US 7,321,497 B2 | ||
Electronic circuit apparatus and method for stacking electronic circuit units | ||
Sven Boldt, Aschheim (Germany); and Erwin Thalmann, Villach (Austria) | ||
Assigned to Infineon Technologies AG, Munich (Germany) | ||
Filed on May 25, 2005, as Appl. No. 11/137,062. | ||
Claims priority of application No. 10 2004 028 989 (DE), filed on Jun. 16, 2004. | ||
Prior Publication US 2005/0281015 A1, Dec. 22, 2005 | ||
Int. Cl. H05K 1/11 (2006.01) |
U.S. Cl. 361—803 [361/805] | 19 Claims |
1. Electronic circuit apparatus, having:
a) a plurality of electronic circuit units;
b) a circuit board, on which the electronic circuit units are arranged, wherein the circuit board has:
b1) a basic board element; and
b2) a plurality of additional board elements,
b3) the additional board elements being connected to the basic board element by means of connecting elements, and
b4) the circuit units being arranged on the additional board elements in such a way that in each case identical signal propagation
times are provided between the circuit units arranged on an additional board and the connection unit; and
c) a connection unit, which is electrically connected to the plurality of electronic circuit units, for the connection of
the electronic circuit units to an external circuit apparatus,
d) at least one of the electronic circuit units being replaced by a cooling device such that the at least one cooling device
is arranged between circuit units stacked on above the other, wherein the at least one cooling device is formed as a Peltier
element.
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