US 12,169,170 B2
Sensing package, optical module and method for detecting light
Wei-Hao Chang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Apr. 26, 2022, as Appl. No. 17/730,123.
Prior Publication US 2023/0341317 A1, Oct. 26, 2023
Int. Cl. G01N 21/17 (2006.01); G06F 3/01 (2006.01)
CPC G01N 21/1717 (2013.01) [G01N 2021/1725 (2013.01); G01N 2201/0636 (2013.01); G06F 3/011 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a carrier configured to face an object to be inspected;
an emitter device disposed adjacent to the carrier and configured to emit a first light;
a receiver device disposed between the carrier and the object; and
an optical device configured to direct the first light toward the object;
wherein the receiver device is configured to receive a second light reflected by the object, wherein the optical device is configured to direct the first light into a first region of the object and into a second region distinct from the first region.