US 7,320,425 B2 | ||
Low-profile capillary for wire bonding | ||
James E. Eder, Doylestown, Pa. (US); and Jon Brunner, Sellersville, Pa. (US) | ||
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, Pa. (US) | ||
Filed on May 05, 2005, as Appl. No. 11/122,939. | ||
Claims priority of provisional application 60/570341, filed on May 12, 2004. | ||
Prior Publication US 2005/0252950 A1, Nov. 17, 2005 | ||
Int. Cl. B23K 37/00 (2006.01); B23K 1/06 (2006.01) |
U.S. Cl. 228—4.5 [228/1.1; 228/110.1; 228/180.5] | 8 Claims |
1. A wire bonding tool comprising:
a first cylindrical portion having a first outside cylindrical diameter, the first cylindrical portion being configured to
be engaged with a transducer of a wire bonding machine such that the length of the first cylindrical portion does not extend
below the transducer during engagement with the transducer;
a second cylindrical portion adjacent the first cylindrical portion, the second cylindrical portion having a second outside
cylindrical diameter, the second outside cylindrical diameter being less than the first outside cylindrical diameter; and
a tapered portion adjacent the second cylindrical portion, the tapered portion having a third outside diameter at an end adjacent
the second cylindrical portion, the third outside diameter being less than the first outside cylindrical diameter;
wherein a tip of an EFO wand is configured to be positioned directly adjacent (1) the second cylindrical portion and (2) a
lower end of the transducer during a wire bonding operation.
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