US 7,320,867 B2 | ||
Linker compound, ligand, and producing method thereof | ||
Yasuo Suda, Kagoshima (Japan); Akio Arano, Nagoya (Japan); Shoichi Kusumoto, Minoo (Japan); and Michael Sobel, Seattle, Wash. (US) | ||
Assigned to Japan Science and Technology Agency, Saitama (Japan); and National University Corporation Kagoshima University, Kagoshima (Japan) | ||
Appl. No. 10/526,775 PCT Filed Sep. 08, 2003, PCT No. PCT/JP03/11417 § 371(c)(1), (2), (4) Date Mar. 08, 2005, PCT Pub. No. WO2004/022583, PCT Pub. Date Mar. 18, 2004. |
||
Claims priority of application No. 2002-263412 (JP), filed on Sep. 09, 2000; and application No. 2003-190568 (JP), filed on Jul. 02, 2003. | ||
Prior Publication US 2006/0030699 A1, Feb. 09, 2006 | ||
This patent is subject to a terminal disclaimer. | ||
Int. Cl. G01N 33/53 (2006.01); G01N 33/532 (2006.01); C12P 7/58 (2006.01); C07K 1/13 (2006.01) |
U.S. Cl. 435—7.1 [435/7.92; 435/137; 435/961; 435/287.2; 435/970; 530/402; 530/404; 530/411; 436/544] | 25 Claims |
1. A linker compound comprising:
a structure represented by following general formula (1):
![]() where n is an integer of 1 to 6, and
X has a structure represented by the following general formula (2):
![]() where m1, m2 and m3 are independently an integer of 1 to 6.
|