US 7,320,772 B2 | ||
System for embossing carrier tape and method for producing carrier tape | ||
Hiroshi Otsuka, Itami (Japan) | ||
Assigned to Sumitomo Bakelite Company, Ltd., Tokyo (Japan) | ||
Appl. No. 10/492,693 PCT Filed Oct. 15, 2002, PCT No. PCT/JP02/10691 § 371(c)(1), (2), (4) Date Apr. 15, 2004, PCT Pub. No. WO03/033353, PCT Pub. Date Apr. 24, 2003. |
||
Claims priority of application No. 2001-319157 (JP), filed on Oct. 17, 2001. | ||
Prior Publication US 2004/0253333 A1, Dec. 16, 2004 | ||
Int. Cl. B29C 51/08 (2006.01); B29C 51/20 (2006.01); B29C 59/02 (2006.01) |
U.S. Cl. 264—280 [264/322; 425/112; 425/122; 425/394] | 6 Claims |
1. An apparatus for embossing a carrier tape, comprising:
a heating portion for heating a tape to a desired temperature,
a temperature-maintaining portion adapted to shield the heated tape from the outside environment and to maintain the heated
tape at the desired temperature, and
a molding portion for embossing the heated tape by heat molding,
wherein the temperature-maintaining portion is disposed between the heating portion and the molding portion and has a length
approximately corresponding to one pitch, and
wherein the heating portion comprises a heating plate having a length obtained by adding a length of one rib portion to a
length corresponding to one pitch.
|