US 7,320,423 B2
High speed linear and rotary split-axis wire bonder
Krishnan Suresh, Madison, Wis. (US); and David T. Beatson, Kennett Square, Pa. (US)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, Pa. (US)
Filed on Nov. 17, 2003, as Appl. No. 10/715,809.
Claims priority of provisional application 60/427788, filed on Nov. 19, 2002.
Prior Publication US 2004/0129754 A1, Jul. 08, 2004
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 37/00 (2006.01); B23K 31/00 (2006.01); B23K 31/02 (2006.01)
U.S. Cl. 228—4.5  [228/180.5] 24 Claims
OG exemplary drawing
 
13. A method of operating a wire bonding system, the wire bonding system being configured to bond a wire to a workpiece, the method comprising the steps of:
(1) positioning a workpiece supported by a work table by moving the work table prior to performing a high speed wire bonding operation on the workpiece;
(2) moving a bond head of the wire bonding system in a first substantially horizontal direction during the high speed wire bonding operation wherein the high speed wire bonding operation is the process of attaching a conductive wire between bonding locations on the workpiece, the bond head supporting a bonding tool; and
(3) moving the workpiece in a second substantially horizontal direction during the high speed wire bonding operation by moving the work table with a high speed conveyance system, wherein the second substantially horizontal direction is different from the first substantially horizontal direction, and wherein the movement of the workpiece in step (3) is distinct from the positioning of the workpiece in step (1).