US 12,168,601 B2
Interconnection scheme for dielectric element sensor
Michael Pedersen, Long Grove, IL (US); and Peter V. Loeppert, Durand, IL (US)
Assigned to Knowles Electronics, LLC, Itasca, IL (US)
Filed by Knowles Electronics, LLC, Itasca, IL (US)
Filed on Apr. 7, 2022, as Appl. No. 17/715,184.
Prior Publication US 2023/0322547 A1, Oct. 12, 2023
Int. Cl. B81B 7/02 (2006.01)
CPC B81B 7/02 (2013.01) [B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81B 2207/07 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A microelectromechanical systems (MEMS) die comprising:
a diaphragm assembly, comprising:
a first diaphragm having a first side and a second side;
a second diaphragm having a first side facing the first side of the first diaphragm and a second side facing away from the first diaphragm;
a first plurality of electrodes, each of the first plurality of electrodes having a first end connected to the first side of the first diaphragm and a second end connected to the first side of the second diaphragm, and a first plurality of interconnect strips disposed along the first side of the first diaphragm and the first side of the second diaphragm, wherein each of the first plurality of electrodes is in electrical communication with one of the first plurality of interconnect strips;
a second plurality of electrodes, each of the second plurality of electrodes having a first end connected to the first side of the first diaphragm and a free second end, and a second plurality of interconnect strips disposed along the first side of the first diaphragm, wherein each of the second plurality of electrodes is in electrical communication with one of the second plurality of interconnect strips; and
a third plurality of electrodes, each of the third plurality of electrodes having a first end connected to the first side of the second diaphragm and a free second end, and a third plurality of interconnect strips disposed along the first side of the second diaphragm, wherein each of the third plurality of electrodes is in electrical communication with one of the third plurality of interconnect strips.