CPC H01L 25/0753 (2013.01) [H01L 25/167 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01)] | 12 Claims |
1. A method of manufacturing a display device, the method comprising:
forming a sacrificial layer on a carrier glass;
forming a first substrate layer on the sacrificial layer, the first substrate layer comprising an organic insulation material;
forming a first through-hole in the first substrate layer, the first through-hole passing through the first substrate layer;
forming a wiring on an upper surface of the first substrate layer, the wiring extending into the first through-hole;
sequentially forming a circuit layer, an emission layer, and an encapsulation layer on the wiring;
separating the sacrificial layer and the carrier glass from the first substrate layer by irradiating the sacrificial layer with a laser so as to change a state of the sacrificial layer from a solid state to a liquid state; and
attaching a driving element on a lower surface of the first substrate layer, the driving element being electrically connected to the wiring through the first through-hole.
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