US 12,171,058 B2
Printed circuit board (PCB) module comprising an embedded radio-frequency semiconductor die
Maja Amskov Gravad, Copenhagen (DK); and Søren Christian Ell, Roskilde (DK)
Assigned to GN HEARING A/S, Ballerup (DK)
Appl. No. 17/549,851
Filed by GN Hearing A/S, Ballerup (DK)
PCT Filed Jun. 17, 2020, PCT No. PCT/EP2020/066700
§ 371(c)(1), (2) Date Dec. 13, 2021,
PCT Pub. No. WO2020/254362, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 19180726 (EP), filed on Jun. 18, 2019.
Prior Publication US 2024/0015882 A1, Jan. 11, 2024
Int. Cl. H05K 1/02 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0243 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 2201/10098 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) module comprising a multilayer PCB, the multilayer PCB comprising:
a plurality of layers, the plurality of layers comprising interleaved conductive layers and non-conductive layers;
a first outer surface and second outer surface opposite from the first outer surface;
one or more electrical components coupled to the first outer surface;
one or more electrical contacts coupled to the second outer surface; and
a first embedded semiconductor die having an active side facing towards a location of the first outer surface;
wherein the first embedded semiconductor die comprises a first wireless radio-frequency transceiver; and
wherein the multilayer PCB comprises a keep-out volume between the first outer surface and the active side of the first embedded semiconductor die, the keep-out volume being defined by a keep-out area of the active side of the first embedded semiconductor die and a keep-out height extending from the keep-out area towards the first outer surface, the keep-out volume being free from electrically conductive materials.