US 12,169,315 B2
Optoelectronic modules and wafer-level methods for manufacturing the same
Qi Chuan Yu, AE Eindhoven (NL); Hartmut Rudmann, AE Eindhoven (NL); Ji Wang, AE Eindhoven (NL); Kam Wah Leong, AE Eindhoven (NL); and Kim Lung Ng, AE Eindhoven (NL)
Assigned to ams Sensors Singapore Pte. Ltd., Singapore (SG)
Appl. No. 16/978,736
Filed by ams Sensors Singapore Pte. Ltd., Singapore (SG)
PCT Filed Feb. 27, 2019, PCT No. PCT/SG2019/050107
§ 371(c)(1), (2) Date Sep. 7, 2020,
PCT Pub. No. WO2019/172841, PCT Pub. Date Sep. 12, 2019.
Claims priority of provisional application 62/639,700, filed on Mar. 7, 2018.
Prior Publication US 2021/0041650 A1, Feb. 11, 2021
Int. Cl. G02B 6/36 (2006.01); G02B 6/42 (2006.01); H01L 27/146 (2006.01); H01L 31/0232 (2014.01); H01L 33/56 (2010.01)
CPC G02B 6/4292 (2013.01) [G02B 6/4249 (2013.01); H01L 27/14618 (2013.01); H01L 31/02327 (2013.01); H01L 33/56 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an optoelectronic component mounted to a PCB substrate;
a transmissive adhesive disposed directly on the optoelectronic component, wherein the adhesive is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component;
an optical filter disposed directly on and in contact with the transmissive adhesive; and
an epoxy laterally surrounding and in contact with side surfaces of the transmissive adhesive and the optical filter, wherein the epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component; and
wherein a coefficient of thermal expansion of the transmissive adhesive is the same as or very close to a coefficient of thermal expansion of the optoelectronic component.