US 12,168,634 B2
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method
Nobuyuki Terasaki, Saitama (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/270,149
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Aug. 27, 2019, PCT No. PCT/JP2019/033461
§ 371(c)(1), (2) Date Feb. 22, 2021,
PCT Pub. No. WO2020/045403, PCT Pub. Date Mar. 5, 2020.
Claims priority of application No. 2018-159457 (JP), filed on Aug. 28, 2018.
Prior Publication US 2021/0238103 A1, Aug. 5, 2021
Int. Cl. B23K 1/00 (2006.01); C04B 35/581 (2006.01); C04B 37/02 (2006.01); H05K 1/03 (2006.01)
CPC C04B 37/023 (2013.01) [B23K 1/00 (2013.01); C04B 35/581 (2013.01); C04B 2237/12 (2013.01); C04B 2237/366 (2013.01); C04B 2237/407 (2013.01); H05K 1/03 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A copper/ceramic bonded body, comprising:
a copper member made of copper or a copper alloy; and
a ceramic member made of an aluminum nitride,
wherein the copper member and the ceramic member being bonded to each other,
a Mg solid solution layer is provided between the copper member and the ceramic member and contains Mg in a state of a solid solution in a Cu primary phase,
the Mg solid solution layer is in contact with the ceramic member,
the Mg solid solution layer has a concentration gradient in which a Mg concentration gradually increases from the copper member toward a side of the ceramic member, and
Ti, Zr, Nb, and Hf are not present at a bonded interface between the copper member and the ceramic member.