CPC H01L 23/18 (2013.01) [H01L 21/565 (2013.01); H01L 23/3185 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01)] | 20 Claims |
1. A method for forming a package structure, comprising:
bonding a package component to a substrate through a plurality of first connectors, wherein the package component comprises a first semiconductor die and a second semiconductor die;
forming a dam structure over the substrate and surrounding the first connectors, wherein a top surface of the dam structure is lower than a bottom surface of the package component, wherein the material of the dam structure is a 2D cross-linking polymer;
filling an underfill layer in a space between the dam structure and the first connectors; and
removing the dam structure after the underfill layer is formed.
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