US 7,321,168 B2 | ||
Semiconductor package and method for manufacturing the same | ||
Su Tao, Kaohsiung (Taiwan) | ||
Assigned to Advanced Semiconductor Engineering, Inc., Kaohsiung (Taiwan) | ||
Filed on Apr. 06, 2006, as Appl. No. 11/398,723. | ||
Prior Publication US 2006/0183313 A1, Aug. 17, 2006 | ||
Int. Cl. H01L 23/48 (2006.01) |
U.S. Cl. 257—734 | 16 Claims |
1. A semiconductor package, comprising:
a semiconductor chip having an active surface, a backside and a plurality of bonding pads disposed on the active surface;
a preformed lid covering the active surface of the semiconductor chip;
a passivation layer covering the backside of the semiconductor chip;
a plurality of solder pads disposed on a backside of the passivation layer, wherein adjacent ones of said solder pads are
separated from each other by the passivation layer which isolates the adjacent ones of said solder pads from each other;
a plurality of conductive pastes surrounding the semiconductor chip and being exposed on an outer peripheral surface of the
semiconductor package; and
a plurality of metal extension traces each extending from one of the bonding pads on the active surface of the semiconductor
chip to an upper surface of one of the conductive pastes, wherein the bonding pads are respectively electrically connected
to the solder pads on the backside of the passivation layer via the metal extension traces and the conductive pastes.
|