CPC H01R 43/0256 (2013.01) [B23K 1/0008 (2013.01); B23K 3/087 (2013.01); H01R 12/58 (2013.01); H01R 43/0263 (2013.01); B23K 2101/42 (2018.08); H05K 2201/10803 (2013.01)] | 15 Claims |
1. An assembly, comprising:
a component,
a solder pin arranged on the component,
an electrical structural unit, and
a soldering point which is arranged on the electrical structural unit and forms an opening, into which the solder pin is insertable along an insertion direction in order to produce a soldered joint,
wherein the solder pin has an insertion portion which, on sides of the solder pin that face away from one another, forms insertion walls which are arranged at an acute angle to one another in such a way that the insertion portion tapers in the insertion direction,
wherein, when the soldered joint has been produced between the solder pin and the soldering point, a part of the insertion portion is arranged outside the opening in such a way that one or more portions of the insertion walls extend inside the opening and one or more portions of the insertion walls extend outside the opening,
wherein the solder pin has a head which the insertion portion adjoins in the insertion direction, and
wherein the head has walls extending in parallel to one another and transition slopes adjoining the walls in the insertion direction, wherein the insertion walls adjoin the transition slopes.
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