US 7,321,163 B2 | ||
Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof | ||
Makoto Terui, Yamanashi (Japan) | ||
Assigned to Oki Electric Industry Co., Ltd., Tokyo (Japan) | ||
Filed on May 16, 2005, as Appl. No. 11/129,328. | ||
Claims priority of application No. 2004-148496 (JP), filed on May 19, 2004. | ||
Prior Publication US 2005/0258547 A1, Nov. 24, 2005 | ||
Int. Cl. H01L 23/02 (2006.01) |
U.S. Cl. 257—686 [257/777; 257/E27.137] | 17 Claims |
1. A semiconductor device comprising:
a first circuit element chip including a first surface on which a plurality of first electrodes are arranged;
a second circuit element chip, including a first surface on which a plurality of second electrodes are arranged, which is
mounted on the first circuit element chip, wherein the first surface of the first circuit element chip faces the first surface
of the second circuit element chip;
an insulating film disposed on a side surface of the second circuit element chip, and disposed between the first surfaces
of the first and second circuit element chips, wherein a gap between the first circuit element chip and the second circuit
element chip is filled with the insulating film; and
a resin layer covering the first circuit element chip, the second circuit element chip and the insulating film.
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