US 7,320,828 B2 | ||
Composition for forming insulating film and process for producing insulating film | ||
Kensuke Morita, Shizuoka (Japan); and Yutaka Adegawa, Shizuoka (Japan) | ||
Assigned to FUJIFILM Corporation, Tokyo (Japan) | ||
Filed on Feb. 18, 2005, as Appl. No. 11/60,544. | ||
Claims priority of application No. P.2004-041404 (JP), filed on Feb. 18, 2004. | ||
Prior Publication US 2005/0182227 A1, Aug. 18, 2005 | ||
Int. Cl. B32B 9/04 (2006.01) |
U.S. Cl. 428—447 [427/384] | 13 Claims |
1. An insulating film obtained by a process, the process comprising
using a compound represented by formula (I) as a starting material:
![]() wherein R1 to R7 each independently represents an organic group, and R1 to R7 are the same or different, wherein the using comprises:
applying a composition comprising the compound represented by formula (I) to a substrate to produce an applied composition;
and
heating the applied composition at a temperature of from 300° C. to 450° C., so as to form the insulating film.
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