US 12,170,269 B2
Display device and method of manufacturing display device
Hyunah Sung, Suwon-si (KR); Gyungmin Baek, Yongin-si (KR); and Hyuneok Shin, Gwacheon-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Oct. 5, 2021, as Appl. No. 17/494,260.
Claims priority of application No. 10-2020-0179047 (KR), filed on Dec. 18, 2020.
Prior Publication US 2022/0199852 A1, Jun. 23, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 25/167 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method of manufacturing a display device, the method comprising:
forming a sacrificial layer on a carrier glass;
forming a first substrate layer on the sacrificial layer, the first substrate layer comprising an organic insulation material;
forming a first through-hole in the first substrate layer, the first through-hole passing through the first substrate layer;
forming a wiring on an upper surface of the first substrate layer, the wiring extending into the first through-hole;
sequentially forming a circuit layer, an emission layer, and an encapsulation layer on the wiring;
separating the sacrificial layer and the carrier glass from the first substrate layer by irradiating the sacrificial layer with a laser so as to change a state of the sacrificial layer from a solid state to a liquid state; and
attaching a driving element on a lower surface of the first substrate layer, the driving element being electrically connected to the wiring through the first through-hole.