US 7,320,250 B2
Pressure sensing element and sensor incorporating the same
Masato Ueno, Anjo (Japan)
Assigned to DENSO CORPORATION, Kariya (Japan)
Filed on Jan. 19, 2006, as Appl. No. 11/334,461.
Claims priority of application No. 2005-038893 (JP), filed on Feb. 16, 2005.
Prior Publication US 2006/0179953 A1, Aug. 17, 2006
Int. Cl. G01L 9/00 (2006.01)
U.S. Cl. 73—754  [73/715; 73/753] 30 Claims
OG exemplary drawing
 
1. A sensing element comprising:
a substrate having a stress-accepting portion and a joint portion; and
a structure formed between the stress-accepting portion and the joint portion for restraining stress in the substrate, wherein
the stress-accepting portion includes a diaphragm and a thick part, the thick part being disposed on a periphery of the diaphragm, and the structure being disposed in the thick part,
the structure comprises a groove formed in a surface of the substrate where the joint portion is located, and
the joint portion surrounds the stress-accepting portion, and the groove is located between the joint portion and the stress-accepting portion to surround the stress-accepting portion.