US 7,321,257 B2 | ||
Semiconductor device capable of detecting an open bonding wire using weak current | ||
Isao Yamamoto, Kyoto (Japan); and Koichi Miyanaga, Kyoto (Japan) | ||
Assigned to Rohm Co., Ltd., (Japan) | ||
Filed on Sep. 01, 2004, as Appl. No. 10/931,445. | ||
Claims priority of application No. 2003-322295 (JP), filed on Sep. 12, 2003. | ||
Prior Publication US 2005/0057301 A1, Mar. 17, 2005 | ||
Int. Cl. G05F 1/10 (2006.01); G05F 3/02 (2006.01) |
U.S. Cl. 327—540 [327/541; 327/564; 327/565; 323/316] | 4 Claims |
3. A semiconductor device comprising:
an input terminal to which a power supply voltage is applied;
a regulator circuit formed on an IC chip for generating a desired voltage from the power supply voltage; and
an output terminal for outputting the desired voltage thus generated, wherein
the IC chip includes:
a plurality of IC chip pads connected to either the input terminal or the output terminal by bonding wires;
a plurality of signal lines each having one end thereof connected to one of the IC chip pads and the other end connected to
the regulator circuit; and
a diode having one end thereof connected to one of the plurality of signal lines and the other end connected to another one
of the plurality of signal lines.
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