CPC H01F 41/02 (2013.01) [H05K 3/44 (2013.01); H05K 3/4697 (2013.01)] | 12 Claims |
1. A method, comprising:
providing a multilayer printed circuit board (PCB) comprising one or more conductive features each arranged on one or more conductive layers of the multilayer PCB such that each of the one or more conductive features forms a winding around a predetermined axis;
forming a hole in the multilayer PCB at the axis of the winding formed from each of the one or more conductive features to accommodate a core leg, wherein for each hole, an inner circumferential edge of a respective one of the one or more conductive features overlap an edge of the hole in a lateral direction after the hole is formed; and
for each hole, etching the multilayer PCB after forming the hole to create a setback between the inner circumferential edge of the respective one of the one or more conductive features and the hole, the setback being created by etching from within the hole radially outward along the inner circumferential edge to remove a setback portion of the respective one of the one or more conductive features.
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