US 7,320,930 B2 | ||
Multi-elevation singulation of device laminates in wafer scale and substrate processing | ||
Dean Eshleman, Streetsboro, Ohio (US) | ||
Assigned to HANA Microdisplay Technologies, Inc., Twinsburg, Ohio (US) | ||
Filed on Apr. 19, 2004, as Appl. No. 10/828,110. | ||
Prior Publication US 2005/0233549 A1, Oct. 20, 2005 | ||
Int. Cl. H01L 21/46 (2006.01); H01L 29/74 (2006.01) |
U.S. Cl. 438—462 [257/113] | 16 Claims |
1. A method of manufacturing a plurality of devices from a structure having intersecting scribe streets in which cuts are
made along which to separate the structure into a plurality of devices, the method comprising the steps of:
forming a first cut in a first scribe street on the structure to a first depth which does not extend through the structure;
forming a second cut in a second scribe street which intersects the first scribe street on the structure to a second depth
different than the first depth and which also does not extend through the structure;
separating the structure generally along the first cut, after forming the first cut and the second cut; and
further separating the structure generally along the second cut into a plurality of devices.
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