US 12,169,219 B2
Apparatus for testing a semiconductor package
Min Cheol Kim, Chungcheongnam-do (KR); and Sol Lee, Chungcheongnam-do (KR)
Assigned to TSE CO., LTD., Chungcheongnam-do (KR)
Filed by TSE CO., LTD., Chungcheongnam-do (KR)
Filed on Jan. 12, 2023, as Appl. No. 18/153,461.
Claims priority of application No. 10-2022-0063522 (KR), filed on May 24, 2022.
Prior Publication US 2023/0384364 A1, Nov. 30, 2023
Int. Cl. G01R 31/00 (2006.01); G01R 31/28 (2006.01)
CPC G01R 31/2862 (2013.01) [G01R 31/2863 (2013.01); G01R 31/2865 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A test apparatus comprising:
a lower socket mounted on a tester configured to provide a test signal, the lower socket comprising a plurality of first conductive parts configured to electrically connect a lower package to the tester by being connected to lower terminals of the lower package;
a pusher coupled to an upper package and having a vacuum hole through which vacuum pressure of a vacuum generation device is transferred, the pusher being configured to be movable toward or away from the lower socket by receiving power from a drive part;
an upper socket coupled to the pusher and including an insulation pad made of an inelastic insulating material, and a plurality of second conductive parts supported on the insulation pad and each of the plurality of second conductive parts comprising one end connected to a corresponding lower terminal of the upper package, and the other end of each of the plurality of second conductive parts connected to a corresponding upper terminal of the lower package, the upper socket having a conductive region part configured to surround the plurality of second conductive parts, and a peripheral region portion positioned at a periphery of the conductive region part;
a vacuum picker coupled to a lower portion of the upper socket and having an insulation pad hole formed at a center of the upper socket so that the vacuum pressure is transferred through the insulation pad hole; and
a vacuum guide means installed between the upper package and the upper socket, wherein the vacuum guide means comprises:
a conductive guide member comprising a region corresponding to the conductive region part and having through-holes formed at positions corresponding to the plurality of second conductive parts and corresponding to the lower terminals of the upper package, the conductive guide member comprising an inelastic insulating material; and
a peripheral guide member made of a metallic material and having an insertion groove into which the conductive guide member is inserted,
wherein a first vacuum space portion comprising a concave groove shape and connected to the vacuum hole is formed in a lower surface of the conductive guide member, and
wherein a second vacuum space portion comprising a concave groove shape and connected to the vacuum hole is formed in a lower surface of the peripheral guide member.