US 7,320,940 B2
Method for manufacturing electronic device including package
Tomohito Kunda, Okazaki (Japan); and Tsukasa Fukurai, Kisarazu (Japan)
Assigned to DENSO CORPORATION, Kariya (Japan); and Yoshikawa Kogyo Co., Ltd., Fukuoka-pref. (Japan)
Filed on Sep. 16, 2004, as Appl. No. 10/941,929.
Claims priority of application No. 2003-331718 (JP), filed on Sep. 24, 2003.
Prior Publication US 2005/0062067 A1, Mar. 24, 2005
Int. Cl. H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/00 (2006.01)
U.S. Cl. 438—692  [438/125; 257/E21.5; 257/E21.51; 257/E21.511] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic device including a package, comprising:
plating a lid of the package such that a plating film is formed on a surface of the lid;
removing burrs on the plating film on the lid surface by chemical polishing;
inserting the electronic component in a package body through an opening thereof located on one of sides thereof; and
attaching the lid to the package body.