CPC G02B 6/124 (2013.01) [G02B 6/1228 (2013.01); G02B 6/13 (2013.01); H01L 24/16 (2013.01); G02B 2006/12107 (2013.01); H01L 2224/16225 (2013.01)] | 12 Claims |
1. A signal conveying assembly comprising:
a photonic integrated circuit (PIC) chip, comprising:
a substrate;
a wafer on the substrate comprising a cladding layer located furthest from the substrate; and
a grating coupler within the wafer including a taper portion and grating, the grating extending toward the substrate from the taper portion; and
a printed circuit board (PCB) to which the PIC chip is mounted such that a wafer side of the PIC chip faces the PCB; and
electrical contacts patterned on the cladding layer, the electrical contacts establishing electric communication between the PIC chip and the PCB.
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