US 7,321,457 B2 | ||
Process and structure for fabrication of MEMS device having isolated edge posts | ||
David Heald, Solvang, Calif. (US) | ||
Assigned to QUALCOMM Incorporated, San Diego, Calif. (US) | ||
Filed on Jun. 01, 2006, as Appl. No. 11/445,607. | ||
Prior Publication US 2007/0279730 A1, Dec. 06, 2007 | ||
Int. Cl. G02B 26/00 (2006.01); G02B 26/08 (2006.01) |
U.S. Cl. 359—291 [359/224] | 26 Claims |
1. A method of fabricating a microelectromechanical systems (MEMS) device, comprising:
forming an electrode layer over a substrate;
depositing a sacrificial layer over the electrode layer;
forming a plurality of support structures, said support structures extending through the sacrificial layer, wherein at least
some of said plurality of support structures comprise edge support structures;
depositing a mechanical layer over the plurality of support structures;
patterning the mechanical layer to form strips, wherein said strips are separated by gaps, and wherein said gaps are located
over a central portion of each of said edge support structures; and
after forming the plurality of support structures, etching a portion of each of said edge support structures underlying the
gaps, thereby forming isolated edge support structures.
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