US 12,169,358 B2
Production method of template, template blank, and template substrate for imprinting, production method of template for imprinting, and template
Takaharu Nagai, Tokyo (JP); Katsutoshi Suzuki, Tokyo (JP); Koji Ichimura, Tokyo (JP); and Kouji Yoshida, Tokyo (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
Filed on Apr. 18, 2022, as Appl. No. 17/722,608.
Application 17/722,608 is a division of application No. 16/304,264, granted, now 11,340,526, previously published as PCT/JP2017/019415, filed on May 24, 2017.
Claims priority of application No. 2016-104729 (JP), filed on May 25, 2016; and application No. 2016-184903 (JP), filed on Sep. 21, 2016.
Prior Publication US 2022/0236642 A1, Jul. 28, 2022
Int. Cl. G03F 7/00 (2006.01); B29C 33/38 (2006.01); B29C 33/42 (2006.01); B29C 59/00 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0002 (2013.01) [B29C 33/38 (2013.01); B29C 33/3842 (2013.01); B29C 33/42 (2013.01); B29C 59/002 (2013.01); H01L 21/0271 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A production method of a template substrate for imprinting, the template substrate including a first step structure on a main surface of a base, a second step structure on the first step structure, and a light shielding film on an upper surface of the first step structure, the production method comprising steps of:
a multistep template substrate with a light shielding material layer preparing step of preparing a multistep template substrate with a light shielding material layer including the first step structure, the second step structure, and a light shielding material layer on an upper surface of the first step structure and on an upper surface of the second step structure;
a resin layer forming step of forming a first resin layer on the light shielding material layer formed on the upper surface of the first step structure, and forming a second resin layer thinner than a thickness of the first resin layer, on the light shielding material layer formed on the upper surface of the second step structure;
a second resin layer removing step of removing the second resin layer while leaving the first resin layer by dry etching; and
a light shielding film forming step of etching the light shielding material layer using the first resin layer left as a mask to remove the light shielding material layer formed on the upper surface of the second step structure while leaving the light shielding material layer formed on the upper surface of the first step structure; in this order, wherein
the resin layer forming step includes:
a resin thickness specifying step of, using a template for specifying resin thickness including a concave part in a main surface side contacting a resin, pushing an upper surface of an outer peripheral part of the concave part in the template for specifying resin thickness against a first resin dropped onto the light shielding material layer formed on the upper surface of the first step structure, and pushing a bottom surface of the concave part in the template for specifying resin thickness against a second resin dropped onto the light shielding material layer formed on the upper surface of the second step structure; and
a depth of the concave part in the template for specifying resin thickness is smaller than a height from the upper surface of the first step structure to the upper surface of the second step structure.