US 12,168,838 B2
Electrolytic copper foil
Daisuke Nakajima, Ageo (JP); Mitsuyoshi Matsuda, Ageo (JP); Yasuji Hara, Ageo (JP); and Mitsuhiro Wada, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 17/792,842
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Jan. 14, 2021, PCT No. PCT/JP2021/001102
§ 371(c)(1), (2) Date Jul. 14, 2022,
PCT Pub. No. WO2021/153256, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 2020-013719 (JP), filed on Jan. 30, 2020.
Prior Publication US 2023/0044366 A1, Feb. 9, 2023
Int. Cl. C25D 5/00 (2006.01); C25D 7/06 (2006.01)
CPC C25D 5/611 (2020.08) [C25D 5/617 (2020.08); C25D 7/0614 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An electrodeposited copper foil having a ten-point average roughness Rz of 0.1 μm or larger and 2.0 μm or smaller on at least one surface,
wherein in cross-sectional analysis by electron backscatter diffraction (EBSD), a proportion of an area occupied by copper crystal grains satisfying all of the following conditions:
i) (101) orientation;
ii) an aspect ratio of 0.500 or less;
iii) |sin θ| of 0.001 or more and 0.707 or less, where θ (°) is an angle between a normal line of an electrode surface of the electrodeposited copper foil and a major axis of the copper crystal grain; and
iv) when the crystal is elliptically approximated, a length of a minor axis of 0.38 μm or smaller,
relative to an area of an observation field occupied by copper crystal grains is 63% or more.