US 12,169,313 B2
Compact micro bench for optical transceiver sub-assembly
Wing Keung Mark Mak, Hong Kong (HK); Vincent Wai Hung, Hong Kong (HK); Hulmut Ying Wai Sun, Hong Kong (HK); Vivian Wei Ma, Hong Kong (HK); Yvonne Xiaoming Yu, Hong Kong (HK); Jason Hok Hay Tang, Hong Kong (HK); Kwong Shing Tsang, Hong Kong (HK); and Hermit Ka Kit Wong, Hong Kong (HK)
Assigned to Cloud Light Technology Limited, Hong Kong (HK)
Filed by Cloud Light Technology Limited, Hong Kong (HK)
Filed on Sep. 26, 2022, as Appl. No. 17/952,360.
Claims priority of provisional application 63/302,126, filed on Jan. 23, 2022.
Prior Publication US 2023/0236371 A1, Jul. 27, 2023
Int. Cl. G02B 6/42 (2006.01); H04B 10/40 (2013.01)
CPC G02B 6/4246 (2013.01) [G02B 6/4257 (2013.01); G02B 6/4271 (2013.01); G02B 6/4281 (2013.01); H04B 10/40 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An optical transceiver sub-assembly integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals, the sub-assembly comprising:
a housing chamber;
a top cover configured to engage with the housing chamber to enclose elements in the optical transceiver sub-assembly other than the housing chamber and the top cover;
a bottom housing module accommodating an optical micro integration;
a transparent optical window to establish an optical communication with outside surroundings;
one or more slots are configured at electrical inlet and/or electrical outlet points on the housing chamber and the top cover; wherein the one or more slots are epoxy slots configured to hermetically seal the optical micro integration;
a plurality of fixing features at a bottom of the housing chamber to fix the bottom housing module;
a carrier configured to hold and provide support to the optical micro integration;
a thermoelectric temperature controller (TEC) deposited on the carrier for cooling heating elements in the optical transceiver sub-assembly;
the optical micro integration comprising:
an optical micro bench configured to deposit a photonic integrated circuit (PIC), a light source, a plurality of passive optical components and an inner printed circuit board (PCB), wherein a cooling surface of the TEC is placed towards the optical micro bench;
the light source emitting an output light signal and being a laser source;
the PIC manipulating a light beam to form and emit the plurality of optical signals to one of the plurality of passive optical components as an output passive optical component; and
a prism configured to fold the output light signal from the light source in a reverse direction from an original path;
wherein the optical transceiver sub-assembly is operably configured to establish an optical-electrical communication with the outside surroundings.