US 12,171,064 B2
Interconnect and method for manufacturing the same
Brandon W. Pillans, Plano, TX (US); Robert Manley, Allen, TX (US); and Monte R. Sanchez, Murphy, TX (US)
Assigned to RAYTHEON COMPANY, Waltham, MA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Mar. 4, 2021, as Appl. No. 17/192,853.
Prior Publication US 2022/0287179 A1, Sep. 8, 2022
Int. Cl. H01R 13/24 (2006.01); H01R 12/71 (2011.01); H01R 43/20 (2006.01); H05K 1/11 (2006.01); H01R 13/621 (2006.01); H05K 3/00 (2006.01); H05K 3/16 (2006.01)
CPC H05K 1/119 (2013.01) [H01R 12/714 (2013.01); H01R 43/205 (2013.01); H01R 13/621 (2013.01); H05K 3/0026 (2013.01); H05K 3/16 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/10318 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An interconnect, comprising:
a recess formed in a body, and comprising an axial end wall and a side wall extending from the axial end wall to the outer surface;
a distributed metallized layer disposed, at least in part, on the axial end wall and the side wall; and
a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer, the CC plug including a recess formed therein sized and arranged to receive a male conductive element therein and being configured to establish an electrical connection between the male conductive element and the metallized layer with the male conductive element out of direct contact with the metallized layer;
wherein the CC plug comprises at least one or more of: conductive polymer, foamed metal, and conductive foamed plastic.