US 7,320,426 B2 | ||
Cover for ball-grid array connector | ||
Thomas L. Shue, Red Lion, Pa. (US); and Matthew S. Emenheiser, Mount Wolf, Pa. (US) | ||
Assigned to FCI Americas Technology, Inc., Reno, Nev. (US) | ||
Filed on Mar. 09, 2005, as Appl. No. 11/75,457. | ||
Application 11/075457 is a division of application No. 10/340279, filed on Jan. 10, 2003, granted, now 6,900,389. | ||
Prior Publication US 2005/0159032 A1, Jul. 21, 2005 | ||
Int. Cl. B23K 30/02 (2006.01) |
U.S. Cl. 228—234.1 [228/59; 439/135] | 12 Claims |
7. A method for mounting a first and a second ball-grid array connector on a circuit substrate, comprising:
positioning the first ball-grid array connector on the circuit substrate;
flowing heated gas over the first ball-grid array connector while a cover mated to the first ball-grid array connector is
in an open position that permits the heated gas to enter a housing of the first ball-grid array connector;
positioning the second ball-grid array connector on the substrate; and
flowing heated gas over the first and second ball-grid array connectors while the cover is in a closed position that substantially
prevents the heated gas from entering the housing of the first ball-grid array connector.
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