US 7,321,160 B2
Multi-part lead frame
S. Derek Hinkle, Boise, Id. (US); Jerry M. Brooks, Caldwell, Id. (US); and David J. Corisis, Meridian, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on May 25, 2005, as Appl. No. 11/137,034.
Application 11/137034 is a continuation of application No. 10/443468, filed on May 22, 2003, granted, now 6,946,722, filed on Sep. 20, 2005.
Application 10/443468 is a continuation of application No. 09/441524, filed on Nov. 16, 1999, granted, now 6,570,244, filed on May 27, 2003.
Application 09/441524 is a continuation of application No. 08/738308, filed on Oct. 25, 1996, granted, now 6,072,228, filed on Jun. 06, 2000.
Prior Publication US 2005/0224928 A1, Oct. 13, 2005
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/495 (2006.01); H01L 23/48 (2006.01)
U.S. Cl. 257—666  [257/E23.042; 257/676; 257/667; 257/698; 257/784; 257/786] 6 Claims
OG exemplary drawing
 
1. A multi-part, multi-level lead frame having a portion for electrical connection to and for supporting a semiconductor device comprising:
a die paddle substantially formed of a first material for supporting a semiconductor device on a portion thereof; and
a lead frame substantially formed of a second material different than the first material of the lead frame, the lead frame including at least two carriers and a plurality of leads for electrical connection to a semiconductor device, at least one lead of the plurality of leads including one type of a lead type that extends over a semiconductor device attached to the die paddle, of a lead type that does not extend over the semiconductor device attached to the die paddle, of a lead type that overlaps the die paddle, or a lead type that terminates adjacent the die paddle.