CPC H01L 23/3735 (2013.01) [B22F 7/064 (2013.01); H01L 21/4882 (2013.01); B22F 2301/10 (2013.01); H01L 23/473 (2013.01); H01L 24/09 (2013.01); H01L 24/29 (2013.01); H05K 7/209 (2013.01)] | 20 Claims |
1. A method, comprising:
disposing a sinter material layer on a side of a ceramic tile;
disposing an intermediate metal layer on a surface of the ceramic tile between the ceramic tile and the sinter material layer disposed on the side of the ceramic tile, the sinter material layer being made of metal particles, the intermediate metal layer being in direct contact with both the ceramic tile and the sinter material layer, the intermediate metal layer having a portion thereof inter diffused into the sinter material layer; and
sinter bonding a lead frame to the side of the ceramic tile with the sinter material layer.
|