US 7,320,902 B2
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
Nobuaki Hashimoto, Suwa (Japan)
Assigned to Seiko Epson Corporation, Tokyo (Japan)
Filed on Mar. 01, 2004, as Appl. No. 10/788,447.
Claims priority of application No. 2003-068281 (JP), filed on Mar. 13, 2003.
Prior Publication US 2004/0229418 A1, Nov. 18, 2004
Int. Cl. H01L 21/00 (2006.01)
U.S. Cl. 438—118  [438/119; 257/687; 257/782; 257/783; 257/784] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic device, the method comprising:
forming an external terminal on an interconnect pattern formed on a substrate;
subsequently mounting a chip component above the substrate face up with an adhesive disposed between the substrate and the chip component, the chip component having an electrode on a first surface of the chip component opposite to a second surface facing the substrate;
forming an insulating section adjacent to the chip component by applying a force between the substrate and the chip component so that a portion of the adhesive is pressed out to a region adjacent to the chip component, the portion having a top higher from the substrate than the first surface, the insulating section formed of the portion of the adhesive; and
forming by inkjet an interconnect on the insulating section from the electrode to the interconnect pattern for electrically connecting the electrode and the interconnect pattern at a temperature lower than a melting point of the external terminal.