US 12,170,217 B2
Substrate processing apparatus and abnormality detection method
Hiroaki Chihaya, Nirasaki (JP); Yasuhiko Kojima, Nirasaki (JP); Einstein Noel Abarra, Fuchu (JP); and Tetsuya Miyashita, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 25, 2022, as Appl. No. 17/652,545.
Claims priority of application No. 2021-036648 (JP), filed on Mar. 8, 2021.
Prior Publication US 2022/0285197 A1, Sep. 8, 2022
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 3 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a stage including an electrostatic chuck configured to attract a substrate;
a heater configured to heat the stage;
a heating drive part configured to supply power to the heater so that a temperature of the stage becomes a target value; and
a detector configured to detect an abnormality in attraction of the substrate by the electrostatic chuck,
wherein the detector is further configured to detect the abnormality based on fluctuation of the power supplied to the heater, the fluctuation being generated by the attraction of the substrate by the electrostatic chuck, and
wherein when detecting the abnormality, the detector is further configured to:
calculate an evaluation index for evaluating the fluctuation,
calculate a first distribution of the evaluation index by applying a voltage having a first voltage value to the electrostatic chuck to attract the substrate by the electrostatic chuck and calculating the evaluation index a plurality of times,
calculate a second distribution of the evaluation index by applying a voltage having a second voltage value smaller than the first voltage value to the electrostatic chuck to attract the substrate by the electrostatic chuck and calculating the evaluation index a plurality of times, and
calculate a performance evaluation value based on the first distribution and the second distribution.