US 7,321,494 B2 | ||
Graphics card apparatus with improved heat dissipating mechanisms | ||
Tai-Sheng (Andrew) Han, Fullerton, Calif. (US) | ||
Assigned to EVGA Corporation, Brea, Calif. (US) | ||
Filed on Dec. 14, 2005, as Appl. No. 11/304,457. | ||
Prior Publication US 2007/0133179 A1, Jun. 14, 2007 | ||
Int. Cl. H05K 7/20 (2006.01) |
U.S. Cl. 361—719 [361/695; 361/699; 361/700; 165/80.3; 165/80.4; 165/185] | 18 Claims |
1. A graphics card apparatus with improved heat dissipation, comprising:
a metal block thermally coupled to one or more electronic components of said graphics card apparatus and including a tubing
forming a tortuous passage for fluid therewithin, said tubing having an inlet end and an exit end;
a radiator including a pipe having an inlet end and an exit end and baffles thermally coupled to said pipe, the inlet end
of said pipe being connected to the exit end of said tubing;
a pump having first and second ports respectively connected to the inlet end of said tubing and the exit end of said pipe,
said pump being operative to circulate coolant through said pipe and said tubing and thereby to transfer thermal energy from
said metal block to said radiator;
a fan for generating an air flow and a carrier for said fan; and
an enclosure surrounding said radiator and metal block, and forming an air passage from said fan to said metal block and thence
to said radiator, said enclosure including a generally planar cover plate and a flow director that includes two generally
elongated strips and is positioned beneath said cover plate;
whereby thermal energy generated by the electronic components is transferred to said metal block and thence to said radiator
via said coolant and is ultimately removed from said radiator by an air flow drawn into said air passage.
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