US 7,321,137 B2 | ||
RGB light emitting diode package with improved color mixing properties | ||
Young Sam Park, Seoul (Korea, Republic of); Hun Joo Hahm, Sungnam (Korea, Republic of); Hyung Suk Kim, Suwon (Korea, Republic of); Jung Kyu Park, Suwon (Korea, Republic of); and Young June Jeong, Suwon (Korea, Republic of) | ||
Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-Do (Korea, Republic of) | ||
Filed on Oct. 07, 2004, as Appl. No. 10/959,154. | ||
Claims priority of application No. 10-2004-0051422 (KR), filed on Jul. 02, 2004. | ||
Prior Publication US 2006/0001034 A1, Jan. 05, 2006 | ||
Int. Cl. H01L 33/00 (2006.01) |
U.S. Cl. 257—98 [257/79; 257/88; 257/100; 257/E33.067] | 10 Claims |
1. An RGB (red, green, and blue) light emitting diode package, comprising:
red, green, and blue light emitting diode chips provided above a reflector; and
a photomixing material and a filler resin for scattering and uniformly mixing rays emitted from the light emitting diode chips;
wherein, the photomixing material and filler resin cover upper surfaces of the light emitting diode chips, the photomixing
material is uniformly dispersed in the filler resin, and the photomixing material constitutes 1-20 wt % of a total weight
of the photomixing material and filler resin;
wherein the photomixing material contains the methyl group;
wherein the photomixing material is at least one selected from the group consisting of an epoxy resin and a silicon resin;
and
wherein the epoxy and silicon resins are mixed with each other, and a mixing ratio of the epoxy and silicon resins is 1:1.
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