US 12,170,218 B2
Method for cleaning electrostatic chuck
Yueh-Lin Yang, Tainan (TW); and Chi-Hung Liao, New Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Nov. 21, 2022, as Appl. No. 17/991,724.
Application 17/365,878 is a division of application No. 16/358,561, filed on Mar. 19, 2019, granted, now 11,056,371, issued on Jul. 6, 2021.
Application 17/991,724 is a continuation of application No. 17/365,878, filed on Jul. 1, 2021, granted, now 11,508,602.
Claims priority of provisional application 62/718,947, filed on Aug. 14, 2018.
Prior Publication US 2023/0093409 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B08B 7/00 (2006.01); B08B 3/04 (2006.01); C23C 14/50 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) [B08B 3/04 (2013.01); B08B 7/00 (2013.01); C23C 14/505 (2013.01); H01L 21/67011 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
detecting a location of a particle on a bottom surface of an electrostatic chuck, comprising:
attaching a dummy photomask on the bottom surface of the electrostatic chuck;
transmitting radiation toward the dummy photomask;
receiving a reflection of the radiation from the dummy photomask; and
analyzing the radiation transmitted toward the dummy photomask with the reflection of the radiation from the dummy photomask to obtain the location of the particle;
moving a platform to a position under the bottom surface of the electrostatic chuck and right under the particle; and
rotating the platform about a center of the platform to remove the particle from the bottom surface of the electrostatic chuck.