US 7,321,455 B2 | ||
Microelectronic devices and methods for packaging microelectronic devices | ||
Larry D. Kinsman, Kuna, Id. (US) | ||
Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
Filed on Jul. 22, 2005, as Appl. No. 11/187,105. | ||
Application 11/187105 is a continuation of application No. 10/665912, filed on Sep. 18, 2003, granted, now 6,934,065. | ||
Prior Publication US 2005/0255628 A1, Nov. 17, 2005 | ||
Int. Cl. G02F 1/03 (2006.01); H01L 31/203 (2006.01); H01L 23/34 (2006.01); H01L 21/00 (2006.01); H01L 27/00 (2006.01); H01L 27/15 (2006.01) |
U.S. Cl. 359—245 [438/57; 438/64; 438/66; 257/79; 257/432; 257/433; 257/434; 257/723; 250/208.1; 348/294] | 25 Claims |
11. A plurality of microelectronic imaging units, comprising:
a support member having a plurality of terminal arrays;
a plurality of imaging dies attached to the support member, the individual imaging dies comprising an image sensor, an integrated
circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
a plurality of wire-bonds having a proximal portion coupled to one of the external contacts and a distal portion coupled to
a corresponding terminal;
a footing on the support member encapsulating the distal portion of the individual wire-bonds;
a plurality of covers positioned over corresponding image sensors; and
an adhesive attaching the covers to the footing and/or corresponding imaging dies.
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