US 12,168,123 B2
Methods of implanting a device into a brain
Loren M. Frank, San Anselmo, CA (US); and Jason Chung, Oakland, CA (US)
Assigned to The Regents of the University of California, Oakland, CA (US)
Filed by The Regents of the University of California, Oakland, CA (US)
Filed on May 2, 2023, as Appl. No. 18/142,279.
Application 18/142,279 is a continuation of application No. 16/756,013, granted, now 11,648,394, previously published as PCT/US2018/059012, filed on Nov. 2, 2018.
Claims priority of provisional application 62/581,437, filed on Nov. 3, 2017.
Prior Publication US 2024/0042194 A1, Feb. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/05 (2006.01); A61B 17/34 (2006.01); A61N 1/372 (2006.01); A61B 5/00 (2006.01); A61B 90/10 (2016.01)
CPC A61N 1/0531 (2013.01) [A61B 17/3468 (2013.01); A61N 1/0539 (2013.01); A61N 1/37223 (2013.01); A61B 5/6868 (2013.01); A61B 2090/103 (2016.02)] 23 Claims
OG exemplary drawing
 
1. A system for implanting an implantable device, the system comprising:
(a) one or more implantable devices, wherein the implantable device comprises a plurality of electrodes and a measuring device;
(b) an implantation device;
(c) a first polymeric material;
(d) a second polymeric material, wherein the second polymeric material has a higher viscosity than the first polymeric material; and
(e) a capping element.