CPC B61L 27/53 (2022.01) [B61K 9/08 (2013.01); B61L 1/06 (2013.01); G01B 17/04 (2013.01); H04R 29/005 (2013.01)] | 9 Claims |
1. A microphone assembly comprising:
an outer housing comprising an outer surface, an inner surface opposite the outer surface and defining an opening there through, and a plurality of attachment structures protruding from the inner surface thereof;
an inner housing comprising an outer surface, an opening, and a plurality of attachment structures protruding from the outer surface thereof;
a printed circuit board (PCB) comprising at least one micro-electromechanical systems (MEMS) microphone comprising an acoustic port, the PCB coupled to the inner housing such that the acoustic port of the at least one MEMS microphone is positioned within the opening; and
a cord interwoven between the attachment structures of the outer and inner housings to interconnect the attachments structures of the outer and inner housings, respectively, together, the cord vibrationally isolating the inner housing from the outer housing.
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