US 12,170,170 B2
Multilayer electronic component
Jun Hyeong Kim, Suwon-si (KR); Myung Jun Park, Suwon-si (KR); Jin Soo Park, Suwon-si (KR); Yeon Song Kang, Suwon-si (KR); Eun Jin Kim, Suwon-si (KR); Kyu Sik Park, Suwon-si (KR); and Kang Ha Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 10, 2021, as Appl. No. 17/523,198.
Claims priority of application No. 10-2020-0183844 (KR), filed on Dec. 24, 2020.
Prior Publication US 2022/0208462 A1, Jun. 30, 2022
Int. Cl. H01G 4/232 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/0085 (2013.01); H01G 4/30 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and including first and second surfaces opposing in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in a third direction;
a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer;
a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer;
a first external electrode including a first electrode layer connected to the first conductive layer, and a first plating layer disposed on the first electrode layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and
a second external electrode including a second electrode layer connected to the second conductive layer, and a second plating layer disposed on the second electrode layer, wherein the second external electrode is disposed to be spaced apart from the first external electrode on a surface on which the first external electrode is disposed, and
wherein in a cross-section in the first direction and the second direction, the first plating layer does not cover the first insulating layer in the second direction and the second plating layer does not cover the second insulating layer in the second direction, and
in the cross-section in the first direction and the second direction, a thickness of each of end portions of one of the first and second electrode layers is lower than a thickness of a center portion of the one of the first and second electrode layers.