US 7,320,930 B2
Multi-elevation singulation of device laminates in wafer scale and substrate processing
Dean Eshleman, Streetsboro, Ohio (US)
Assigned to HANA Microdisplay Technologies, Inc., Twinsburg, Ohio (US)
Filed on Apr. 19, 2004, as Appl. No. 10/828,110.
Prior Publication US 2005/0233549 A1, Oct. 20, 2005
Int. Cl. H01L 21/46 (2006.01); H01L 29/74 (2006.01)
U.S. Cl. 438—462  [257/113] 16 Claims
OG exemplary drawing
 
1. A method of manufacturing a plurality of devices from a structure having intersecting scribe streets in which cuts are made along which to separate the structure into a plurality of devices, the method comprising the steps of:
forming a first cut in a first scribe street on the structure to a first depth which does not extend through the structure;
forming a second cut in a second scribe street which intersects the first scribe street on the structure to a second depth different than the first depth and which also does not extend through the structure;
separating the structure generally along the first cut, after forming the first cut and the second cut; and
further separating the structure generally along the second cut into a plurality of devices.