CPC H01L 23/66 (2013.01) [H01L 23/481 (2013.01); H01L 24/32 (2013.01); H01L 2224/32221 (2013.01)] | 16 Claims |
1. A semiconductor device, comprising:
a base member of a semiconductor material which forms a thin plate shape;
a front face electrode which is placed on one of surfaces of the base member;
a rear face electrode which covers another one of the surfaces of the base member; and
plural via holes, each of which forms a hole shape provided with the front face electrode as a bottom and being open onto said another surface, and through which the front face electrode and the rear face electrode are electrically connected to each other;
wherein, at a circumferential edge portion of the base member on its side where said another surface is located, a protrusion portion which protrudes in a thickness direction is disposed intermittently along a circumferential direction, and an entire portion of the another surface between the plural via holes is recessed relative to the protrusion in the thickness direction.
|