US 12,170,240 B2
Lead frame for improving adhesive fillets on semiconductor die corners
Rennier Rodriguez, Bulacan (PH); Maiden Grace Maming, Calamba (PH); and Jefferson Sismundo Talledo, Calamba (PH)
Assigned to STMicroelectronics, Inc., Calamba (PH)
Filed by STMicroelectronics, Inc., Calamba (PH)
Filed on Apr. 19, 2023, as Appl. No. 18/303,471.
Application 18/303,471 is a division of application No. 17/317,818, filed on May 11, 2021, granted, now 11,664,239.
Application 17/317,818 is a division of application No. 16/264,824, filed on Feb. 1, 2019, granted, now 11,037,864, issued on Jun. 15, 2021.
Claims priority of provisional application 62/636,332, filed on Feb. 28, 2018.
Prior Publication US 2023/0253213 A1, Aug. 10, 2023
Int. Cl. H01L 23/49 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/49513 (2013.01) [H01L 21/4825 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/562 (2013.01); H01L 24/29 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a die pad including:
a surface; and
first, second, third, and fourth cavities extending in to the surface and separated from each other by portions of the die pad, the first, second, third, and fourth cavities extending partially into the die pad such that each of the first, second, third, and fourth cavities includes a base, the first and second cavities being aligned with each other in a first direction, the third and fourth cavities being aligned with each other in the first direction, the first and third cavities being aligned with each other in a second direction that is transverse to the first direction, the second and fourth cavities being aligned with each other in the second direction, each of the first, second, third, and fourth cavities having an L shape with a first portion extending in the first direction and a second portion extending in the second direction, the surface of the die pad being continuous except for the first, second, third, and fourth cavities; and
a plurality of leads surrounding the die pad.