US 12,170,193 B2
Temperature estimation apparatus, plasma processing system, temperature estimation method and temperature estimation program
Yuki Kataoka, Hokkaido (JP); and Hiroshi Nagahata, Miyagi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Aug. 26, 2021, as Appl. No. 17/445,967.
Claims priority of application No. 2020-148524 (JP), filed on Sep. 3, 2020; and application No. 2021-137303 (JP), filed on Aug. 25, 2021.
Prior Publication US 2022/0068602 A1, Mar. 3, 2022
Int. Cl. H01J 37/32 (2006.01); G01K 13/00 (2021.01)
CPC H01J 37/3299 (2013.01) [G01K 13/00 (2013.01); H01J 2237/24585 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A temperature estimation apparatus, the apparatus comprising:
a memory; and
one or more processing circuits coupled to the memory and configured to
obtain time series process data relating to conditions inside a processing space in which plasma processing is performed;
successively estimate temperature data by successively inputting the obtained time series process data into a time series model generated in advance that correlates data values, in each time period, of time series process data relating to conditions inside the processing space, with a data value, at a respective time point, of time series temperature data measured inside the processing space; and
adjust a time length of the plasma processing or an amount of power of an RE power supply, prior to a start of the plasma processing or during the plasma processing, such that the successively estimated temperature data approach a target temperature.