US 7,320,847 B2
Alternate side lithographic substrate imaging
Keith Frank Best, Prunedale, Calif. (US); Joseph J. Consolini, Costa Mesa, Calif. (US); and Alexander Friz, San Jose, Calif. (US)
Assigned to ASML Netherlands B.V., Veldhoven (Netherlands)
Filed on Nov. 12, 2003, as Appl. No. 10/705,218.
Claims priority of application No. 02257846 (EP), filed on Nov. 13, 2002.
Prior Publication US 2004/0142256 A1, Jul. 22, 2004
Int. Cl. G03F 9/00 (2006.01)
U.S. Cl. 430—22  [430/313; 430/311] 26 Claims
 
1. A device manufacturing method comprising:
providing a first substrate having a first and second surface on a first and second side thereof, respectively;
patterning said first surface of said first substrate with normal alignment markers and at least one reversed alignment marker that is a mirror image of at least one of the normal alignment markers;
providing a protective layer over said at least one reversed alignment marker;
bonding said first substrate to a second substrate with said first side of said first substrate facing said second substrate;
locally etching said first substrate as far as said protective layer to form a trench substantially devoided of material around said at least one reversed alignment marker; and
forming at least one patterned layer on said second surface of said first substrate using a lithographic projection apparatus having an alignment system configured to align said second surface using the at least one reversed alignment marker(s) revealed by each trench.