CPC H04R 9/047 (2013.01) [H04R 1/025 (2013.01); H04R 7/06 (2013.01); H04R 7/18 (2013.01); H04R 9/025 (2013.01); H04R 9/06 (2013.01); H04R 31/003 (2013.01); H04R 31/006 (2013.01); H04R 2201/003 (2013.01); H04R 2307/025 (2013.01)] | 20 Claims |
1. A package structure of a micro speaker, comprising:
a substrate having a hollow chamber;
a diaphragm disposed on a top surface of the substrate, wherein the diaphragm includes a first portion suspended over the hollow chamber and a second portion surrounding the first portion, wherein in a plan view, the second portion of the diaphragm and the hollow chamber do not overlap;
a coil structure embedded in the first portion of the diaphragm;
at least one dummy structure embedded in the second portion of the diaphragm, wherein the at least one dummy structure is electrically isolated from the coil structure by the diaphragm, wherein in a vertical direction that is perpendicular to the top surface of the substrate, a thickness of the at least one dummy structure is equal to a thickness of the coil structure; and
a carrier board disposed on a bottom surface of the substrate opposite the top surface.
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