US 12,170,102 B1
Short on wafer laser for heat assisted magnetic recording
Reyad Mehfuz, Londonderry (GB); Niall Donlon, Limerick (IE); Aidan Dominic Goggin, Donegal (IE); and Prim Gangmei, Belfast (GB)
Assigned to Seagate Technology LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Fremont, CA (US)
Filed on Sep. 29, 2023, as Appl. No. 18/375,210.
Application 18/375,210 is a continuation of application No. 17/729,719, filed on Apr. 26, 2022, granted, now 11,848,036.
Claims priority of provisional application 63/180,350, filed on Apr. 27, 2021.
This patent is subject to a terminal disclaimer.
Int. Cl. G11B 5/00 (2006.01); G11B 5/31 (2006.01); G11B 5/48 (2006.01); G11B 5/60 (2006.01)
CPC G11B 5/4866 (2013.01) [G11B 5/6088 (2013.01); G11B 2005/0021 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a substrate;
a laser disposed above the substrate, the laser comprising one or more non-self-supporting layers of crystalline material, the laser having a length along a light path in a range of about 60 um to about 250 um;
an optical input coupler configured to receive light from the laser; and
a waveguide disposed proximate the optical input coupler, the waveguide configured to communicate light from the laser via the optical input coupler to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium.