US 12,170,236 B2
Method for forming package structure
Chih-Hao Chen, Taipei (TW); Chih-Chien Pan, Taipei (TW); Li-Hui Cheng, New Taipei (TW); Chin-Fu Kao, Taipei (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 18, 2023, as Appl. No. 18/302,223.
Application 18/302,223 is a continuation of application No. 17/372,814, filed on Jul. 12, 2021, granted, now 11,664,286.
Application 17/372,814 is a continuation of application No. 16/548,165, filed on Aug. 22, 2019, granted, now 11,062,968, issued on Jul. 13, 2021.
Prior Publication US 2023/0253276 A1, Aug. 10, 2023
Int. Cl. H01L 23/18 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/18 (2013.01) [H01L 21/565 (2013.01); H01L 23/3185 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming a package structure, comprising:
bonding a package component to a substrate through a plurality of first connectors, wherein the package component comprises a first semiconductor die and a second semiconductor die;
forming a dam structure over the substrate and surrounding the first connectors, wherein a top surface of the dam structure is lower than a bottom surface of the package component, wherein the material of the dam structure is a 2D cross-linking polymer;
filling an underfill layer in a space between the dam structure and the first connectors; and
removing the dam structure after the underfill layer is formed.