CPC H01J 37/32715 (2013.01) [B05D 1/60 (2013.01); B05D 1/62 (2013.01); C23C 16/4584 (2013.01); C23C 16/509 (2013.01); C23C 16/515 (2013.01); H01J 37/3244 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/3321 (2013.01)] | 12 Claims |
1. A coating apparatus for coating a plurality of substrates by a coating forming material, comprising:
a chamber body having a reaction chamber;
a supporting rack having a supporting area for supporting the substrates within said reaction chamber of said chamber body;
a plurality of monomer discharge sources having a discharge inlet for introducing the coating forming material into said reaction chamber of said chamber body; and
a plasma generation source disposed in said reaction chamber of said chamber body for exciting the coating forming material, wherein said supporting area of said supporting rack is located at a position between said monomer discharge source and said plasma generation source in such manner that the substrates are adapted for being arranged between said monomer discharge source and said plasma generation source;
wherein said supporting rack comprises a movable rack and a plurality of carrier racks supported on the movable rack, wherein said plurality of carrier racks are spaced from each other, wherein each of said carrier racks has said supporting area for supporting the substrates; and
wherein said plasma generation source is disposed at the center of said reaction chamber, and the plurality of monomer discharge sources are disposed around said plasma generation source, when the substrates are supported on said carrier racks, the plurality of monomer discharge sources and the plasma generation source are respectively arranged at two opposite sides of each corresponding substrate;
wherein said plasma generation source comprises an electrode means for applying an electric power to the coating forming material, and said electrode means comprises first and second concentric cylindrical electrodes disposed at the center of said reaction chamber, and the plurality of monomer discharge sources are disposed around said electrode means.
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