US 12,170,219 B2
Electrostatic chuck
Naoki Furukawa, Kagoshima (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Filed by KYOCERA Corporation, Kyoto (JP)
Filed on Nov. 2, 2023, as Appl. No. 18/500,308.
Application 18/500,308 is a continuation of application No. 17/418,308, granted, now 11,842,915, previously published as PCT/JP2020/002411, filed on Jan. 23, 2020.
Claims priority of application No. 2019-009961 (JP), filed on Jan. 24, 2019.
Prior Publication US 2024/0063046 A1, Feb. 22, 2024
Int. Cl. H01L 21/683 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32697 (2013.01); H01J 37/32733 (2013.01); H01J 2237/2007 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck, comprising:
a substrate comprising:
a first surface for holding a sample, the first surface comprising a first opening;
a second surface opposite to the first surface, the second surface comprising a second opening; and
a first through-hole from the first opening to the second opening, the first through-hole has a first diameter;
an electrode located inside the substrate, and comprising a first part and a second part next to the first part in a cross-sectional view;
a support comprising:
a third surface comprising a third opening;
a fourth surface opposite to the third surface, the fourth surface comprising a fourth opening; and
a second through-hole from the third opening to the fourth opening, the second through-hole has a second diameter at the third opening being larger than the first diameter,
wherein the second through-hole is between the first part and the second part in the cross-sectional view; and
a porous member is located in the second through-hole.