US 12,170,214 B2
Semiconductor device manufacturing system and method for manufacturing semiconductor device
Kai-Chih Liang, Tainan (TW); and Yu Kai Chen, Kaohsiung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Nov. 24, 2020, as Appl. No. 17/103,794.
Prior Publication US 2022/0165592 A1, May 26, 2022
Int. Cl. H01L 21/67 (2006.01); G05B 19/418 (2006.01)
CPC H01L 21/67248 (2013.01) [G05B 19/418 (2013.01); H01L 21/67103 (2013.01); G05B 2219/45031 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device manufacturing system, comprising:
a conditioner connected to a semiconductor device manufacturing apparatus and configured to control a first temperature and a humidity of an air and deliver the air to the semiconductor device manufacturing apparatus;
a data collector connected to the conditioner and configured to collect first temperature data and second temperature data from the conditioner; and
a processor connected to the data collector and configured to receive the first temperature data and second temperature data transferred from the data collector,
wherein the first temperature data comprises a first cooling rate of a first workpiece placed on a cold plate of the semiconductor device manufacturing apparatus, and the second temperature data comprises a second temperature of a second workpiece placed on a hot plate of the semiconductor device manufacturing apparatus, and the conditioner is further configured to decrease or increase the first temperature based on the first cooling rate of the first workpiece,
wherein the processor is further configured to forecast how to adjust processing time and a second cooling rate of the cold plate on which the first workpiece is placed based on an analysis result of the first cooling rate of the first workpiece, and the analysis result is obtained based on the first temperature data and the second temperature data,
wherein the semiconductor device manufacturing apparatus uses the forecasted processing time and the second cooling rate of the cold plate to process the first workpiece.