US 12,170,216 B2
Transfer device, processing system, and transfer method
Shinya Okano, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/759,117
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Jan. 13, 2021, PCT No. PCT/JP2021/000816
§ 371(c)(1), (2) Date Jul. 20, 2022,
PCT Pub. No. WO2021/149551, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 2020-008497 (JP), filed on Jan. 22, 2020.
Prior Publication US 2023/0038276 A1, Feb. 9, 2023
Int. Cl. H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67742 (2013.01) [H01L 21/67784 (2013.01); H01L 21/68721 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A transfer device comprising:
a first holding part configured to contact an edge part of a substrate when holding the substrate;
a second holding part formed with an elastic member and configured to contact only a back surface of the substrate when holding the substrate; and
a control device,
wherein the control device is configured to control the transfer device such that a transfer speed when the substrate is held by the first holding part is greater than a transfer speed when the substrate is held by the second holding part, and
wherein the first holding part is provided at a position where the first holding part does not contact the substrate being held by the second holding part, and the second holding part is provided at a position where the second holding part does not contact the substrate being held by the first holding part.