CPC G02B 6/4292 (2013.01) [G02B 6/4249 (2013.01); H01L 27/14618 (2013.01); H01L 31/02327 (2013.01); H01L 33/56 (2013.01)] | 15 Claims |
1. An apparatus comprising:
an optoelectronic component mounted to a PCB substrate;
a transmissive adhesive disposed directly on the optoelectronic component, wherein the adhesive is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component;
an optical filter disposed directly on and in contact with the transmissive adhesive; and
an epoxy laterally surrounding and in contact with side surfaces of the transmissive adhesive and the optical filter, wherein the epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component; and
wherein a coefficient of thermal expansion of the transmissive adhesive is the same as or very close to a coefficient of thermal expansion of the optoelectronic component.
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