US 7,320,604 B2
Electronic circuit module and method for fabrication thereof
Terukazu Ohtsuki, Nara (Japan)
Assigned to Sharp Kabushiki Kaisha, Osaka (Japan)
Filed on Nov. 14, 2006, as Appl. No. 11/598,759.
Claims priority of application No. 2006-021728 (JP), filed on Jan. 31, 2006.
Prior Publication US 2007/0178729 A1, Aug. 02, 2007
Int. Cl. H01R 12/00 (2006.01)
U.S. Cl. 439—69  [361/772] 26 Claims
OG exemplary drawing
 
1. An electronic circuit module comprising a board and an electronic component mounted on both faces of the board, wherein
the electronic component mounted on at least one face of the board is sealed to the board with resin applied thereto with a portion thereof exposed from the resin, and
a part or a whole of the exposed portion serves as a connecting terminal to be electrically connected to an outside of the module.