US 12,168,262 B2
Joint structure, semiconductor device, and joining method
Kazunori Fuji, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Appl. No. 17/267,595
Filed by ROHM CO., LTD., Kyoto (JP)
PCT Filed Aug. 23, 2019, PCT No. PCT/JP2019/032966
§ 371(c)(1), (2) Date Feb. 10, 2021,
PCT Pub. No. WO2020/045263, PCT Pub. Date Mar. 5, 2020.
Claims priority of application No. 2018-161045 (JP), filed on Aug. 30, 2018.
Prior Publication US 2021/0308791 A1, Oct. 7, 2021
Int. Cl. B23K 26/082 (2014.01); B23K 26/21 (2014.01); H01L 23/00 (2006.01)
CPC B23K 26/082 (2015.10) [B23K 26/21 (2015.10); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/73265 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A joint structure comprising a first metal member and a second metal member that overlap with each other as viewed in a first direction and that are joined to each other, the joint structure further comprising:
a welded portion in which a part of the first metal member and a part of the second metal member are fused to each other in an area where the first metal member and the second metal member overlap with each other,
wherein the welded portion includes:
an outer circumferential edge that is annular as viewed in the first direction; and
a plurality of marks each extending from an inside of the welded portion toward the outer circumferential edge as viewed in the first direction, and
wherein each of the plurality of linear marks is curved to bulge to one side in an annular direction along the outer circumferential edge,
the outer circumferential edge has an annular shape centered at a first reference point, and
each of the plurality of marks extends from the first reference point toward the outer circumferential edge, and bulges in a first sense of a circumferential direction of the outer circumferential edge.