US 7,320,513 B2 | ||
Bubble-ink jet print head and fabrication method thereof | ||
Yun-gi Kim, Yongin (Korea, Republic of); Yong-shik Park, Seongnam (Korea, Republic of); and Sung-joon Park, Suwon (Korea, Republic of) | ||
Assigned to Samsung Electronics Co., Ltd., Suwon-Si (Korea, Republic of) | ||
Filed on Jan. 06, 2004, as Appl. No. 10/751,467. | ||
Claims priority of application No. 10-2003-0007935 (KR), filed on Feb. 07, 2003. | ||
Prior Publication US 2004/0155943 A1, Aug. 12, 2004 | ||
Int. Cl. B41J 2/05 (2006.01) |
U.S. Cl. 347—65 | 3 Claims |
1. A bubble-ink jet print head comprising:
a substrate having ink chambers to store ink and resistance heat emitting bodies to heat ink disposed thereover; and
an ink supply passage which penetrates the substrate, extends beyond the substrate, and which is connected to the ink chambers,
the ink supply passage including:
a first trench formed at a first surface of the substrate in a first pattern having a separating distance from at least one
of inlets of the ink chambers and connecting portions between the adjacent ink chambers, the first surface of the substrate
having the ink chambers disposed thereover, and
a second trench formed at a second surface of the substrate in a second pattern, having an area equal to or smaller than that
of the first trench in the range of the first pattern of the first trench, having a uniform width, penetrating the substrate
and directly connected to the first trench,
wherein the first trench has a depth from 5 μm to 20 μm.
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