CPC H01L 21/67017 (2013.01) | 20 Claims |
15. A method for thermal management in a semiconductor fabrication facility, comprising:
supplying electric power to a semiconductor processing tool via a power cable;
positioning a fluid conduit in close proximity to the power cable;
delivering a fluid within the fluid conduit to absorb heat radiated from the power cable; and
regulating a flow of the fluid based on real-time data associated with temperature of the power cable to control a temperature of the power cable.
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