US 7,321,166 B2 | ||
Wiring board having connecting wiring between electrode plane and connecting pad | ||
Jun Sakai, Tokyo (Japan); Hirobumi Inoue, Tokyo (Japan); and Kazuhiro Motonaga, Kanagawa (Japan) | ||
Assigned to NEC Corporation, Tokyo (Japan); and NEC Electronics Corporation, Kanagawa (Japan) | ||
Filed on Nov. 16, 2005, as Appl. No. 11/274,182. | ||
Claims priority of application No. 2004-332687 (JP), filed on Nov. 17, 2004. | ||
Prior Publication US 2006/0103004 A1, May 18, 2006 | ||
Int. Cl. H01L 23/12 (2006.01) |
U.S. Cl. 257—700 [257/750; 257/758; 257/691; 257/760; 257/748; 257/E23.001; 257/E23.005; 257/E23.194] | 19 Claims |
1. A wiring board for a semiconductor integrated circuit package, comprising:
a plurality of metal layers including a ground plane, a power supply plane, and a signal wiring layer which are stacked;
a surface layer in which an electronic device mount part is surrounded by an electrode plane, wherein the electronic device
mount part has device connecting pads arranged in an area-array form;
ground pads and power supply pads arranged on an inner side of the electronic device mount part; and
connecting wiring for connecting between the electrode plane and one of the connecting pads having a same potential as the
electrode plane wherein the electrode plane, the one of the connecting pads, and the connecting wiring are disposed on a same
layer.
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