US 12,170,252 B2
Electronic substrate stacking
Lei Shan, Carmel, NY (US); Daniel Joseph Friedman, Sleepy Hollow, NY (US); Griselda Bonilla, Hopewell Junction, NY (US); and John Knickerbocker, Monroe, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Sep. 29, 2021, as Appl. No. 17/449,280.
Prior Publication US 2023/0098054 A1, Mar. 30, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4857 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A composite substrate comprising:
a base substrate comprising electrical connections on a lower surface, electrical connections on an upper surface, one or more wiring layers electrically connected between the lower surface and the upper surface;
a set of high-k substrate layers electrically and mechanically connected to the upper surface of the base substrate, wherein each layer of the set of high-k substrate layers comprises wiring and vias which connect above and below each layer of the set of high-k substrate layers, wherein a set of one or more discrete decoupling capacitors are embedded into the set of high-k substrate layers; and
a set of high density substrate layers electrically and mechanically connected to an upper surface of the set of high-k substrate layers, wherein each layer of the set of high density substrate layers comprises wiring and vias which connect above and below each layer of the set of high density substrate layers.