US 12,170,237 B2
Semiconductor structure and manufacturing method thereof
Wensen Hung, Hsinchu County (TW); Ping-Kang Huang, Chiayi (TW); Sao-Ling Chiu, Hsinchu (TW); Tsung-Yu Chen, New Taipei (TW); Tsung-Shu Lin, Hsinchu (TW); Chien-Yuan Huang, Hsinchu (TW); and Chen-Hsiang Lao, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 14, 2023, as Appl. No. 18/334,381.
Application 18/334,381 is a continuation of application No. 17/688,898, filed on Mar. 8, 2022, granted, now 11,715,675.
Application 17/688,898 is a continuation of application No. 16/718,211, filed on Dec. 18, 2019, granted, now 11,302,600, issued on Apr. 12, 2022.
Prior Publication US 2023/0326826 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 21/4871 (2013.01); H01L 23/42 (2013.01); H01L 23/49562 (2013.01); H01L 23/562 (2013.01); H01L 25/0657 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor structure, comprising:
a circuit substrate,
a semiconductor die disposed on the circuit substrate, and
a cover, disposed over the semiconductor die and over the circuit substrate, wherein the cover includes a lid portion overlying the semiconductor die and a support portion connected with the lid and connected to the circuit substrate;
a first adhesive bonding the support portion to the circuit substrate; and
a second adhesive bonding the support portion and the lid portion,
wherein the first and second adhesives are disposed at opposite sides of the support portion, and wherein an elastic modulus of the first adhesive is greater than an elastic modulus of the second adhesive.