CPC G06F 30/31 (2020.01) [G06F 30/367 (2020.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06N 3/04 (2013.01); G06N 3/08 (2013.01); G06F 2111/02 (2020.01); G06F 2117/12 (2020.01); G06F 2119/08 (2020.01)] | 20 Claims |
1. A system configured for designing a multi-chip module, the system comprising:
one or more hardware processors configured by machine-readable instructions to:
receive a selection of a multi-chip module type and a selection of two or more die from a user;
generate a module configuration file;
generate a module bonding diagram;
select one or more SPICE models corresponding with the two or more die;
provide the module configuration file, the module bonding diagram, and the one or more SPICE models to a three dimensional simulation module;
generate a product SPICE model that includes module packaging;
generate a three dimensional model for the multi-chip module using the three dimensional simulation module; and
provide access to at least the module bonding diagram, the product SPICE model including module packaging, and the three dimensional model to the user.
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