US 12,171,080 B2
Cover of electronic device, and method for manufacturing same
Kyoungdon Son, Suwon-si (KR); Poonggi Jung, Suwon-si (KR); Sejin Kim, Suwon-si (KR); Hakju Kim, Suwon-si (KR); and Jindeuk Jeon, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 26, 2022, as Appl. No. 17/896,733.
Application 17/896,733 is a continuation of application No. PCT/KR2020/015243, filed on Nov. 3, 2020.
Claims priority of application No. 10-2020-0030341 (KR), filed on Mar. 11, 2020.
Prior Publication US 2022/0408581 A1, Dec. 22, 2022
Int. Cl. H05K 5/03 (2006.01); B24B 29/00 (2006.01); C03B 23/03 (2006.01); C03C 17/00 (2006.01)
CPC H05K 5/03 (2013.01) [B24B 29/00 (2013.01); C03B 23/03 (2013.01); C03C 17/002 (2013.01); C03C 2218/119 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A rear cover of an electronic device, the rear cover comprising:
a glass substrate; and
a hard coating layer formed on a first face of the glass substrate,
wherein the first face of the glass substrate comprises:
a roughness layer formed on the first face of the glass substrate and including fine grooves formed irregularly, the fine grooves having irregular depths and widths,
a hairline pattern formed irregularly between the fine grooves of the roughness layer and having irregular depths and widths, and
wherein the hard coating layer is coated on the roughness layer and the hairline pattern.