CPC H01L 21/67092 (2013.01) [H05B 3/283 (2013.01)] | 31 Claims |
1. A method to correct surface non-uniformities using a bonding tool, the method comprising:
having a tool head with four segments;
having a first segment have flat surface to uniformly press a donor substrate against a device substrate;
having the first segment fixed to a second segment;
having the second segment and a third segment move relative to each other by means of a curved guideway;
having the flat surface of the first segment to rotate and conform to irregularities in an angle of a device surface about a first axis due to the curved guideway;
having the third segment and a fourth segment move relative to each other by means of a first part of the curved guideway;
having the first part of the curved guideway have larger radius than a part of a lower curved guideway; and
having the first part of the guideway oriented perpendicular to the part of the lower guideway, allowing for the flat surface of the first segment to rotate and conform to irregularities about a second axis which is perpendicular to that of the first axis.
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