US 12,170,190 B2
Wafer support table and RF rod
Yutaka Unno, Handa (JP); and Tomohiro Hara, Handa (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK Insulators, Ltd., Nagoya (JP)
Filed on Oct. 19, 2022, as Appl. No. 18/047,713.
Application 18/047,713 is a continuation of application No. PCT/JP2022/009916, filed on Mar. 8, 2022.
Claims priority of application No. 2021-062560 (JP), filed on Apr. 1, 2021.
Prior Publication US 2023/0058637 A1, Feb. 23, 2023
Int. Cl. H01T 23/00 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/683 (2006.01); C23C 16/505 (2006.01)
CPC H01J 37/32724 (2013.01) [C23C 16/4586 (2013.01); H01L 21/6833 (2013.01); C23C 16/505 (2013.01); H01J 2237/2007 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A wafer support table comprising:
a ceramic base having a wafer placement surface and including an RF electrode and a heater electrode embedded, the RF electrode being closer to the wafer placement surface;
a hole extending from a surface of the ceramic base opposite the wafer placement surface toward the RF electrode; and
an RF rod through which radio-frequency power is supplied to the RF electrode and having a top end joined to the RF electrode exposed to a bottom of the hole or joined to a conductive member connected to the RF electrode, wherein
the RF rod is a hybrid rod including a first rod member that is made of Ni and constitutes a portion of the RF rod from the top end to a predetermined position located between the top end and a base end and a second rod member that is joined to the first rod member and constitutes a portion of the RF rod from the predetermined position to the base end, and
the second rod member is made of a non-magnetic material.