US 6,981,323 B2 | ||
Method for fabricating a fluid injection head structure | ||
Tsung-Wei Huang, Taipei (Taiwan); and Chih-Ching Chen, Taipei (Taiwan) | ||
Assigned to BenQ Corporation, Tao-Yuan Hsien (Taiwan) | ||
Filed on Feb. 11, 2004, as Appl. No. 10/708,152. | ||
Application 10/708152 is a division of application No. 10/065609, filed on Nov. 03, 2002, granted, now 6,902,257. | ||
Claims priority of application No. 90127720 A (TW), filed on Nov. 08, 2001. | ||
Prior Publication US 2004/0160479 A1, Aug. 19, 2004 | ||
Int. Cl. B21D 53/76 (2006.01); B41J 2/135 (2006.01) |
U.S. Cl. 29—890.1 | 15 Claims |
1. A method for fabricating a fluid injection head structure comprising steps of:
providing a substrate;
forming at least one bubble generator on the substrate;
forming at least one functional device;
forming a first conductive trace, the first conductive trace formed of poly-silicon; and
forming a second conductive trace, which is used to electrically couple the functional device with the bubble generator, and
also serves to couple the functional device with the first conductive trace.
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