US 12,169,216 B2
Semiconductor device and inspection method
Tsuyoshi Tachi, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Jan. 26, 2022, as Appl. No. 17/584,673.
Claims priority of application No. 2021-014913 (JP), filed on Feb. 2, 2021.
Prior Publication US 2022/0244305 A1, Aug. 4, 2022
Int. Cl. G01R 31/26 (2020.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01)
CPC G01R 31/2607 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 24/48 (2013.01); H01L 2224/48175 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor element having an element main surface and an element back surface facing opposite each other in a thickness direction, and first and second electrodes arranged on the element main surface;
a first lead on which the semiconductor element is mounted;
a second lead arranged to be spaced apart from the first lead and electrically connected to the first electrode;
a third lead arranged to be spaced apart from the first lead and the second lead and electrically connected to the second electrode;
a plurality of first connecting portions bonded to the first electrode and the second lead; and
a sealing resin configured to cover the semiconductor element,
wherein the sealing resin includes a resin main surface facing the same side as the element main surface, a resin back surface facing the same side as the element back surface, and a resin side surface connected to the resin main surface and the resin back surface,
wherein the second lead includes a second lead exposed portion exposed from the sealing resin,
wherein the third lead includes a third lead exposed portion exposed from the sealing resin,
wherein the second lead exposed portion includes a portion located on the resin main surface with respect to the third lead exposed portion, and
wherein the third lead exposed portion includes a back surface and a terminal end surface while a main surface of the third lead is covered with the sealing resin in the thickness direction.