US 7,320,817 B2 | ||
Holding structure and a molding with the same | ||
Wakana Kotani, Kariya (Japan); Masahiro Kimura, Chiryu (Japan); Katsuyoshi Shirai, Anjyo (Japan); and Eiichiro Iwase, Toyoake (Japan) | ||
Assigned to Aisin Seiki Kabushiki Kaisha, Kariya-Shi, Aichi-Ken (Japan) | ||
Filed on May 28, 2004, as Appl. No. 10/855,739. | ||
Claims priority of application No. 2003-153364 (JP), filed on May 29, 2003; and application No. 2004-151945 (JP), filed on May 21, 2004. | ||
Prior Publication US 2004/0241358 A1, Dec. 02, 2004 | ||
Int. Cl. B29D 22/00 (2006.01); H01F 27/02 (2006.01); G01B 7/14 (2006.01); G01R 33/02 (2006.01); H01L 23/28 (2006.01) |
U.S. Cl. 428—34.1 [428/68; 336/96; 324/207.16; 324/207.17; 324/244; 174/521] | 13 Claims |
1. A holding structure of a magnetic sensing member comprising:
a case possessing a base surface and a predetermined inner surface facing the base surface, the base surface being in contact
with the magnetic sensing member;
a convex portion provided at the predetermined inner surface of the case and holding the magnetic sensing member relative
to the base surface, the convex portion defining a guiding space between the magnetic sensing member and the predetermined
inner surface of the case during insertion of the magnetic sensing member into the case;
wherein a primary molding resin is guided into the guiding space upon injection of the primary molding resin into the case
while the magnetic sensing member is in contact with the base surface such that the magnetic sensing member is held in the
case.
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