US 12,170,562 B2
Reconfigurable intelligent surface link identification
Yucheng Dai, San Diego, CA (US); Wooseok Nam, San Diego, CA (US); Tao Luo, San Diego, CA (US); and Peter Gaal, San Diego, CA (US)
Assigned to QUALCOMM Incorpoated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Dec. 15, 2022, as Appl. No. 18/066,342.
Application 18/066,342 is a continuation of application No. 17/305,002, filed on Jun. 29, 2021, granted, now 11,770,171.
Prior Publication US 2023/0115007 A1, Apr. 13, 2023
Int. Cl. H04B 7/06 (2006.01)
CPC H04B 7/0684 (2013.01) 30 Claims
OG exemplary drawing
 
1. A receiver for wireless communication, comprising:
a memory; and
one or more processors, coupled to the memory, configured to:
receive a signal that is transmitted by a transmitter, the signal including an indication of a signature of a relay that is controlled by a network when the signal is received via an indirect communications link that includes the relay;
determine, based at least in part on whether the signal includes the indication of signature of the relay and based at least in part on whether the signal is received during an uplink to downlink switching gap, during a downlink to uplink switching gap, or via a frequency domain resource outside of a carrier bandwidth associated with the signal, whether the signal is received via a direct communications link between the receiver and the transmitter or via the indirect communications link; and
perform an action associated with communicating with the transmitter based at least in part on whether the signal is received via the direct communications link or the indirect communications link.