US 12,170,171 B2
Electronic component
Yuuta Hoshino, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Nov. 29, 2023, as Appl. No. 18/522,505.
Application 18/522,505 is a continuation of application No. 17/672,205, filed on Feb. 15, 2022, granted, now 11,887,788.
Application 17/672,205 is a continuation of application No. PCT/JP2020/020973, filed on May 27, 2020.
Claims priority of application No. 2019-151734 (JP), filed on Aug. 22, 2019.
Prior Publication US 2024/0096556 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a ceramic body; and
an external electrode on a surface of the ceramic body, the external electrode including:
a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase present around the granulate of the metal material; and
a metal layer on the base layer,
wherein a density of the metal material in a first portion of the base layer closer to the metal layer is higher than a density of the metal material in a second portion of the base layer closer to the surface of the ceramic body, and
wherein the base layer has a thickness of 1.5 μm or less.