CPC H05K 1/0243 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 2201/10098 (2013.01)] | 16 Claims |
1. A printed circuit board (PCB) module comprising a multilayer PCB, the multilayer PCB comprising:
a plurality of layers, the plurality of layers comprising interleaved conductive layers and non-conductive layers;
a first outer surface and second outer surface opposite from the first outer surface;
one or more electrical components coupled to the first outer surface;
one or more electrical contacts coupled to the second outer surface; and
a first embedded semiconductor die having an active side facing towards a location of the first outer surface;
wherein the first embedded semiconductor die comprises a first wireless radio-frequency transceiver; and
wherein the multilayer PCB comprises a keep-out volume between the first outer surface and the active side of the first embedded semiconductor die, the keep-out volume being defined by a keep-out area of the active side of the first embedded semiconductor die and a keep-out height extending from the keep-out area towards the first outer surface, the keep-out volume being free from electrically conductive materials.
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