US 7,320,936 B2 | ||
Plating of multi-layer structures | ||
Magall Brunet, Bellegarde (France); Andrew Mark Connell, Cork (Ireland); Paul McCloskey, Cork (Ireland); Terence O'Donnell, Cork (Ireland); Stephen O'Reilly, County Cork (Ireland); and Sean Cian O'Mathuna, Limerick (Ireland) | ||
Assigned to University College Cork - National University of Ireland, Cork, Cork (Ireland) | ||
Filed on Jun. 21, 2005, as Appl. No. 11/156,544. | ||
Application 11/156544 is a continuation of application No. PCT/IE03/00176, filed on Dec. 23, 2003. | ||
Claims priority of application No. 2002/0997 (IE), filed on Dec. 23, 2002. | ||
Prior Publication US 2005/0233593 A1, Oct. 20, 2005 | ||
Int. Cl. H01L 21/44 (2006.01) |
U.S. Cl. 438—678 [257/E21.114; 257/E21.464; 427/437; 427/443.1] | 19 Claims |
1. A method of applying layers to conductive areas of a substrate comprising the steps of:
(a) electrophoretically depositing an insulator onto said conductive areas of the substrate to provide an insulating layer,
wherein a catalyst is co-deposited with the insulating layer, and wherein the insulating layer is electrophoretically deposited
from an emulsion of insulator particles, and the catalyst is dissolved in solution in the emulsion; and
(b) electroless plating a conductive layer onto the insulating layer, in which the catalyst activates the electroless plating;
wherein the insulating layer is activated before electroless plating of the conductive layer; and wherein the insulating layer
is activated by plasma etching to remove a surface portion of the insulating layer to expose the catalyst.
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