US 12,169,365 B2
Computer-readable storage medium recording data structure for storing data controlling operation of overlay measurement device and overlay measurement device therefor
Sol-Lee Hwang, Hwaseong-si (KR); Dong-Won Jung, Hwaseong-si (KR); Hee-Chul Lim, Hwaseong-si (KR); Hyun-Kyoo Shon, Hwaseong-si (KR); and Min-Ho Lee, Hwaseong-si (KR)
Assigned to AUROS TECHNOLOGY, INC., Hwaseong-si (KR)
Filed by AUROS TECHNOLOGY, INC., Hwaseong-si (KR)
Filed on Feb. 6, 2024, as Appl. No. 18/433,486.
Application 18/433,486 is a continuation of application No. 18/142,886, filed on May 3, 2023, granted, now 11,960,214.
Claims priority of application No. 10-2022-0151955 (KR), filed on Nov. 14, 2022.
Prior Publication US 2024/0176253 A1, May 30, 2024
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/70641 (2013.01) [G03F 7/70625 (2013.01); G03F 7/70633 (2013.01)] 8 Claims
 
1. A non-transitory computer-readable storage medium that records a data computer-readable storage medium that records a data structure for storing data controlling an operation of an overlay measurement device that measures an error between a first overlay mark and a second overlay mark formed on different layers of a wafer, the data, comprising:
information of a recipe that is input to allow the overlay measurement device to measure characteristics of a wafer through a manager program installed in a user terminal, and unique information of the overlay measurement device,
wherein the overlay measurement device comprises
a light source,
an aperture that changes a beam from the light source to be suitable for photographing the first overlay mark or the second overlay mark,
a detector that acquires an image of the first overlay mark and an image of the second overlay mark,
a transceiver, and
a processor electrically connected to the transceiver, and
wherein the processor is configured to
obtain the data transmitted from the user terminal through the transceiver,
analyze the recipe included in the data,
when the analysis of the recipe is completed, perform optimization process for measurement options of the wafer based on the recipe,
measure the aperture in a first pinhole position,
measure the aperture in a second pinhole position that is a predetermined distance apart from the first pinhole position once,
calculate Tis 3 Sigma in the first pinhole position and the second pinhole position, and
perform a pinhole optimization process of selecting a pinhole position from the first pinhole position and the second pinhole position where the Tis 3 Sigma is a minimum by modeling the Tis 3 Sigma in each pinhole position in relation to the aperture.