US 7,321,805 B2 | ||
Production managing system of semiconductor device | ||
Keizo Yamada, Tokyo (Japan); Yousuke Itagaki, Tokyo (Japan); Takeo Ushiki, Tokyo (Japan); and Tohru Tsujide, Tokyo (Japan) | ||
Assigned to Fab Solutions, Inc., Kanagawa (Japan) | ||
Filed on Dec. 06, 2004, as Appl. No. 11/5,330. | ||
Application 11/005330 is a continuation of application No. 10/790276, filed on Mar. 01, 2004, granted, now 6,842,663. | ||
Application 10/790276 is a continuation of application No. 10/082247, filed on Feb. 26, 2002, granted, now 6,711,453. | ||
Claims priority of application No. 2001-056953 (JP), filed on Mar. 01, 2001. | ||
Prior Publication US 2005/0106803 A1, May 19, 2005 | ||
This patent is subject to a terminal disclaimer. | ||
Int. Cl. G06F 19/00 (2006.01) |
U.S. Cl. 700—121 | 38 Claims |
1. A system for managing the production of semiconductor devices, the system comprising:
a plurality of production devices to perform production processes for fabricating semiconductor devices;
a plurality of in-line measuring devices to measure at least one process parameter of each production process performed by
the production devices and to output the process parameter as measured data, wherein:
at least one in-line measuring device of the plurality of in-line measuring devices is associated with one of the plurality
of production devices such that the in-line measuring device measures a process parameter of the process performed by the
associated production device, and
at least one in-line measuring device is a wafer current measuring device that: (a) irradiates holes, formed in a semiconductor
wafer or disposed in a layer which is disposed on or above a semiconductor wafer, with electron beam and (b) measures a substrate
current in or flowing through the wafer, wherein the substrate current is generated in response to the irradiated electron
beam; and
a data storage device to store: (i) data which is indicative of the production processes performed by the production devices,
(ii) the measured data or data representative thereof, (iii) specifications of the production processes that are associated
with the measured data, (iv) data of the start of production of the semiconductor devices, (v) data of the scheduled date
on which each production process is performed by the production devices, and (vi) data of the date of completion of each production
process performed by the production devices.
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