US 12,169,316 B2
Semiconductor device including leaf springs for holding optical fiber
Kazuya Ohira, Nerima (JP); and Hideto Furuyama, Yokohama (JP)
Assigned to KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed on Aug. 19, 2022, as Appl. No. 17/820,934.
Claims priority of application No. 2022-036873 (JP), filed on Mar. 10, 2022.
Prior Publication US 2023/0288652 A1, Sep. 14, 2023
Int. Cl. G02B 6/42 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/4292 (2013.01) [G02B 6/4206 (2013.01); G02B 6/424 (2013.01); H01L 25/167 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a holding member located on the substrate, the holding member including an optical fiber holding part and a module placement part arranged in a first direction;
an optical module located in the module placement part and mounted on the substrate;
an optical fiber passing through the optical fiber holding part, the optical fiber being connected with the optical module; and
a first leaf spring and a second leaf spring located in the optical fiber holding part, the first leaf spring and the second leaf spring holding the optical fiber between the first leaf spring and the second leaf spring in a direction crossing the first direction, wherein
the optical module includes:
an optical element optically coupled with the optical fiber; and
a semiconductor element electrically connected with the optical element.