US 7,321,169 B2 | ||
Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus | ||
Ryosuke Imaseki, Nagano (Japan); and Ken Kaneko, Nagano (Japan) | ||
Assigned to Seiko Epson Corporation, (Japan) | ||
Filed on Sep. 21, 2005, as Appl. No. 11/232,381. | ||
Claims priority of application No. 2004-283627 (JP), filed on Sep. 29, 2004. | ||
Prior Publication US 2006/0076638 A1, Apr. 13, 2006 | ||
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) |
U.S. Cl. 257—773 [257/692; 257/734; 438/666] | 9 Claims |
1. A semiconductor device comprising:
a protrusion group composed of a resin material and including a plurality of first protrusions arranged on a mounting surface
and separated from each other, and a plurality of second protrusions composed of a resin material and located between certain
adjacent first protrusions of the plurality of first protrusions; and
conductive members provided on protruding surfaces of the plurality of first protrusions,
wherein the height of the second protrusions from the mounting surface is smaller than the height of the first protrusions
from the mounting surface;
wherein certain others of adjacent first protrusions are separated by culling gaps where no second protrusions are provided,
at a culling interval that is greater in the vicinity of ends of the protrusion group than in the vicinity of a center of
the protrusion group.
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