US 12,170,243 B2
Dielectric anchors for anchoring a conductive pillar
Lung Yuan Pan, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 28, 2022, as Appl. No. 17/682,238.
Prior Publication US 2023/0275012 A1, Aug. 31, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/76898 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16146 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, the method comprising:
receiving a first semiconductor substrate;
forming a plurality of openings that extend vertically through the first semiconductor substrate, wherein the openings are laterally disposed around a portion of the first semiconductor substrate, wherein forming the plurality of openings forms a plurality of semiconductor anchors laterally between the openings, and wherein the plurality of semiconductor anchors extend laterally between the portion of the first semiconductor substrate and a surrounding portion of the first semiconductor substrate; and
performing an oxidation process on the plurality of semiconductor anchors to convert the plurality of semiconductor anchors into a plurality of dielectric anchors.