US 7,320,830 B2 | ||
Flame-retardant heat-resistant resin composition and adhesive film comprising the same | ||
Toshihiko Itou, Ibaraki (Japan); Masaru Tanaka, Yuki (Japan); and Shigehiro Nakamura, Ibaraki (Japan) | ||
Assigned to Hitachi Chemical Co., Ltd., Tokyo (Japan) | ||
Appl. No. 10/488,687 PCT Filed Sep. 02, 2002, PCT No. PCT/JP02/08875 § 371(c)(1), (2), (4) Date Sep. 27, 2004, PCT Pub. No. WO03/022929, PCT Pub. Date Mar. 20, 2003. |
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Claims priority of application No. 2001-269141 (JP), filed on Sep. 05, 2001; and application No. 2002-137309 (JP), filed on May 13, 2002. | ||
Prior Publication US 2005/0054776 A1, Mar. 10, 2005 | ||
Int. Cl. B32B 27/34 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 77/10 (2006.01); C08L 79/08 (2006.01) |
U.S. Cl. 428—473.5 [428/355 EP; 428/413; 428/474.4; 523/451; 525/423; 525/533] | 24 Claims |
1. A non-flammable heat-resistant resin composition, comprising:
(A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphorus-based compound,
wherein a cured film, obtained from the non-flammable heat-resistant resin composition, exerts a storage elastic modulus of
700 MPa or less, a coefficient of thermal expansion of 5×10−3/K or less and an internal stress of 20 MPa or less, in a temperature range of 25 to 250° C., and
wherein the (A) modified polyamideimide resin is a modified polyamideimide resin that is obtained by allowing a mixture containing
diimide dicarboxylic acid, represented by the following formula 1, formula 2 and formula 3 obtained through a reaction between
a mixture of diamine having three or more aromatic rings, polyoxypropylene diamine and siloxane diamine, and trimellitic anhydride;
![]() ![]() ![]() ![]() ![]() ![]() ![]() HOOC —R10—COOH (Formula 4)
[in the formula, R10 represents:
![]() NCO —R11—NCO (Formula 5)
[in the formula, R11 represents:
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