US 12,169,925 B2
System using film thickness estimation from machine learning based processing of substrate images
Sivakumar Dhandapani, San Jose, CA (US); Arash Alahgholipouromrani, San Jose, CA (US); Dominic J. Benvegnu, La Honda, CA (US); Jun Qian, Sunnyvale, CA (US); and Kiran Lall Shrestha, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 2, 2023, as Appl. No. 18/500,811.
Application 18/500,811 is a continuation of application No. 17/359,345, filed on Jun. 25, 2021, granted, now 11,847,776.
Claims priority of provisional application 63/045,782, filed on Jun. 29, 2020.
Prior Publication US 2024/0062364 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06T 7/00 (2017.01); B24B 37/013 (2012.01); G06T 7/60 (2017.01)
CPC G06T 7/001 (2013.01) [B24B 37/013 (2013.01); G06T 7/60 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/20021 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A computer program product, comprising a non-transitory computer-readable medium encoded with instructions to cause one or more processors to:
receive a first color image of a first substrate from an in-line monitoring station of a polishing system;
divide the first color image into a plurality of second color images using a die mask such that each second color image corresponds to a region for a die being fabricated on the first substrate;
generate residue measurements for one or more locations, each respective location of the one more locations corresponding to a respective region for a die being fabricated on the first substrate, wherein the instructions to generate the residue measurement for a region include instructions to process a second color image corresponding to the region through a neural network that was trained using training data that included a plurality of third color images of dies of a calibration substrate and ground truth residue measurements of the calibration substrate with each respective third color image paired with a ground truth residue measurement for a die region associated with the respective third color image; and
determine a value for a polishing parameter for the first substrate or a subsequent second substrate based on the residue measurements.