CPC C04B 37/023 (2013.01) [B23K 1/00 (2013.01); C04B 35/581 (2013.01); C04B 2237/12 (2013.01); C04B 2237/366 (2013.01); C04B 2237/407 (2013.01); H05K 1/03 (2013.01)] | 6 Claims |
1. A copper/ceramic bonded body, comprising:
a copper member made of copper or a copper alloy; and
a ceramic member made of an aluminum nitride,
wherein the copper member and the ceramic member being bonded to each other,
a Mg solid solution layer is provided between the copper member and the ceramic member and contains Mg in a state of a solid solution in a Cu primary phase,
the Mg solid solution layer is in contact with the ceramic member,
the Mg solid solution layer has a concentration gradient in which a Mg concentration gradually increases from the copper member toward a side of the ceramic member, and
Ti, Zr, Nb, and Hf are not present at a bonded interface between the copper member and the ceramic member.
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