US 12,169,644 B2
Memory system
Manabu Matsumoto, Yokohama Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Aug. 23, 2021, as Appl. No. 17/408,772.
Claims priority of application No. 2021-007161 (JP), filed on Jan. 20, 2021.
Prior Publication US 2022/0229587 A1, Jul. 21, 2022
Int. Cl. G06F 3/06 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01R 12/71 (2011.01)
CPC G06F 3/0658 (2013.01) [G06F 3/0626 (2013.01); G06F 3/0679 (2013.01); H01L 23/367 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01R 12/716 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01R 2201/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory system comprising:
a nonvolatile memory;
a controller that is configured to control the nonvolatile memory;
a connector configured to electrically connect the controller and a host;
a first rigid substrate on which the nonvolatile memory and the controller are mounted;
a second rigid substrate on which the connector is mounted; and
a flexible substrate that is flexible and electrically connects the first rigid substrate and the second rigid substrate, wherein
a thickness of the first rigid substrate is less than a thickness of the second rigid substrate.