US 12,170,174 B2
Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, and multi-layer ceramic electronic component package
Hiroaki Sato, Tokyo (JP)
Assigned to Taiyo Yuden Co., Ltd., Tokyo (JP)
Filed by Taiyo Yuden Co., Ltd., Tokyo (JP)
Filed on Jan. 24, 2023, as Appl. No. 18/158,736.
Application 18/158,736 is a continuation of application No. 16/225,585, filed on Dec. 19, 2018, abandoned.
Claims priority of application No. 2017-246104 (JP), filed on Dec. 22, 2017.
Prior Publication US 2023/0162925 A1, May 25, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/06 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A method of producing a multi-layer ceramic electronic component, the method comprising:
forming a plurality of ceramic sheets, wherein the forming of each ceramic sheet of the plurality of ceramic sheets comprises:
forming an internal electrode pattern having a predetermined thickness on an unsintered ceramic sheet, the unsintered ceramic sheet comprising an electrode non-formation region where the internal electrode pattern is absent; and
forming a dielectric pattern on the unsintered ceramic sheet having the internal electrode pattern formed thereon, the dielectric pattern being formed only in the electrode non-formation region of the unsintered ceramic sheet such that the dielectric pattern occupies 75% or more and less than 100% of the electrode non-formation region, wherein a thickness of the dielectric pattern is equal to that of the internal electrode pattern;
laminating in a first direction the plurality of ceramic sheets, thereby forming an unsintered multi-layer body;
cutting the unsintered multi-layer body, thereby forming an unsintered ceramic body including a plurality of internal electrodes laminated in the first direction;
sintering the unsintered ceramic body to form a sintered ceramic body, a dimension of the sintered ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the sintered ceramic body in a second direction orthogonal to the first direction; and
forming a pair of external electrodes connected to the plurality of internal electrodes and facing each other in a third direction orthogonal to the first direction and the second direction,
wherein a width of the sintered ceramic body in the second direction is 0.65 mm or more,
wherein the sintered ceramic body comprises a main surface on an outer portion thereof,
wherein the main surface is perpendicular to the first direction and comprises a center region facing the first direction,
wherein the center region is flat, and
wherein a width of the center region in the second direction is 82% or more and less than 100% of the width dimension of the sintered ceramic body in the second direction.