CPC B81C 1/00182 (2013.01) [B81B 3/0021 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01)] | 12 Claims |
1. A method for manufacturing an electroacoustic transducer comprising:
a frame;
an element movable with respect to the frame, the movable element comprising a membrane and a rigification structure for rigidifying the membrane;
a first transmission arm, the movable element being coupled to an end of the first transmission arm;
the method comprising:
providing a stack comprising successively a substrate, a first sacrificial layer and a first structural layer;
etching the first structural layer to the first sacrificial layer in such a way as to separate a first portion of the first structural layer and a second portion of the first structural layer, the first portion of the first structural layer being intended to form the membrane of the movable element; forming a second sacrificial layer comprising:
a first portion arranged on the first portion of the first structural layer;
a second portion spaced from the first portion and arranged on the first structural layer; and
a third portion adjacent to the second portion and arranged on the first sacrificial layer between the first and second portions of the first structural layer;
forming a second structural layer on the second sacrificial layer;
etching the second structural layer in such a way as to delimit the rigidification structure of the movable element and in such a way as to expose the first portion of the second sacrificial layer;
etching the second sacrificial layer in such a way as to expose the first portion of the first structural layer;
wherein the etching of the first structural layer and the etching of the second structural layer delimiting the periphery of the rigidification structure are spaced from one another in a region around the position of the first transmission arm, in such a way that the second portion of the second sacrificial layer serves as a stop layer to the etching of the second structural layer.
|