US 7,320,168 B2 | ||
Method to improve heat dissipation in a magnetic shield | ||
Cherng-Chyi Han, San Jose, Calif. (US); Rod Lee, San Jose, Calif. (US); Mao-Min Chen, San Jose, Calif. (US); and Pokang Wang, San Jose, Calif. (US) | ||
Assigned to Headway Technologies, Inc., Milpitas, Calif. (US) | ||
Filed on Oct. 29, 2003, as Appl. No. 10/696,431. | ||
Prior Publication US 2005/0094319 A1, May 05, 2005 | ||
Int. Cl. G11B 5/127 (2006.01); H04R 31/00 (2006.01) |
U.S. Cl. 29—603.13 [29/603.11; 29/603.15; 29/603.16; 29/603.18; 360/235.2; 360/234.7; 360/319; 360/320] | 4 Claims |
1. A method to improve heat dissipation in a magnetic shield, comprising:
providing said shield in the form of a layer of ferromagnetic material on a substrate;
inserting a layer of non-magnetic material, having a thermal conductivity greater than about 300 W/m.K, between said shield
and said substrate; and
splitting said shield into two coplanar opposing parts separated by a gap.
|