US 7,320,899 B2
Micro-displays and their manufacture
Charles C Haluzak, Corvallis, Oreg. (US); Kenneth Faase, Corvallis, Oreg. (US); John R Sterner, Albany, Oreg. (US); Chien-Hua Chen, Corvallis, Oreg. (US); Kirby Sand, Corvallis, Oreg. (US); Bao-Sung Bruce Yeh, Corvallis, Oreg. (US); and Michael J. Regan, Corvallis, Oreg. (US)
Assigned to Hewlett-Packard Development Company, L.P., Houston, Tex. (US)
Filed on Oct. 29, 2004, as Appl. No. 10/977,278.
Claims priority of provisional application 60/621176, filed on Oct. 21, 2004.
Prior Publication US 2006/0094143 A1, May 04, 2006
Int. Cl. H01L 21/00 (2006.01); G02B 26/08 (2006.01)
U.S. Cl. 438—31  [257/432; 257/E21.499; 359/223] 23 Claims
OG exemplary drawing
 
1. A method of forming a micro-display, comprising:
forming a device, wherein forming the device comprises:
forming a partially reflecting layer on a cover of the micro-display, the cover being transparent to visible light, wherein the partially reflecting layer forms a first capacitor plate of the device;
forming a first sacrificial layer overlying and in direct contact with the partially reflecting layer;
forming a reflective second capacitor plate overlying and in direct contact with the first sacrificial layer so that the first sacrificial layer is interposed between the second capacitor plate and the partially reflecting layer;
forming a second sacrificial layer overlying and in direct contact with the second capacitor plate;
removing the first sacrificial layer to form a first portion of a gap that is interposed between the partially reflecting layer and the second capacitor plate; and
removing the second sacrificial layer to form a second portion of the gap overlying the second capacitor plate; and
adhering the device to a second substrate.