CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 21/4871 (2013.01); H01L 23/42 (2013.01); H01L 23/49562 (2013.01); H01L 23/562 (2013.01); H01L 25/0657 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01)] | 20 Claims |
1. A semiconductor structure, comprising:
a circuit substrate,
a semiconductor die disposed on the circuit substrate, and
a cover, disposed over the semiconductor die and over the circuit substrate, wherein the cover includes a lid portion overlying the semiconductor die and a support portion connected with the lid and connected to the circuit substrate;
a first adhesive bonding the support portion to the circuit substrate; and
a second adhesive bonding the support portion and the lid portion,
wherein the first and second adhesives are disposed at opposite sides of the support portion, and wherein an elastic modulus of the first adhesive is greater than an elastic modulus of the second adhesive.
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