US 12,171,066 B2
Method for removing and repositioning electronic components connected to a circuit board
Matthias Fettke, Berlin (DE); and Andrej Kolbasow, Paulinenaue (DE)
Assigned to Pac Tech—Packaging Technologies GmbH, Nauen (DE)
Filed by Pac Tech—Packaging Technologies GmbH, Nauen (DE)
Filed on Oct. 21, 2021, as Appl. No. 17/507,684.
Application 17/507,684 is a continuation in part of application No. 17/164,159, filed on Feb. 1, 2021, granted, now 12,023,756.
Claims priority of application No. 102151 (LU), filed on Oct. 23, 2020.
Prior Publication US 2022/0132714 A1, Apr. 28, 2022
Int. Cl. H05K 13/04 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 26/03 (2006.01); B23K 101/42 (2006.01); B25J 15/04 (2006.01); H05K 13/08 (2006.01)
CPC H05K 13/0486 (2013.01) [B23K 1/0016 (2013.01); B23K 3/08 (2013.01); B23K 26/034 (2013.01); B25J 15/04 (2013.01); H05K 13/0409 (2018.08); H05K 13/0812 (2018.08); H05K 13/082 (2018.08); B23K 2101/42 (2018.08)] 20 Claims
OG exemplary drawing
 
1. A device for removing and repositioning an electronic component from a contact area on a circuit board, comprising:
a first exchangeable adaptor tip of a vacuum suction nozzle, wherein a vacuum suction is generated at the vacuum suction nozzle such that the electronic component that is to be removed or repositioned is drawn towards the vacuum suction nozzle by the vacuum suction, wherein the first exchangeable adaptor tip is configured with an opening through which the electronic component can pass into the vacuum suction nozzle;
a second exchangeable adaptor tip of the vacuum suction nozzle, wherein the second exchangeable adaptor tip is configured such that the electronic component is prevented from entering into the vacuum suction nozzle and is held by the vacuum suction at the second exchangeable adaptor tip; and
a laser beam emitter oriented so as to emit a laser beam through the vacuum suction nozzle towards the contact area on the circuit board.