US 7,320,772 B2
System for embossing carrier tape and method for producing carrier tape
Hiroshi Otsuka, Itami (Japan)
Assigned to Sumitomo Bakelite Company, Ltd., Tokyo (Japan)
Appl. No. 10/492,693
PCT Filed Oct. 15, 2002, PCT No. PCT/JP02/10691
§ 371(c)(1), (2), (4) Date Apr. 15, 2004,
PCT Pub. No. WO03/033353, PCT Pub. Date Apr. 24, 2003.
Claims priority of application No. 2001-319157 (JP), filed on Oct. 17, 2001.
Prior Publication US 2004/0253333 A1, Dec. 16, 2004
Int. Cl. B29C 51/08 (2006.01); B29C 51/20 (2006.01); B29C 59/02 (2006.01)
U.S. Cl. 264—280  [264/322; 425/112; 425/122; 425/394] 6 Claims
OG exemplary drawing
 
1. An apparatus for embossing a carrier tape, comprising:
a heating portion for heating a tape to a desired temperature,
a temperature-maintaining portion adapted to shield the heated tape from the outside environment and to maintain the heated tape at the desired temperature, and
a molding portion for embossing the heated tape by heat molding,
wherein the temperature-maintaining portion is disposed between the heating portion and the molding portion and has a length approximately corresponding to one pitch, and
wherein the heating portion comprises a heating plate having a length obtained by adding a length of one rib portion to a length corresponding to one pitch.