CPC H01L 22/34 (2013.01) [H01L 23/585 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/08135 (2013.01); H01L 2224/80895 (2013.01)] | 20 Claims |
1. A seal ring structure, comprising:
a first metal structure in a first wafer;
a second metal structure in the first wafer;
a third metal structure in a second wafer; and
a metal bonding structure, including:
a first set of metal elements coupling the first metal structure and the third metal structure, and
a second set of metal elements coupling the second metal structure and the third metal structure.
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