US 12,171,063 B2
Backplane footprint for high speed, high density electrical connectors
Marc B. Cartier, Jr., Durham, NH (US); Mark W. Gailus, Concord, MA (US); Tom Pitten, Merrimack, NH (US); Donald A. Girard, Jr., Bedford, NH (US); and Huilin Ren, Amherst, NH (US)
Assigned to Amphenol Corporation, Wallingford, CT (US)
Filed by Amphenol Corporation, Wallingford, CT (US)
Filed on Jul. 24, 2023, as Appl. No. 18/357,218.
Application 18/357,218 is a division of application No. 17/347,668, filed on Jun. 15, 2021, granted, now 11,758,656.
Application 17/347,668 is a division of application No. 16/435,781, filed on Jun. 10, 2019, granted, now 11,057,995, issued on Jul. 6, 2021.
Claims priority of provisional application 62/683,146, filed on Jun. 11, 2018.
Prior Publication US 2023/0371178 A1, Nov. 16, 2023
Int. Cl. H05K 1/11 (2006.01); H01R 13/66 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/115 (2013.01) [H01R 13/6658 (2013.01); H05K 1/117 (2013.01); H05K 1/145 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An interconnection system comprising:
a component including first and second signal leads and at least one ground lead; and
a printed circuit board comprising a plurality of layers including conductive layers separated by dielectric layers, the printed circuit board further comprising:
first and second signal conductors for connection to the respective first and second signal leads of the component to an upper surface of the printed circuit board and for connection of the first and second signal leads of the component to a breakout layer of the conductive layers; and
at least one ground conductor for attachment to the at least one ground lead of the component and for connection of the ground lead of the component to a ground plane of the conductive layers,
wherein the component is mounted to the printed circuit board with the first and second signal leads pressing against the first and second signal conductors, wherein each of the first and second signal conductors includes a recess in an upper surface thereof, and wherein the recess includes a conical, truncated conical, or hemispherical portion.