US 12,170,208 B2
Method for managing temperature in semiconductor fabrication facility
Otto Chen, Tainan (TW); Ying-Yen Tseng, Hsinchu (TW); Wen-Yu Ku, Hsinchu (TW); and Chia-Chih Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on May 28, 2021, as Appl. No. 17/333,560.
Prior Publication US 2022/0384214 A1, Dec. 1, 2022
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67017 (2013.01) 20 Claims
OG exemplary drawing
 
15. A method for thermal management in a semiconductor fabrication facility, comprising:
supplying electric power to a semiconductor processing tool via a power cable;
positioning a fluid conduit in close proximity to the power cable;
delivering a fluid within the fluid conduit to absorb heat radiated from the power cable; and
regulating a flow of the fluid based on real-time data associated with temperature of the power cable to control a temperature of the power cable.