CPC H01L 23/373 (2013.01) [H01L 23/29 (2013.01); H01L 23/585 (2013.01)] | 20 Claims |
1. A semiconductor die package, comprising:
a package substrate;
a first semiconductor die and a second semiconductor die disposed over the package substrate;
an underfill element disposed over the package substrate and surrounding the first and second semiconductor dies, wherein a portion of the underfill element is between the first semiconductor die and the second semiconductor die;
a first lid structure attached to a first top surface of the first semiconductor die, wherein in a plan view, the entire first lid structure is located within a periphery of the first top surface of the first semiconductor die; and
a second lid structure attached to a second top surface of the second semiconductor die, wherein in a plan view, the entire second lid structure is located within a periphery of the second top surface of the second semiconductor die,
wherein the second lid structure is disconnected from the first lid structure, and a gap is formed between the first lid structure and the second lid structure and located over the portion of the underfill element, wherein there is a second gap formed between the first semiconductor die and the second semiconductor die, and the second gap is smaller than the gap between the first lid structure and the second lid structure, and wherein at least one of the first lid structure or the second lid structure includes a plurality of lid parts separated from each other.
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