US 7,320,331 B1 | ||
In-situ plasma cleaning device for cylindrical surfaces | ||
Michael J. Audino, Albany, N.Y. (US); Michael Cipollo, East Greenbush, N.Y. (US); David Glocker, West Henrietta, N.Y. (US); Kevin Miner, Castleton, N.Y. (US); and Patrick Vottis, Schnectady, N.Y. (US) | ||
Assigned to United States of America as represented by the Secrertary of the Army, Washington, D.C. (US) | ||
Filed on Sep. 30, 2003, as Appl. No. 10/605,432. | ||
Int. Cl. C23C 14/34 (2006.01); B08B 3/00 (2006.01) |
U.S. Cl. 134—166R [134/1; 134/1.1; 134/104.2; 134/122 R; 156/345.42; 156/345.46; 156/345.49; 204/298.21; 204/298.22; 204/298.31; 204/298.37] | 1 Claim |
1. An in-situ plasma cleaning device for performing an atomic surface cleaning process to remove contaminants, comprising:
a cleaning assembly;
a magnetic field generator, located within the cleaning assembly, that generates a generally axially directed magnetic field
to provide a plasma for cleaning a surface within the cleaning assembly;
wherein the cleaning assembly comprises a collector shield disposed opposite to the surface to be cleaned for collecting the
contaminants and by-product material, wherein the cleaning assembly traverses the length of a target cylindrical surface and
a substrate cylindrical surface during a cleaning process.
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