US 6,982,387 B2 | ||
Method and apparatus to establish circuit layers interconnections | ||
Richard R. Hall, Endwell, N.Y. (US); How T. Lin, Vestal, N.Y. (US); Christopher J. Majka, Owego, N.Y. (US); Matthew F. Seward, Windsor, N.Y. (US); and Ronald V. Smith, Friendsville, Pa. (US) | ||
Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
Filed on Jun. 19, 2001, as Appl. No. 9/884,778. | ||
Prior Publication US 2002/0189861 A1, Dec. 19, 2002 | ||
Int. Cl. H01R 12/04 (2006.01); H05K 1/11 (2006.01) |
U.S. Cl. 174—262 | 5 Claims |
1. A method of forming a conductive path within a laminate, comprising:
providing an opening in the laminate;
pressing a conductive element into the opening such that a portion of at least one end of the conductive element extends beyond
a surface of the laminate; and
applying a compressive pressure to the portion of the at least one end of the conductive element, wherein the compressive
pressure applied to the portion of the at least one end of the conductive element forms a contact pad extending beyond the
surface of the laminate, and wherein the conductive element includes an inner element covered by an outer element, wherein
the conductive element is a sphere.
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