US 12,171,065 B2
Electronic device including interposer
Sangwon Ha, Suwon-si (KR); Subyung Kang, Suwon-si (KR); Sanghoon Park, Suwon-si (KR); Soohyun Seo, Suwon-si (KR); Yongjin Woo, Suwon-si (KR); and Yeomoon Yoon, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 25, 2023, as Appl. No. 18/456,153.
Application 18/456,153 is a continuation of application No. 16/868,941, filed on May 7, 2020, granted, now 11,744,017, issued on Aug. 29, 2023.
Claims priority of application No. 10-2019-0086151 (KR), filed on Jul. 17, 2019.
Prior Publication US 2023/0403795 A1, Dec. 14, 2023
Int. Cl. H05K 1/14 (2006.01); H01L 23/40 (2006.01)
CPC H05K 1/145 (2013.01) [H05K 1/144 (2013.01); H01L 2023/4087 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A portable communication device comprising:
a housing;
a first printed circuit board (PCB) accommodated in the housing, the first PCB including a first conductive terminal formed on a surface thereof;
a second PCB accommodated in the housing as substantially parallel with the first PCB, the second PCB including a second conductive terminal formed on a surface thereof facing the surface of the first PCB;
an interposer including a conductive post formed from a first surface to a second surface of the interposer opposite to the first surface, a third conductive terminal formed at a first end of the conductive post, and a fourth conductive terminal formed at a second end of the conductive post opposite to the first end, the interposer disposed between the first and second PCBs such that the third conductive terminal is soldered with the first conductive terminal, and that the fourth conductive terminal is connected with the second conductive terminal via a conductive support terminal soldered therebetween; and
an overflow prevention portion disposed around the third conductive terminal soldered with the first conductive terminal and the fourth conductive terminal soldered with the second conductive terminal.