US 7,321,215 B1 | ||
Wireless 3D auto-offset system for robot arms | ||
Sheng-Hua Yang, Hsinchu (Taiwan); and Chia-Feng Liang, Taichung County (Taiwan) | ||
Assigned to Powerchip Semiconductor Corp., Hsin-Chu (Taiwan) | ||
Filed on Aug. 09, 2006, as Appl. No. 11/500,901. | ||
Int. Cl. B25J 19/04 (2006.01) |
U.S. Cl. 318—568.16 [318/568.21; 901/30; 901/47] | 7 Claims |
1. A wireless 3D auto-offset system for robot arms, comprising:
a wireless 3D offset monitoring sensor, comprising
an electronic tilt detector comprising an arcuate body, the interior thereof filled with liquid material and having a bubble;
and
a sensor, sensing positions of the bubble; and
a corrector, retrieving and displaying the bubble positions using the sensor on a screen thereof, determining whether a process
apparatus is horizontally located according to a predefined standard range, and, if not, calculating an offset value of the
process apparatus.
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