US 12,170,234 B2
Daisy-chain seal ring structure
Chun-Liang Lu, Tainan (TW); Chun-Wei Chia, Kaohsiung (TW); Chun-Hao Chou, Tainan (TW); and Kuo-Cheng Lee, Tainan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 15, 2023, as Appl. No. 18/335,413.
Application 18/335,413 is a continuation of application No. 17/448,002, filed on Sep. 17, 2021, granted, now 11,756,842.
Claims priority of provisional application 63/201,191, filed on Apr. 16, 2021.
Prior Publication US 2023/0326815 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 29/10 (2006.01)
CPC H01L 22/34 (2013.01) [H01L 23/585 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/08135 (2013.01); H01L 2224/80895 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A seal ring structure, comprising:
a first metal structure in a first wafer;
a second metal structure in the first wafer;
a third metal structure in a second wafer; and
a metal bonding structure, including:
a first set of metal elements coupling the first metal structure and the third metal structure, and
a second set of metal elements coupling the second metal structure and the third metal structure.