US 12,171,057 B2
Manufacturing method for pcb with thermal conductor embedded therein, and pcb
Lu Xiao, Guangdong (CN); Hongyu Wu, Guangdong (CN); Chengguang Ji, Guangdong (CN); Mengru Liu, Guangdong (CN); Zhengqing Chen, Guangdong (CN); Hongbing Du, Guangdong (CN); and Haibo Tang, Guangdong (CN)
Assigned to SHENGYI ELECTRONICS CO., LTD., Guangdong (CN)
Appl. No. 17/635,386
Filed by SHENGYI ELECTRONICS CO., LTD., Guangdong (CN)
PCT Filed Aug. 11, 2020, PCT No. PCT/CN2020/108352
§ 371(c)(1), (2) Date Feb. 15, 2022,
PCT Pub. No. WO2021/052060, PCT Pub. Date Mar. 25, 2021.
Claims priority of application No. 201910889232.X (CN), filed on Sep. 19, 2019.
Prior Publication US 2022/0346217 A1, Oct. 27, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/021 (2013.01) [H05K 3/0047 (2013.01); H05K 3/4611 (2013.01); H05K 3/06 (2013.01); Y10T 29/49158 (2015.01)] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing a printed circuit board (PCB) with an embedded thermal conductor, comprising:
stacking a core with an opening or a specified daughter board with an opening with at least one bonding sheet with an opening in a predetermined sequence to form a stack, the openings of the core or specified daughter board and the at least one bonding sheet forming a thermal conductor accommodation hole;
arranging a thermal conductor including a conductive layer in the thermal conductor accommodation hole of the stack such that the thermal conductor is flush with the stack;
stacking a first sheet of copper foil and a second sheet of copper foil on either side of the stack with the thermal conductor in the accommodation hole to form a stacked structure, wherein each of the first sheet of copper foil and the second sheet of copper foil has no opening;
performing a lamination process on the stacked structure at a high temperature to form a laminate, wherein a part of a surface of the laminate covering the thermal conductor protrudes from an other part of the surface of the laminate not covering the thermal conductor;
removing a part of the first sheet of copper foil covering the thermal conductor and a part of the second sheet of copper foil covering the thermal conductor from the laminate, to expose the conductive layer of the thermal conductor; and
manufacturing an outer layer pattern on an outer layer of the thermal conductor and/or an outer layer of the laminate not covering the thermal conductor of the laminate.