US 7,321,099 B2
Component mounting substrate and structure
Kinuko Mishiro, Kawasaki (Japan)
Assigned to Fujitsu Limited, Kawasaki (Japan)
Filed on Aug. 19, 2004, as Appl. No. 10/921,196.
Claims priority of application No. 2004-114985 (JP), filed on Apr. 09, 2004.
Prior Publication US 2005/0224252 A1, Oct. 13, 2005
Int. Cl. H05K 1/16 (2006.01)
U.S. Cl. 174—260  [174/262] 8 Claims
OG exemplary drawing
 
1. A substrate for mounting thereon a component having one or more solder joints, via which the component is adapted to be connected to the substrate, said substrate comprising:
a substrate body with a depressed part thereof formed within said substrate body on a component side thereof, on which side one or more electrodes are provided to come into close contact with the solder joints;
a filling made of a filling material with rigidity different from that of a material making up said substrate body, said filling being filled into the depressed part so as to be flush or almost flush with a surface of the substrate facing the component, wherein said filling is free of a bonding material to bond the substrate body to the component;
wherein said depressed part has a bottom surface comprised of said substrate body; and
wherein at least a portion of said depressed part does not directly underlie the component.