CPC H01L 21/563 (2013.01) [H01L 23/3171 (2013.01); H01L 23/3185 (2013.01); H01L 24/00 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 25/0657 (2013.01); H01L 23/3192 (2013.01); H01L 24/81 (2013.01); H01L 25/105 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/034 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/0616 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/94 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1047 (2013.01); H01L 2225/1058 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a die disposed over a first substrate, the die comprising:
a second substrate comprising an integrated circuit;
contact pads disposed over the second substrate, the contact pads being electrically connected to the integrated circuit, the contact pads comprising a first contact pad, a second contact pad, and a third contact pad;
conductive pillars disposed over and electrically connected to the contact pads, the conductive pillars comprising a first conductive pillar, a second conductive pillar, and a third conductive pillar;
a conductive line over the second substrate, the conductive line being a continuous material with the first conductive pillar and the second conductive pillar, an upper surface of the conductive line being level with an upper surface of the first conductive pillar and an upper surface of the second conductive pillar;
dielectric layers disposed over the second substrate, the dielectric layers disposed over and around the contact pads, the conductive pillars, and the conductive line;
an encapsulant disposed over the first substrate and around lateral edges of the die; and
a redistribution layer disposed over the die, the redistribution layer electrically connected to the conductive pillars.
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