US 7,320,903 B2 | ||
Apparatus for and method of packaging semiconductor devices | ||
Lance Cole Wright, Van Alstyne, Tex. (US) | ||
Assigned to Texas Instruments Incorporated, Dallas, Tex. (US) | ||
Filed on Nov. 01, 2005, as Appl. No. 11/263,618. | ||
Application 11/263618 is a division of application No. 10/789645, filed on Mar. 01, 2004, granted, now 6,977,191. | ||
Application 10/789645 is a division of application No. 10/035527, filed on Dec. 29, 2001, granted, now 6,774,485. | ||
Prior Publication US 2006/0055026 A1, Mar. 16, 2006 | ||
Int. Cl. H01L 21/00 (2006.01) |
U.S. Cl. 438—123 | 4 Claims |
1. A method of packaging a BGA semiconductor device having first and second opposed surfaces both of which are generally normal
to the device's periphery, a first surface of the device carrying an array of contact balls, which comprises:
closing one end of a device-periphery-conformal aperture formed through a member to render the aperture a blind aperture;
inserting the device into the blind aperture so that the balls on the first article surface are supported at the blind end
of the aperture and its second surface is unsupported and exposed;
closing the other end of the aperture to render the aperture a closed aperture; and
manipulating the member and thereafter opening the one end of the closed aperture with the second surface of the device supported
to expose the first device surface with the balls thereon.
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