US 7,321,681 B2
Bonding pattern discrimination program
Satoshi Enokido, Hachioji (Japan)
Assigned to Kabushiki Kaisha Shinkawa, Tokyo (Japan)
Filed on Oct. 16, 2006, as Appl. No. 11/582,585.
Application 11/582585 is a division of application No. 10/959241, filed on Oct. 06, 2004, granted, now 7,224,829.
Claims priority of application No. 2003-348887 (JP), filed on Oct. 07, 2003.
Prior Publication US 2007/0036423 A1, Feb. 15, 2007
Int. Cl. G06K 9/00 (2006.01)
U.S. Cl. 382—145  [156/351; 156/358; 228/103; 324/765; 382/218; 382/294] 1 Claim
OG exemplary drawing
 
1. A computer readable medium storing a bonding pattern discrimination program in bonding, said program comprising:
a reference-image acquisition process that makes an image of positioning pattern for a reference chip that serves as a reference for discriminating an inclination of said positioning pattern and obtains said image as a reference-image;
a reference conversion origin specifying process that specifies a conversion origin that is used for a polar coordinate conversion of the reference-image;
a reference-image conversion process that performs a polar coordinate conversion on the reference-image by way of using a specified reference conversion origin, thus producing a post-conversion reference-image;
an object-image acquisition process that makes an image of the positioning pattern for a chip that is an object of bonding and acquires said image as an object-image;
a positional-relationship calculation process that moves the positioning pattern of the reference-image and the positioning pattern of the object-image in relative terms so that both images are superimposed, so that a relative positional-relationship between the positioning pattern of the reference chip and the positioning pattern of the bonding object chip is calculated from an amount of said movement;
an object conversion origin specifying process that specifies an origin that is used in order to subject the object-image to a polar coordinate conversion based upon the calculated relative positional-relationship by a positional-relationship that is the same as the positional-relationship between the positioning pattern and the reference conversion origin in the reference-image;
an object-image conversion process that performs a polar coordinate conversion on the object-image by way of using a specified object conversion origin, thus producing a post-conversional object-image; and
an inclination-angle calculation process that moves both post-conversion images in relative terms on an angular axis so that a positioning pattern developed in polar coordinates in the post-conversion object-image and the positioning pattern developed in polar coordinates in the post-conversion reference-image are superimposed, so that the relative inclination-angle between the positioning pattern of the reference chip and the positioning pattern of the bonding object chip is calculated from the amount of a movement angle;
wherein said reference conversion origin specifying process is comprised of:
a rotated image acquisition process that acquires a rotated image produced by rotating the reference-image through a specified angle, and
a pattern matching process that performs pattern matching by causing relative movement of the reference-image and rotated image so that the positioning pattern of the reference-image and the positioning pattern of the rotated image are superimposed; and
a reference conversion origin, which is such that an error in a relative positional-relationship between two positioning patterns detected by pattern matching of an image that is an object of comparison obtained by imaging-positioning patterns disposed in an attitude that includes positional deviation in a direction of rotation, and a reference-image obtained by imaging-positioning patterns containing no positional deviation in the direction of rotation shows a minimal value, is specified based upon results of said pattern matching.