US 7,321,457 B2
Process and structure for fabrication of MEMS device having isolated edge posts
David Heald, Solvang, Calif. (US)
Assigned to QUALCOMM Incorporated, San Diego, Calif. (US)
Filed on Jun. 01, 2006, as Appl. No. 11/445,607.
Prior Publication US 2007/0279730 A1, Dec. 06, 2007
Int. Cl. G02B 26/00 (2006.01); G02B 26/08 (2006.01)
U.S. Cl. 359—291  [359/224] 26 Claims
OG exemplary drawing
 
1. A method of fabricating a microelectromechanical systems (MEMS) device, comprising:
forming an electrode layer over a substrate;
depositing a sacrificial layer over the electrode layer;
forming a plurality of support structures, said support structures extending through the sacrificial layer, wherein at least some of said plurality of support structures comprise edge support structures;
depositing a mechanical layer over the plurality of support structures;
patterning the mechanical layer to form strips, wherein said strips are separated by gaps, and wherein said gaps are located over a central portion of each of said edge support structures; and
after forming the plurality of support structures, etching a portion of each of said edge support structures underlying the gaps, thereby forming isolated edge support structures.