US 7,320,738 B2 | ||
Method for encapsulation of a chip card and module obtained thus | ||
Jean-Pierre Radenne, Paris (France); Yannick De Maquille, Saint Germain en Laye (France); Jean-Jacques Mischler, Cierrey (France); and Christophe Mathieu, Poissy (France) | ||
Assigned to FCI, Versailles (France) | ||
Appl. No. 10/511,792 PCT Filed Apr. 16, 2003, PCT No. PCT/EP03/50109 § 371(c)(1), (2), (4) Date May 09, 2005, PCT Pub. No. WO03/088139, PCT Pub. Date Oct. 23, 2003. |
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Claims priority of application No. 02 04899 (FR), filed on Apr. 18, 2002. | ||
Prior Publication US 2005/0253228 A1, Nov. 17, 2005 | ||
Int. Cl. B29C 65/00 (2006.01); B32B 37/00 (2006.01) |
U.S. Cl. 156—293 [257/E23.064; 257/678; 257/681; 235/492; 235/488; 174/52.4; 174/521; 156/252; 156/253; 156/295] | 6 Claims |
1. A method for producing an electronic microcircuit module tape comprising the following steps performed in the following
order:
depositing an electrically conductive layer on a first face of a substrate tape, wherein the substrate tape comprises a second
opposite face;
gluing a first face of a mask tape on the second opposite face of the substrate tape; and
concurrent with or subsequent to the step of gluing, arranging an adhesive on a second different face of the mask tape;
wherein the mask tape comprises a window open to the second face of the substrate tape, wherein the window is sized and shaped
to allow an integrated circuit to be inserted through the window and be subsequently mounted to the second face of the substrate
tape after the mask tape has been attached to the substrate tape, and wherein the mask tape has a height greater than a height
of an integrated circuit intended to be mounted on the second face of the substrate tape.
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