US 12,170,191 B2
Substrate supporting apparatus and substrate treating apparatus including the same
Jong Gun Lee, Chungcheongnam-do (KR); So Hyung Jiong, Chungcheongnam-do (KR); and Hyung Joon Kim, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Dec. 11, 2022, as Appl. No. 18/078,958.
Claims priority of application No. 10-2022-0094780 (KR), filed on Jul. 29, 2022.
Prior Publication US 2024/0038508 A1, Feb. 1, 2024
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01)
CPC H01J 37/32724 (2013.01) [H01J 37/32577 (2013.01); H01L 21/6833 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate supporting apparatus comprising:
a body configured to support a substrate and formed of a dielectric substance;
a heat transfer medium supply hole installed to penetrate the body;
a first electrostatic electrode disposed in the body; and
a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode,
wherein a surface area of the first electrostatic electrode is smaller than a surface area of the second electrostatic electrode, and
wherein the first electrostatic electrode and a heater are disposed at a same level.