CPC H01G 4/30 (2013.01) [H01G 2/06 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01)] | 3 Claims |
1. A method of producing a multi-layer ceramic electronic component, the method comprising:
forming a plurality of ceramic sheets, wherein the forming of each ceramic sheet of the plurality of ceramic sheets comprises:
forming an internal electrode pattern having a predetermined thickness on an unsintered ceramic sheet, the unsintered ceramic sheet comprising an electrode non-formation region where the internal electrode pattern is absent; and
forming a dielectric pattern on the unsintered ceramic sheet having the internal electrode pattern formed thereon, the dielectric pattern being formed only in the electrode non-formation region of the unsintered ceramic sheet such that the dielectric pattern occupies 75% or more and less than 100% of the electrode non-formation region, wherein a thickness of the dielectric pattern is equal to that of the internal electrode pattern;
laminating in a first direction the plurality of ceramic sheets, thereby forming an unsintered multi-layer body;
cutting the unsintered multi-layer body, thereby forming an unsintered ceramic body including a plurality of internal electrodes laminated in the first direction;
sintering the unsintered ceramic body to form a sintered ceramic body, a dimension of the sintered ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the sintered ceramic body in a second direction orthogonal to the first direction; and
forming a pair of external electrodes connected to the plurality of internal electrodes and facing each other in a third direction orthogonal to the first direction and the second direction,
wherein a width of the sintered ceramic body in the second direction is 0.65 mm or more,
wherein the sintered ceramic body comprises a main surface on an outer portion thereof,
wherein the main surface is perpendicular to the first direction and comprises a center region facing the first direction,
wherein the center region is flat, and
wherein a width of the center region in the second direction is 82% or more and less than 100% of the width dimension of the sintered ceramic body in the second direction.
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