US 7,320,902 B2 | ||
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument | ||
Nobuaki Hashimoto, Suwa (Japan) | ||
Assigned to Seiko Epson Corporation, Tokyo (Japan) | ||
Filed on Mar. 01, 2004, as Appl. No. 10/788,447. | ||
Claims priority of application No. 2003-068281 (JP), filed on Mar. 13, 2003. | ||
Prior Publication US 2004/0229418 A1, Nov. 18, 2004 | ||
Int. Cl. H01L 21/00 (2006.01) |
U.S. Cl. 438—118 [438/119; 257/687; 257/782; 257/783; 257/784] | 4 Claims |
1. A method of manufacturing an electronic device, the method comprising:
forming an external terminal on an interconnect pattern formed on a substrate;
subsequently mounting a chip component above the substrate face up with an adhesive disposed between the substrate and the
chip component, the chip component having an electrode on a first surface of the chip component opposite to a second surface
facing the substrate;
forming an insulating section adjacent to the chip component by applying a force between the substrate and the chip component
so that a portion of the adhesive is pressed out to a region adjacent to the chip component, the portion having a top higher
from the substrate than the first surface, the insulating section formed of the portion of the adhesive; and
forming by inkjet an interconnect on the insulating section from the electrode to the interconnect pattern for electrically
connecting the electrode and the interconnect pattern at a temperature lower than a melting point of the external terminal.
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