Aleksander Magi, Portland, OR (US); Melissa Gregg, Santa Clara, CA (US); Todd Smith, Hillsboro, OR (US); James Okuley, Portland, OR (US); Praveen Vishakantaiah, Santa Clara, CA (US); Prosenjit Ghosh, Portland, OR (US); Fredrik Hamberger, Santa Clara, OR (US); Juha Paavola, Hillsboro, OR (US); and Justin M. Huttula, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 30, 2020, as Appl. No. 29/733,192.
Term of patent 15 Years
LOC (14) Cl. 14 - 02
U.S. Cl. D14—315
The ornamental design for a modular electronic device, as shown and described.