the first opening.
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