US 7,321,491 B2 | ||
Heat sink for a portable computer | ||
Jun Long, Guangdong (China); Yong Zhong, Guangdong (China); Tao Li, Guangdong (China); and Wan-Lin Xia, Guangdong (China) | ||
Assigned to Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Longhua Town, Bao'an District, Shenzhen, Guangdong Province (US); and Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
Filed on Mar. 15, 2006, as Appl. No. 11/308,273. | ||
Prior Publication US 2007/0217150 A1, Sep. 20, 2007 | ||
Int. Cl. H05K 7/20 (2006.01); F28D 15/00 (2006.01); H01B 7/42 (2006.01) |
U.S. Cl. 361—687 [361/700; 361/702; 361/704; 361/709; 361/756; 165/80.5; 165/104.33; 174/15.2] | 14 Claims |
1. A heat sink attached to an extensible interface of a portable computer, comprising:
a conducting plate inserted in the extensible interface of the portable computer;
a plurality of fins located at an external space of the portable computer; and
a heat pipe thermally connecting the conducting plate and the fins;
wherein the heat pipe is L-shaped, and comprises an evaporating portion soldered to the conducting plate and a condensing
portion extending through the fins; and
wherein the conducting plate defines a slot for receiving the evaporating portion of the heat pipe therein.
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