US 7,320,593 B2
Light emitting diode light source for curing dental composites
Calvin D. Ostler, Riverton, Utah (US); Kevin D. Ostler, South Jordan, Utah (US); Bruce R. Walker, West Jordan, Utah (US); Marc C. Cimolino, Snohomish, Wash. (US); and Miles F. Elledge, Kirkland, Wash. (US)
Assigned to TIR Systems Ltd., Burnaby, British Columbia (Canada)
Filed on Mar. 07, 2001, as Appl. No. 9/801,351.
Claims priority of provisional application 60/187899, filed on Mar. 08, 2000.
Prior Publication US 2001/0046652 A1, Nov. 29, 2001
Int. Cl. A61C 3/00 (2006.01)
U.S. Cl. 433—29  [362/119] 20 Claims
OG exemplary drawing
 
1. An apparatus configured as a light emitting diode dental curing light source for curing composite materials, said apparatus comprising:
a) a plurality of light emitting diodes being capable of emitting light when supplied with adequate electrical current, each of the plurality of light emitting diodes having a bottom surface configured as a heat transfer surface;
b) a first substrate portion upon which the bottom surface of each of said plurality of light emitting diodes are mounted, said first substrate portion being electrically conductive and thermally conductive;
c) a second substrate portion thermally connected to the first substrate portion, said second substrate portion being thermally conductive and electrically insulating;
d) a heat pipe capable of transferring heat from one location to another, said heat pipe having a first end portion and a second end portion, said first end portion being thermally connected to the second substrate portion;
e) a heat sink constructed of a material capable of dissipating heat into a heat dissipation environment, said heat sink being thermally coupled to the second end portion of the heat pipe; and
f) control circuitry capable of controlling electrical current transmission to said plurality of light emitting diodes in order to control light production by said plurality of light emitting diodes; wherein heat generated by the plurality of light emitting diodes is transmitted to the heat sink via the first substrate portion, the second substrate portion and the heat pipe.