US 12,169,137 B2
Airflow amount measuring device
Binti Haridan Fatin Farhanah, Hitachinaka (JP); Hiroyuki Abe, Hitachinaka (JP); Takayuki Yogo, Hitachinaka (JP); Nozomi Yatsumonji, Hitachinaka (JP); and Mizuki Ijuin, Hitachinaka (JP)
Assigned to Hitachi Astemo, Ltd., Hitachinaka (JP)
Appl. No. 17/801,620
Filed by Hitachi Astemo, Ltd., Hitachinaka (JP)
PCT Filed Dec. 25, 2020, PCT No. PCT/JP2020/048699
§ 371(c)(1), (2) Date Aug. 23, 2022,
PCT Pub. No. WO2021/181827, PCT Pub. Date Sep. 16, 2021.
Claims priority of application No. 2020-040656 (JP), filed on Mar. 10, 2020.
Prior Publication US 2023/0079532 A1, Mar. 16, 2023
Int. Cl. G01F 1/692 (2006.01)
CPC G01F 1/692 (2013.01) 5 Claims
OG exemplary drawing
 
1. An airflow amount measuring device comprising
a resin-sealed package including
a lead frame,
an airflow amount measuring element mounted on the lead frame and having a detection portion, and
a sealing resin member which seals the lead frame and the airflow amount measuring element such that at least the detection portion is exposed, wherein
a curvature radius ρ of an exposed portion of the airflow amount measuring element exposed from the sealing resin member is 2.13 mm or less,
the sealing resin member has a recessed groove-shaped passage having a pair of passage walls and a bottom wall from which the detection portion is exposed, and
the pair of passage walls forming the passage of the resin-sealed package covers both side edges of the airflow amount measuring element,
a maximum thickness h3 of the sealing resin member on a sensor element side with respect to the lead frame is twice or more of a maximum thickness h1 of the sealing resin member on a back surface side with respect to the lead frame,
in the lead frame, a hole is formed in a region obtained by projecting the detection portion on the lead frame in a direction perpendicular to a front surface of the airflow amount measuring element, and
a tape is attached to a back surface side of the lead frame to cover the hole.