CPC H04R 1/1075 (2013.01) [H04R 1/1016 (2013.01); H04R 2420/07 (2013.01)] | 20 Claims |
19. A main control applied to an electronic device, wherein the main control comprises:
a rigid-flexible circuit board comprising:
a rigid board portion;
a first flexible board portion comprising a first end coupled to the rigid board portion; and
a second flexible board portion comprising a second end coupled to the rigid board portion;
a first substrate, wherein the first substrate and the rigid board portion are stacked at a space from each other;
a first support member located between the first substrate and the rigid board portion and configured to abut against each of the first substrate and the rigid board portion, wherein the first support member comprises a plurality of first elevating pillars located between the rigid board portion and the first substrate and fastened to the rigid board portion;
a first package layer located between the rigid board portion and the first substrate, wherein the first package layer is configured to package the first elevating pillars; and
a plurality of chips comprising:
a first chip fastened to the rigid board portion and packaged in the first package layer; and
a second chip fastened to the first substrate and electrically coupled to the rigid board portion using the first support member.
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