US 12,171,056 B2
Electronic assembly and method for thermal balancing of surfacemount devices
Igor Loiferman, Yokneam-Illit (IL); Tomer Klein, Pardes Hana-Karkur (IL); and Rom Becker, Ramat Yishai (IL)
Assigned to MELLANOX TECHNOLOGIES LTD., Yokneam (IL)
Filed by Mellanox Technologies Ltd., Yokneam (IL)
Filed on Jun. 20, 2022, as Appl. No. 17/844,275.
Prior Publication US 2023/0413417 A1, Dec. 21, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/10015 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device comprising:
a printed circuit board (PCB); a plurality of surface-mount electronic devices disposed on the PCB, wherein a thermal mass of each of the surface-mount electronic devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value; and
a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value and equal to or smaller than the second thermal mass value.