US 12,171,068 B2
Electronic device and method for manufacturing electronic device
Koji Dobashi, Kanagawa (JP); and Koichi Sasaki, Kanagawa (JP)
Assigned to PANASONIC AUTOMOTIVE SYSTEMS CO., LTD., Kanagawa (JP)
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed on Feb. 7, 2023, as Appl. No. 18/106,716.
Claims priority of application No. 2022-018736 (JP), filed on Feb. 9, 2022.
Prior Publication US 2023/0254982 A1, Aug. 10, 2023
Int. Cl. H05K 5/00 (2006.01); H05K 3/32 (2006.01); H05K 5/03 (2006.01)
CPC H05K 3/328 (2013.01) [H05K 5/0039 (2013.01); H05K 5/03 (2013.01); H05K 2203/107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing that is formed of a resin member having a predetermined light absorption property and that has an opening;
a circuit board that is accommodated in the housing and on which an electronic circuit is formed;
at least one terminal that includes one end portion and the other end portion, the other end portion being electrically connected to the circuit board; and
a cover portion that covers the opening of the housing, that is penetrated by the at least one terminal, and that is formed of a resin member having a predetermined light transmitting property,
wherein the one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion,
wherein the cover portion is molded at a mold temperature of 100 degrees Celsius to 180 degrees Celsius,
wherein the at least one terminal and the circuit board are electrically connected to each other by solder joining,
wherein the housing and the cover portion are connected to each other by laser welding, and
wherein a light absorption property of the housing is higher than a light absorption property of the cover portion.