US 7,321,455 B2
Microelectronic devices and methods for packaging microelectronic devices
Larry D. Kinsman, Kuna, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on Jul. 22, 2005, as Appl. No. 11/187,105.
Application 11/187105 is a continuation of application No. 10/665912, filed on Sep. 18, 2003, granted, now 6,934,065.
Prior Publication US 2005/0255628 A1, Nov. 17, 2005
Int. Cl. G02F 1/03 (2006.01); H01L 31/203 (2006.01); H01L 23/34 (2006.01); H01L 21/00 (2006.01); H01L 27/00 (2006.01); H01L 27/15 (2006.01)
U.S. Cl. 359—245  [438/57; 438/64; 438/66; 257/79; 257/432; 257/433; 257/434; 257/723; 250/208.1; 348/294] 25 Claims
OG exemplary drawing
 
11. A plurality of microelectronic imaging units, comprising:
a support member having a plurality of terminal arrays;
a plurality of imaging dies attached to the support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
a plurality of wire-bonds having a proximal portion coupled to one of the external contacts and a distal portion coupled to a corresponding terminal;
a footing on the support member encapsulating the distal portion of the individual wire-bonds;
a plurality of covers positioned over corresponding image sensors; and
an adhesive attaching the covers to the footing and/or corresponding imaging dies.