CPC H05K 1/115 (2013.01) [H01R 13/6658 (2013.01); H05K 1/117 (2013.01); H05K 1/145 (2013.01)] | 7 Claims |
1. An interconnection system comprising:
a component including first and second signal leads and at least one ground lead; and
a printed circuit board comprising a plurality of layers including conductive layers separated by dielectric layers, the printed circuit board further comprising:
first and second signal conductors for connection to the respective first and second signal leads of the component to an upper surface of the printed circuit board and for connection of the first and second signal leads of the component to a breakout layer of the conductive layers; and
at least one ground conductor for attachment to the at least one ground lead of the component and for connection of the ground lead of the component to a ground plane of the conductive layers,
wherein the component is mounted to the printed circuit board with the first and second signal leads pressing against the first and second signal conductors, wherein each of the first and second signal conductors includes a recess in an upper surface thereof, and wherein the recess includes a conical, truncated conical, or hemispherical portion.
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