CPC H10K 50/844 (2023.02) [H10K 71/00 (2023.02); H10K 59/12 (2023.02); H10K 59/1201 (2023.02); H10K 59/8722 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02); H10K 2102/351 (2023.02)] | 12 Claims |
1. An encapsulation method for a flexible organic light-emitting diode (OLED) substrate, comprising following steps:
providing a glass substrate, wherein the glass substrate comprises a first substrate portion and a second substrate portion connected to each other;
providing a flexible substrate on the first substrate portion and the second substrate portion, and producing an inorganic barrier layer on a surface of the flexible substrate away from the glass substrate;
producing an OLED device on the inorganic barrier layer corresponding to the first substrate portion, and producing an adhesive-filling layer on the flexible substrate corresponding to the second substrate portion; and
bending the first substrate portion to press against the second substrate portion or bending the second substrate portion to press against the first substrate portion, so that the flexible substrate is spaced apart from the OLED device by the adhesive-filling layer and covers the OLED device.
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