CPC H05K 7/20236 (2013.01) [H05K 7/20272 (2013.01)] | 11 Claims |
1. An immersion cooling apparatus for a circuit board including a heat-generating section, comprising:
a pressure vessel including a vessel body and at least one lid, wherein the at least one lid is detachably joined to the vessel body, wherein a certain lid of the at least one lid has a coolant outlet and a coolant inlet, and wherein the pressure vessel is filled with liquid coolant; and
a mounting member that places the circuit board at a position between the coolant outlet and the coolant inlet within the pressure vessel, wherein the circuit board is immersed in the liquid coolant within the pressure vessel such the circuit board is surrounded with the liquid coolant,
wherein the circuit board is placed to partition an inside space of the pressure vessel into a coolant-outlet-side and a coolant-inlet-side, such that the liquid coolant forcedly flows from one side of the circuit board to outside the pressure vessel through the coolant outlet and forcedly flows into another side of the circuit board from outside the pressure vessel through the coolant inlet,
wherein the vessel body has two opening surfaces which are detachably closed by a first lid and a second lid, respectively, wherein the first lid has the coolant outlet and the coolant inlet, and the second lid has electric terminals connected to the circuit board.
|