US 7,320,664 B2
Reducing discomfort caused by electrical stimulation
Mark Edward Riehl, Doylestown, Pa. (US); and Stanford W. Miller, Kennesaw, Ga. (US)
Assigned to Neuronetics, Inc., Malvern, Pa. (US)
Filed on Mar. 04, 2004, as Appl. No. 10/792,994.
Application 10/792994 is a continuation of application No. 10/657296, filed on Sep. 08, 2003.
Claims priority of provisional application 60/452477, filed on Mar. 07, 2003.
Prior Publication US 2004/0204625 A1, Oct. 14, 2004
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/00 (2006.01)
U.S. Cl. 600—13  [607/103] 72 Claims
OG exemplary drawing
 
1. A method for reducing discomfort caused by transcutaneous stimulation, comprising:
providing transcutaneous stimulation to a first location;
locating at least one conductive material at a second location; and
reducing discomfort caused by the transcutaneous stimulation at the second location using the conductive material.