US 12,171,062 B2
Electrically conductive adhesive, electronic circuit using the same, and method for manufacturing such electronic circuit
Toshio Nakatani, Osaka (JP); and Hideaki Minamiyama, Osaka (JP)
Assigned to TOYO ALUMINUM KABUSHIKI KAISHA, Osaka (JP)
Appl. No. 18/024,527
Filed by TOYO ALUMINIUM KABUSHIKI KAISHA, Osaka (JP)
PCT Filed Jul. 29, 2021, PCT No. PCT/JP2021/028020
§ 371(c)(1), (2) Date Mar. 3, 2023,
PCT Pub. No. WO2022/049937, PCT Pub. Date Mar. 10, 2022.
Claims priority of application No. 2020-148215 (JP), filed on Sep. 3, 2020.
Prior Publication US 2023/0319988 A1, Oct. 5, 2023
Int. Cl. H01B 1/22 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01)
CPC H05K 1/095 (2013.01) [H05K 3/386 (2013.01); H01B 1/22 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electrically conductive adhesive comprising:
an electrically conductive filler, a surface of the electrically conductive filler being a coating layer including silver,
wherein a compounded amount of the electrically conductive filler is 29.0 vol. % to 63.0 vol. % with respect to the electrically conductive adhesive,
wherein a compounded amount of the silver is 3.5 vol. % to 7.0 vol. % with respect to the electrically conductive adhesive, and
wherein the electrically conductive filler has a core comprising alumina, silica, or aluminum.