US 7,320,867 B2
Linker compound, ligand, and producing method thereof
Yasuo Suda, Kagoshima (Japan); Akio Arano, Nagoya (Japan); Shoichi Kusumoto, Minoo (Japan); and Michael Sobel, Seattle, Wash. (US)
Assigned to Japan Science and Technology Agency, Saitama (Japan); and National University Corporation Kagoshima University, Kagoshima (Japan)
Appl. No. 10/526,775
PCT Filed Sep. 08, 2003, PCT No. PCT/JP03/11417
§ 371(c)(1), (2), (4) Date Mar. 08, 2005,
PCT Pub. No. WO2004/022583, PCT Pub. Date Mar. 18, 2004.
Claims priority of application No. 2002-263412 (JP), filed on Sep. 09, 2000; and application No. 2003-190568 (JP), filed on Jul. 02, 2003.
Prior Publication US 2006/0030699 A1, Feb. 09, 2006
This patent is subject to a terminal disclaimer.
Int. Cl. G01N 33/53 (2006.01); G01N 33/532 (2006.01); C12P 7/58 (2006.01); C07K 1/13 (2006.01)
U.S. Cl. 435—7.1  [435/7.92; 435/137; 435/961; 435/287.2; 435/970; 530/402; 530/404; 530/411; 436/544] 25 Claims
 
1. A linker compound comprising:
a structure represented by following general formula (1):

OG Complex Work Unit Drawing
where n is an integer of 1 to 6, and
X has a structure represented by the following general formula (2):

OG Complex Work Unit Drawing
where m1, m2 and m3 are independently an integer of 1 to 6.