US 12,169,312 B2
Semiconductor package
Keisuke Shimizu, Ogaki (JP); and Tomoyuki Ikeda, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on May 25, 2022, as Appl. No. 17/752,936.
Claims priority of application No. 2021-100307 (JP), filed on Jun. 16, 2021.
Prior Publication US 2022/0404564 A1, Dec. 22, 2022
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4214 (2013.01) [G02B 6/428 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a printed wiring board;
a logic IC mounted on the printed wiring board;
a connector mounted on the printed wiring board;
an optical element accommodated inside the printed wiring board and configured to convert an optical signal to an electrical signal and/or the electrical signal to the optical signal;
an optical waveguide formed between the optical element inside the printed wiring board and the connector on the printed wiring board such that the optical waveguide optically connects the optical element and the connector;
a mirror configured to change a transmission direction of the optical signal between the optical waveguide and the optical element such that the optical waveguide is optically connected to the optical element via the mirror; and
an electrical path formed between the optical element and the logic IC such that the electrical path connects the logic IC and the optical element and that a length of the electrical path is 1 mm or less.