US 12,171,112 B2
Display device and electronic apparatus
Takuma Fujii, Kanagawa (JP); and Yosuke Motoyama, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/431,836
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Feb. 18, 2020, PCT No. PCT/JP2020/006230
§ 371(c)(1), (2) Date Aug. 18, 2021,
PCT Pub. No. WO2020/175235, PCT Pub. Date Sep. 3, 2020.
Claims priority of application No. 2019-035617 (JP), filed on Feb. 28, 2019.
Prior Publication US 2022/0140281 A1, May 5, 2022
Int. Cl. H10K 50/842 (2023.01); G02B 5/20 (2006.01); H10K 50/818 (2023.01); H10K 59/38 (2023.01); H10K 59/80 (2023.01)
CPC H10K 50/8426 (2023.02) [H10K 50/818 (2023.02); H10K 59/38 (2023.02)] 17 Claims
OG exemplary drawing
 
1. A display device, comprising:
a transparent substrate;
an element substrate that includes:
an opposing surface that faces the transparent substrate, wherein
the opposing surface includes a display region and a peripheral region,
the peripheral region surrounds the display region, and
the peripheral region includes a bonding region;
an organic electroluminescent (EL) element configured to emit light from the display region of the opposing surface; and
an overlapping region that overlaps with the bonding region when viewed from the transparent substrate;
a color filter layer on the opposing surface, wherein
the color filter layer includes:
a first color filter in the display region; and
a second color filter in the peripheral region, and
the second color filter avoids the bonding region;
a metal electrode layer on the element substrate, wherein the metal electrode layer avoids at least a part of the overlapping region; and
a transparent adhesive layer that bonds the transparent substrate to the element substrate via the bonding region.