US 12,171,060 B2
Device for temperature measurement
Felix Muehlhausen, Kassel (DE); and Simon Butterweck, Helsa (DE)
Assigned to SMA Solar Technology AG, Niestetal (DE)
Filed by SMA Solar Technology AG, Niestetal (DE)
Filed on Sep. 30, 2022, as Appl. No. 17/956,858.
Application 17/956,858 is a continuation of application No. PCT/EP2021/057404, filed on Mar. 23, 2021.
Claims priority of application No. 10 2020 108 690.3 (DE), filed on Mar. 30, 2020.
Prior Publication US 2023/0021547 A1, Jan. 26, 2023
Int. Cl. H05K 1/02 (2006.01); G01K 1/02 (2021.01); G01K 1/024 (2021.01); G01K 1/14 (2021.01); G01K 1/143 (2021.01); G01K 11/22 (2006.01); G01K 13/02 (2021.01); G01K 13/20 (2021.01); G01R 1/20 (2006.01); G01R 19/32 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/44 (2006.01); H05K 5/03 (2006.01); H05K 5/04 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0284 (2013.01) [G01K 1/143 (2013.01); G01R 1/203 (2013.01); G01R 19/32 (2013.01); H05K 1/18 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0228 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A device for current determination comprising a shunt and a device for temperature measurement comprising a printed circuit board, an evaluation unit and a temperature sensor, wherein the printed circuit board has a milled groove which runs spirally around the temperature sensor, so that the temperature sensor is arranged on a printed circuit board plateau defined by the milled groove and is displaceable in a direction that is parallel to a normal vector of a plane defined by the printed circuit board and, when the temperature sensor is displaced relative to the plane of the printed circuit board, a restoring force is brought about between the printed circuit board and the temperature sensor, wherein the shunt comprises a resistance region having a substantially flat surface, wherein the device for current determination is arranged in the resistance region on the surface of the shunt in such a way that the temperature sensor is arranged in thermal connection with the resistance region of the shunt, wherein voltage taps are arranged on both sides of the temperature sensor and electrically contact the surface of the shunt in order to detect a potential difference along the resistance region.