CPC G01R 31/2607 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 24/48 (2013.01); H01L 2224/48175 (2013.01)] | 16 Claims |
1. A semiconductor device, comprising:
a semiconductor element having an element main surface and an element back surface facing opposite each other in a thickness direction, and first and second electrodes arranged on the element main surface;
a first lead on which the semiconductor element is mounted;
a second lead arranged to be spaced apart from the first lead and electrically connected to the first electrode;
a third lead arranged to be spaced apart from the first lead and the second lead and electrically connected to the second electrode;
a plurality of first connecting portions bonded to the first electrode and the second lead; and
a sealing resin configured to cover the semiconductor element,
wherein the sealing resin includes a resin main surface facing the same side as the element main surface, a resin back surface facing the same side as the element back surface, and a resin side surface connected to the resin main surface and the resin back surface,
wherein the second lead includes a second lead exposed portion exposed from the sealing resin,
wherein the third lead includes a third lead exposed portion exposed from the sealing resin,
wherein the second lead exposed portion includes a portion located on the resin main surface with respect to the third lead exposed portion, and
wherein the third lead exposed portion includes a back surface and a terminal end surface while a main surface of the third lead is covered with the sealing resin in the thickness direction.
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