US 12,169,304 B2
Substrate coupled grating couplers in photonic integrated circuits
Liming Wang, San Jose, CA (US); Ryohei Urata, San Carlos, CA (US); Jan Petykiewicz, Palo Alto, CA (US); and Jill Berger, Saratoga, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on May 30, 2023, as Appl. No. 18/203,328.
Application 18/203,328 is a division of application No. 17/036,827, filed on Sep. 29, 2020, granted, now 11,726,260.
Prior Publication US 2023/0314709 A1, Oct. 5, 2023
Int. Cl. G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/124 (2006.01); G02B 6/13 (2006.01); H01L 23/00 (2006.01)
CPC G02B 6/124 (2013.01) [G02B 6/1228 (2013.01); G02B 6/13 (2013.01); H01L 24/16 (2013.01); G02B 2006/12107 (2013.01); H01L 2224/16225 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A signal conveying assembly comprising:
a photonic integrated circuit (PIC) chip, comprising:
a substrate;
a wafer on the substrate comprising a cladding layer located furthest from the substrate; and
a grating coupler within the wafer including a taper portion and grating, the grating extending toward the substrate from the taper portion; and
a printed circuit board (PCB) to which the PIC chip is mounted such that a wafer side of the PIC chip faces the PCB; and
electrical contacts patterned on the cladding layer, the electrical contacts establishing electric communication between the PIC chip and the PCB.