CPC H01J 37/32724 (2013.01) [C23C 16/4586 (2013.01); H01L 21/6833 (2013.01); C23C 16/505 (2013.01); H01J 2237/2007 (2013.01)] | 9 Claims |
1. A wafer support table comprising:
a ceramic base having a wafer placement surface and including an RF electrode and a heater electrode embedded, the RF electrode being closer to the wafer placement surface;
a hole extending from a surface of the ceramic base opposite the wafer placement surface toward the RF electrode; and
an RF rod through which radio-frequency power is supplied to the RF electrode and having a top end joined to the RF electrode exposed to a bottom of the hole or joined to a conductive member connected to the RF electrode, wherein
the RF rod is a hybrid rod including a first rod member that is made of Ni and constitutes a portion of the RF rod from the top end to a predetermined position located between the top end and a base end and a second rod member that is joined to the first rod member and constitutes a portion of the RF rod from the predetermined position to the base end, and
the second rod member is made of a non-magnetic material.
|