US 12,168,709 B2
Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module
Koji Morita, Tokyo (JP); Ryo Shimokawa, Tokyo (JP); Shinji Tsuchikawa, Tokyo (JP); Keiichi Kasuga, Tokyo (JP); Chihiro Hayashi, Tokyo (JP); and Tomio Iwasaki, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 18/260,382
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Dec. 17, 2021, PCT No. PCT/JP2021/046797
§ 371(c)(1), (2) Date Jul. 5, 2023,
PCT Pub. No. WO2022/149440, PCT Pub. Date Jul. 14, 2022.
Claims priority of application No. 2021-001039 (JP), filed on Jan. 6, 2021; application No. 2021-001044 (JP), filed on Jan. 6, 2021; and application No. 2021-001049 (JP), filed on Jan. 6, 2021.
Prior Publication US 2024/0092958 A1, Mar. 21, 2024
Int. Cl. C08F 283/04 (2006.01)
CPC C08F 283/04 (2013.01) 20 Claims
 
1. A thermosetting resin composition comprising:
a maleimide compound (a) having at least one N-substituted maleimide group, and
a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a):

OG Complex Work Unit Chemistry
wherein in the general formula (1), Xb1 represents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rb1 and Rb2 each independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5,
wherein substituents that the groups in the general formula (1) can have are substituents exhibiting no reactivity with the maleimide group of the component (a) at 200° C. or less.