US 7,320,602 B2 | ||
Substrate structure, substrate manufacturing method and electronic device | ||
Tokihiko Mori, Kunitachi (Japan); and Sadao Makita, Hanno (Japan) | ||
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
Filed on Dec. 07, 2006, as Appl. No. 11/635,224. | ||
Claims priority of application No. 2005-369480 (JP), filed on Dec. 22, 2005. | ||
Prior Publication US 2007/0149025 A1, Jun. 28, 2007 | ||
Int. Cl. H01R 12/00 (2006.01) |
U.S. Cl. 439—66 [439/331] | 11 Claims |
1. A substrate structure, comprising:
a printed-wiring board;
a micro-contact sheet soldered to the printed-wiring board, and including a spiral terminal on a first surface thereof and
a pad on a second surface thereof, the pad being electrically connected to the spiral terminal; and
a holding jig which presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact
sheet contacts with the printed-wiring board.
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