US 12,169,308 B2
Method of using fiber to chip coupler and method of making
Sui-Ying Hsu, Hsinchu (TW); Yuehying Lee, Hsinchu (TW); Chien-Ying Wu, Hsinchu (TW); Chen-Hao Huang, Hsinchu (TW); Chien-Chang Lee, Hsinchu (TW); and Chia-Ping Lai, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 10, 2023, as Appl. No. 18/448,095.
Application 18/448,095 is a division of application No. 17/459,917, filed on Aug. 27, 2021.
Prior Publication US 2023/0384528 A1, Nov. 30, 2023
Int. Cl. G02B 6/34 (2006.01); G02B 6/30 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/34 (2013.01) [G02B 6/30 (2013.01); G02B 6/4214 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of using a coupling system, the method comprising:
aligning an optical fiber with a cavity in a chip, wherein aligning the optical fiber comprises orienting a longitudinal axis of the fiber within an angle ranging from about 88-degrees to about 92-degrees with respect to a top surface of the chip;
emitting an optical signal from the optical fiber;
passing the optical signal through an etch stop layer; and
redirecting, after passing the optical signal through the etch stop layer, the optical signal into a waveguide using a grating positioned on an opposite side of a bottom of the cavity relative to the optical fiber.